Method for preparing off-plane hollow microneedle array for use in transdermal medicament administration

A technology of microneedle array and hollow micro, which is applied in the direction of microneedles, medical devices, needles, etc., can solve the problems of poor bonding strength between the needle body and the substrate, high cost, and difficult process, so as to improve reliability and insertion characteristics, increase the production height, and simplify the process flow

Inactive Publication Date: 2010-10-20
PEKING UNIV
View PDF7 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Kiyoshi Sawada et al. have made hollow microneedle arrays by plastic injection molding, which requires ultra-precision machining capabilities and high costs (Kiyoshi Sawada, et al.Micro structuring of high aspect ratio and array by means of mechanical machine.Int.Conf .Pre Engineering (ICPE), July 18-20, 2001.)
LIGA and improved LIGA technology are more difficult, cost more, and cost relatively high
At the same time, the bonding strength between the electroplated needle body and the substrate is not as high as the reliability of the overall processing technology.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preparing off-plane hollow microneedle array for use in transdermal medicament administration
  • Method for preparing off-plane hollow microneedle array for use in transdermal medicament administration
  • Method for preparing off-plane hollow microneedle array for use in transdermal medicament administration

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Below in conjunction with the accompanying drawings, the present invention is further described in detail through the embodiments, but the scope of the present invention is not limited in any way.

[0026] Through mechanical processing of chemically pure titanium materials, four-inch titanium-based wafers are prepared by wire cutting. Low-temperature vacuum annealing and chemical-mechanical polishing were performed to obtain a 500 μm thick four-inch double-sided polished titanium-based wafer. Take a piece of the titanium substrate to prepare an off-plane hollow microneedle array according to the following steps:

[0027] 1. Growth mask

[0028] The titanium substrate 1 was ultrasonically cleaned with acetone / alcohol for 10 minutes. After that, sputter a layer of 500nm thick nickel mask 2 successively on the polished surface of one side of the substrate (you can also sputter a layer of 20nm thick titanium on the surface of the substrate as an adhesion layer to increase...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a method for preparing an off-plane hollow microneedle array for use in transdermal medicament administration, which comprises: growing a mask film on one side of a metal substrate, defining a microneedle array pattern to form a mask film pattern, and forming a perforation mark which is aligned with the mask film pattern on the other side of the metal substrate; protectingthe side with the perforation mark, and etching the metal substrate till the mask film falls off to form the off-plane microneedle array; and removing the protection of the side with the perforation mark, and performing perforation according to the perforation mark to form the off-plane hollow microneedle array. In the invention, based on a micromechanical process and a positioning perforation technique, the off-plane microneedle array preparation is realized, the process is simple, the processing process of the metal substrate body of off-plane hollow microneedles is made possible, he manufacturing level of the off-plane hollow microneedles is improved greatly, and the reliability and insertion property of the microneedle array are improved.

Description

technical field [0001] The invention relates to micromachining technology, in particular to a method for preparing a hollow microneedle array for transdermal administration. Background technique [0002] At present, the main modes of administration are oral and injection. Due to the gastrointestinal absorption and the first-pass effect of the liver, as well as the obvious pain caused by the injection and the need for professional operation, the microneedle transdermal drug delivery between subcutaneous injection and transdermal patch has become a better solution. [0003] The size of the microneedles is on the order of microns, and through painless pore-forming treatment of the skin, tiny pores are created in the stratum corneum without blood vessels and nerves to improve the permeability of drugs. Due to the extremely small size of the needle tip, there is almost no damage to the skin, and it does not require professional training, so it is easy to use. [0004] From the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): A61M37/00
CPCA61M37/0015A61M2037/0053
Inventor 陈兢李文
Owner PEKING UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products