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Black surface treatment process of electrolytic copper foil
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A technology of electrolytic copper foil and surface treatment, which is applied in the direction of metal material coating process, superimposed layer plating, coating, etc., to achieve the effect of excellent oxidation resistance and good appearance characteristics
Active Publication Date: 2011-08-10
SHANDONG JINBAO ELECTRONICS
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[0008] The technical problem to be solved by the present invention is to provide a method that can solve the problem of high bending resistance of FPC, solve the requirement of copper foil etchability for the development of fine pitch of FPC, and solve the black problem when electrolytic copper foil is used instead of rolled copper foil for FPC. The black surface treatment process of copper foil with appearance problems, the copper foil obtained after this treatment process can reach the performance of FPC in terms of bending resistance, elongation, surface roughness, peel strength, moisture resistance, heat resistance and oxidation resistance. With copper foil requirements
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Embodiment 1
[0037] The black surface treatment process of electrolytic copper foil, the specific process is as follows
[0038] 1. Preparation of roughening solution: mix and dissolve cathode copper, concentrated sulfuric acid, soft water, and steam to form a copper sulfate solution, then add additive A, mix well, pump it into the roughening tank for electroplating; among them, Cu 2+ 15g / L,H 2 SO 4 150g / L, Additive A 50ppm, temperature 40℃, current density 25A / dm 2 , Additive A selects thiourea for use.
[0039] 2. Preparation of curing solution: mix and dissolve cathode copper, concentrated sulfuric acid, soft water and steam to generate copper sulfate solution, pump it into the curing tank for electroplating; where Cu 2+ 65g / L, H 2 SO 4 85g / L, temperature is 80℃, current density is 32A / dm 2 .
[0040] 3. Weak coarsening: mix and dissolve cathode copper, concentrated sulfuric acid, soft water, and steam to form a copper sulfate solution, then add additive C to the copper sulfa...
Embodiment 2
[0046] The difference between this embodiment and embodiment 1 is:
[0047] 1. Coarsening: Cu 2+ 20g / L, H 2 SO 4 150g / L, additive A 10ppm, temperature 26°C, current density 30A / dm 2 , Additive A selects gelatin for use.
[0048] 2. Curing: Cu 2+ 58g / L,H 2 SO 4 160g / L, the temperature is 40℃; the current density is 25A / dm 2 .
[0049] 3. Weak coarsening: Cu 2+ 8g / L, H 2 SO 4 180g / L, additive C 1.2g / L, temperature 40°C, current density 7.5A / dm 2 , additive C is NaAsO 3 .
[0050] 4. Cobalt-plated alloy: K 4 P 2 o 7 140-300g / L, Co 2+ 15g / L, Zn 2+ 1.5g / L, additive M 420ppm, additive N 8.5g / L, pH 9.2, temperature 35°C, current density 12A / dm 2 , the additive M is Ag 2 SO 4 , the additive N is NH 4 AC.
[0051] 5. Galvanized alloy: K 4 P 2 o 7 220g / L, Zn 2+ 6.8g / L, additive D 145ppm, pH 9.6, temperature 40°C, current density 1.6A / dm 2 , the additive D chooses CuSO 4 .
[0055] The difference between this embodiment and embodiment 1 is:
[0056] 1. Coarsening: Cu 2+ 12g / L,H 2 SO 4 142g / L, Additive A 5.5ppm, temperature 45℃, current density 25 A / dm 2 , Additive A selects hydroxyethyl cellulose for use.
[0057] 2. Curing: Cu 2+ 70g / L, H 2 SO 4 95g / L, the temperature is 52℃; the current density is 30A / dm 2 .
[0058] 3. Weak coarsening: Cu 2+ 14g / L,H 2 SO 4 180g / L, additive C 1.8g / L, temperature 50°C, current density 9.2A / dm 2 , Additive C chooses NH 4 Cl.
[0059] 4. Nickel-plated alloy: K 4 P 2 o 7 180g / L, Ni 2+ 12g / L, Zn 2+0.5g / L, additive M 120ppm, additive N 3g / L, pH 10.8, temperature 40°C, current density 12A / dm 2 , the additive M chooses CoSO 4 ·7H 2 O, the additive N is triammonium citrate.
[0060] 5. Galvanized alloy: K 4 P 2 o 7 260g / L, Zn 2+ 5g / L, additive D 140ppm, pH 10.6, temperature 39°C, current density 0.68A / dm 2 , the additive D chooses NiSO 4 ·6H 2 O.
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Abstract
The invention relates to a black surface treatment process of an electrolytic copper foil, belonging to the technical field of production processes of high and precision electrolytic copper foils. The black surface treatment process of an electrolytic copper foil is characterized in that a VLP (Very Low Profile) electrolytic copper foil of 8-12 mu is used as an electrode, and then copper or copper alloy is roughened, solidified, weakly roughened and electrically deposited at a running speed of 25.0+ / -0.1m / min; a layer of nano-scale nickel or cobaltalloy and a layer of nano-scale zinc alloyare sequentially and electrically deposited; and then alkaline chromate passivation is carried out and a layer of coupling agent is coated. In the invention, the black copper foil for an FPC (Flexible Printing Circuit) is obtained by carrying out a series of special surface treatments on the ultrathin and VLP electrolytic copper foil of 8-12 mu, wherein the surface roughness Ra of the obtained copper foil is smaller than or equal to 0.30 mu, Rz is smaller than or equal to 2.5 mu; the thickness of the copper foil subjected to the surface treatments is increased by 1.40-1.80 mu; the copper foil does not contain elements having serious damages to the human body, such as lead, mercury, cadmium, stibium, and the like and has excellent oxidation resistance as well as corrosion and etching resistance; the peel strength of the copper foil on a PI (Polyimide) film reaches higher than 1.0N / mm, and the folding strength on the PI film reach more than 100 thousand numbers of times; the copper foil has good appearance characteristics after the copper foil is microetched, and after the copper foil is made into an FCCL (Flexible Copper Clad Laminate), the copper foil has similar appearance characteristics to a rolled copper foil; and the properties of the copper foil product are equivalent to that of an electrolytic copper foil with the same specification for the FCCL.
Description
technical field [0001] The invention relates to a black surface treatment process of electrolytic copper foil, belonging to the technical field of high-precision electrolytic copper foil production technology. Background technique [0002] Flexible Printed Circuit (FPC) has the advantages of softness, lightness, thinness and flexibility. It has been widely used in notebook computers, digital Cameras, mobile phones, video cameras, liquid crystal displays, electronic communications, aviation electrical and other products. From the mid-1990s to the present, the FPC market has rapidly shifted from military use to civilian use, focusing on consumerelectronics products, forming a trend that almost all high-tech electronic products that have emerged in recent years use FPC in large quantities. [0003] FCCL (FCCL is the processing base material of flexible printed circuit board) is a special type of CCL (copper clad substrate). In addition to the advantages of thinness, lightness...
Claims
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