Lead-free bismuthate glass powder used for bonding electronic ceramics

Abstract

The invention relates to a lead-free bismuthate glass powder used for bonding electronic ceramics. The lead-free bismuthate glass powder comprises the following raw materials in percentage by weight: 65 to 85 percent of bismuth oxide (Bi2O3), 1 to 30 percent of boric oxide (B2O3), 1 to 20 percent of zinc oxide (ZnO), 1 to 10 percent of aluminum oxide (Al2O3), 1 to 5 percent of magnesium oxide (MgO), 1 to 5 percent of vanadium pentoxide (V2O5), 1 to 5 percent of lithium oxide (Li2O), 1 to 5 percent of tungsten trioxide (WO3), 1 to 3 percent of phosphorus pentoxide (P2O5), and 1 to 3 percent of strontium oxide (SrO), wherein the total weight percentage of the Bi2O3, the B2O3 and the ZnO is 70 to 90 percent; the total weight percentage of the Al2O3, the MgO and the WO3 is 5 to 13 percent; and the total weight percentage of the V2O5, the Li2O3 and the P2O5 is 4 to 10 percent. The lead-free bismuthate glass powder used for bonding the electronic ceramics one another has the characteristics of no lead, high air tightness, high sealing fluidity and low sealing temperature, and can be used for bonding electronic ceramics one another.

Description

【Technical field】 [0001] The invention belongs to the technical field of chemical industry, and particularly relates to a lead-free bismuth salt glass powder used for bonding electronic ceramics to each other. 【Background technique】 [0002] Electronic ceramics are widely used in the production of electronic functional components, most of which are sintered materials mainly composed of oxides. The manufacturing process of electronic ceramics is roughly the same as that of traditional ceramics. Electronic ceramics can be divided into five categories according to their functions and uses: insulating device ceramics, capacitor ceramics, ferroelectric ceramics, semiconductor ceramics and ionic ceramics. Insulating device porcelain, referred to as device porcelain, has excellent electrical insulation properties and is used as electronic ceramics for structural parts, substrates and housings in electronic equipment and devices. Ceramics that can use electricity and magnetic prop...

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Problems solved by technology

[0008] U.S. Patent P5153151 discloses a phosphate sealing glass whose molar composition is Li 2 O 0~15%, Na 2 O 0~20%, K 2 O 0~10%, ZnO 0~45%, Ag 2 O 0~25%, Tl 2 O 0~25%, PbO 0~20%, CuO 0~5%, CaO 0~20%, SrO 0~20%, P 2 o 5 24~36%, Al 2 o 3 0~5%, CeO 2 0~2%, BaO 0~20%, SnO 0~5%, Sb 2 o 3 0~61%, Bi 2 o 3 0~10%, B 2 o 3 0-10%, the transition temperature of the glass is 300-340°C, and the coefficient of thermal expansion is 135-180×10 -7 / °C, but the disadvantage of this glass is the larger Tl 2 O toxicity and thermal expansion coefficient, can not be used for medium and low expansion coefficient sealing

[0009] U.S. Patent US20020019303 proposes a sealing glass of phosphorus-tin-zinc system, the sealing temperature is 430°C-500°C, but because it contains a large amount of SnO, it needs to be produced and sealed in a reducing atmosphere, which is not conducive to industrial application

[0010] Hitachi Manufacturing Co., Ltd. has announced a vanadium oxide (V 2 o 5 ) is sealing glass, the sealing temperature is less than 400°C, and the coefficient of thermal expansion is 90×10 -7 / °C, but in this glass, lead oxide is a necessary component, which cannot meet the requirements of lead-free. At the same time, it also contains highly toxic thallium oxide

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