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Copper foil with resin and process for producing copper foil with resin

A technology of resin copper foil and manufacturing method, which is applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of resin layer becoming brittle and reducing bonding stability, and achieve excellent bonding stability, small thermal expansion coefficient, and good The effect of dimensional stability

Inactive Publication Date: 2010-12-08
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the resin material for forming the resin layer with resin copper foil shown in Patent Document 1, when the inorganic filler is dispersed and mixed in the resin, even if the thermal expansion coefficient of the resin layer can be reduced, it is possible to make the build-up printing The positional relationship of the circuit between the layers of the wiring board is good, but the cured resin layer tends to become brittle, and the bonding stability between the circuit formed by the copper foil and the resin layer decreases

Method used

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  • Copper foil with resin and process for producing copper foil with resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] In Example 1, a copper foil with resin is exemplified in which a polyimide resin layer is formed as a cured resin layer on the surface of an electrolytic copper foil, and a maleimide-based resin is used for the formation of a semi-cured resin layer.

[0079] Electrodeposited copper foil: Electrodeposited copper foil having a glossy surface of surface roughness Rzjis=0.70 and a thickness of 12 μm was used. Using a dilute sulfuric acid solution having a concentration of 100 g / L, this electrolytic copper foil was immersed and washed at a liquid temperature of 30° C. for 30 seconds. Next, nickel-zinc alloy plating treatment, chromate treatment, and silane coupling agent treatment were sequentially performed as antirust treatment on the glossy surface. Among them, nickel-zinc alloy plating is performed in a pyrophosphoric acid bath (nickel 2.5g / L, zinc 0.5g / L, liquid temperature 40°C, current density 0.6A / dm 2 , 8 seconds) under the conditions. In addition, electrolytic ch...

Embodiment 2

[0096]Example 2 is different from Example 1 in thickness of the cured resin layer. That is, in the formation of the cured resin layer in Example 1, the thickness of the resin after drying at 110°C for 6 minutes was 35 μm, whereas in Example 2, the thickness of the resin after drying at 110°C for 6 minutes was adjusted to 8 μm . Other than that, the copper foil with resin was produced by the method similar to Example 1. The cured resin layer of Example 2 has a resin thickness of 5 μm after being dried at 400° C. for 8 minutes, and a residual solvent rate of 0.1 wt %. Furthermore, the coefficient of thermal expansion of the entire resin layer after the semi-cured resin was completely cured was 38 ppm / °C, and the peel strength of the copper foil was 0.95 kgf / cm.

Embodiment 3

[0098] Compared with Example 1, Example 3 has a different composition of the cured resin layer. That is, in the formation of the cured resin layer, the resin used was changed to Bioromax HR16NN (trade name, manufactured by Toyobo Co., Ltd.), the thickness of the cured resin layer after drying at 110° C. for 6 minutes was adjusted to 28 μm, and the subsequent drying conditions were changed to The highest temperature setting is 380°C. Other than that, the copper foil with resin was produced by the method similar to Example 1. At this time, the thickness of the cured resin layer after drying at 380° C. for 8 minutes was 24 μm, the residual solvent rate was 0.8 wt %, and the thermal expansion coefficient of the cured resin layer was 23 ppm / ° C. Furthermore, the coefficient of thermal expansion of the entire resin layer with the resin-coated copper foil after the semi-cured resin was completely cured was 34 ppm / °C, and the peel strength of the copper foil was 0.80 kgf / cm.

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Abstract

Disclosed is a copper foil with a resin that can realize an improvement in dimensional stability of a build-up printed wiring board and can realize the formation of a fine pitch circuit. Also disclosed is a process for producing the copper foil with a resin. The copper foil with a resin comprises a copper foil, and a cured resin layer and a semi-cured resin layer provided in that order on a surface of the copper foil. The surface roughness (Rzjis) of a side, of the copper foil, in contact with the cured resin layer is 0.5 mu m to 2.5 mu m. The cured resin layer comprises any resin component selected from polyimide and polyamide-imide resins having a coefficient of thermal expansion of 0 ppm / DEG C to 25 ppm / DEG C or composite resins of the polyimide resins and the polyamide-imide resins. The semi-cured resin layer is provided on the cured resin layer and has a coefficient of thermal expansion of 0 ppm / DEG C to 50 ppm / DEG C after curing.

Description

technical field [0001] The present invention relates to a resin-coated copper foil used as a printed wiring board material and a method for manufacturing the resin-coated copper foil. Background technique [0002] Resin-coated copper foil is formed by stacking a resin layer as an insulating layer on a copper foil as a conductor, and has been used for various purposes in multilayer printed wiring boards (hereinafter sometimes referred to simply as " In the field of manufacturing of laminated printed wiring boards"), etc. For example, in the manufacture of a build-up printed wiring board, an insulating layer formed of a resin layer with a resin copper foil attached to an inner core material is drilled by laser processing to form a via hole. After performing interlayer conductive plating on the inner peripheral wall surface of the via hole, pattern etching was performed on the surface of the outer layer copper foil to form an outer layer circuit. Then, a resin-coated copper f...

Claims

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Application Information

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IPC IPC(8): B32B15/088H05K1/03
Inventor 佐藤哲朗松岛敏文
Owner MITSUI MINING & SMELTING CO LTD
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