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Colloid palladium activation solution, preparation method thereof and non-metal surface activation method

A technology of colloidal palladium activation and colloidal palladium, which is applied in metal material coating process, liquid chemical plating, coating and other directions, can solve the problem of low stability of the activation solution, and achieve high chargeability, enhanced activity, and enhanced binding force. Effect

Inactive Publication Date: 2010-12-29
深圳市新合富力科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This activation solution adopts a salt-based colloidal palladium system, which reduces the generation of hydrochloric acid mist, and vanillin can increase the adhesion of colloidal palladium and substrate and improve the adsorption capacity of colloidal palladium; however, the stability of this activation solution is still very high. Low

Method used

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Examples

Experimental program
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preparation example Construction

[0025] According to the preparation method provided by the present invention, in step a, a surface wetting agent commonly used by those skilled in the art can also be added to the sodium chloride solution, so that the A liquid contains a surface wetting agent. The surface wetting agent is one or more of isopropanol, methanol and ethanol.

[0026] In the b step, palladium chloride and tin protochloride take place following reaction under acidic conditions:

[0027] sn 2+ +Pd 2+ →Sn 4+ +Pd 0 ;

[0028] Through the above reaction, liquid B containing colloidal palladium particles can be obtained. For guaranteeing the activity of colloidal palladium, the mol ratio of palladium chloride and stannous chloride is less than 1 in the b step, is preferably 0.5. The reaction temperature is 20-40° C., and the reaction time is 10-30 minutes.

[0029] The present invention also provides a non-metallic surface activation method, comprising contacting the pretreated non-metallic substr...

Embodiment 1

[0039] This embodiment is used to illustrate the colloidal palladium activation solution provided by the present invention and its preparation method.

[0040] (1) Weigh 3.422mol of sodium chloride and dissolve it in 750mL of deionized water, stir until completely dissolved, add 0.24mol of concentrated hydrochloric acid, 0.013mol of glyoxylic acid, 0.020mol of isopropanol, 0.832mol of urea, stir until completely dissolved .

[0041] (2) 0.00028mol palladium chloride is dissolved in the liquid containing 70ml deionized water of 0.36mol concentrated hydrochloric acid, is stirred to dissolving completely, adds 0.00056mol tin protochloride, continues to stir 12min, reaction generates colloidal palladium mixed solution; Then Pour the mixed solution into the solution in step (1), add deionized water to a volume of 1 L, and keep it at 55°C for 3 hours to obtain the colloidal palladium activation solution of this example, which is denoted as A1.

Embodiment 2

[0043] (1) Weigh 3.422mol sodium chloride and dissolve it in 750mL deionized water, stir until completely dissolved, add 0.24mol concentrated hydrochloric acid, 0.2mol glyoxylic acid, 0.020mol isopropanol, 0.832mol urea, stir until completely dissolved .

[0044] (2) 0.00028mol palladium chloride is dissolved in the liquid containing 70ml deionized water of 0.36mol concentrated hydrochloric acid, is stirred to dissolving completely, adds 0.00056mol tin protochloride, continues to stir 12min, reaction generates colloidal palladium mixed solution; Then Pour the mixed solution into the solution in step (1), add deionized water to a volume of 1 L, and keep it at 55°C for 3 hours to obtain the colloidal palladium activation solution of this example, which is denoted as A2.

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Abstract

The invention provides colloid palladium activation solution which comprises colloid palladium, sodium chloride, glyoxylic acid, hydrochloric acid, stannous chloride and stabilizer for stabilizing the stannous chloride, wherein the glyoxylic acid has strong reducibility and can avoid that divalent tin ions in the activation solution are oxidized, and prolong the service life of the action solution; simultaneously, the glyoxylic acid is adsorbed on the periphery of colloid palladium particles, thereby leading the dispersion of the colloid palladium to be more uniform, avoiding the gel coagulation among the colloid particles and enhancing the activity of the activation solution. The invention provides a preparation method of the colloid palladium, and the process is simple. In addition, the adoption of the colloid palladium activation solution for activating the surface of a non-metal substrate can firstly adsorb the glyoxylic acid in the activation solution on the surface of the non-metal substrate, enhance the bonding force between the colloid palladium particles and the non-metal substrate, leading a plated coating after chemical plating to have uniform thickness and flat surface, and leading the adhesion between the plated coating and the substrate to be very high.

Description

【Technical field】 [0001] The invention relates to the field of non-metal surface activation, in particular to a colloidal palladium activation solution for non-metal surfaces, a preparation method thereof and a non-metal surface activation method. 【Background technique】 [0002] Most non-metallic materials are non-conductors, and a conductive film must be prepared before electroplating. The commonly used method is electroless plating. Before electroless plating, surface pretreatment must be activated. The purpose of activation is to adsorb a certain amount of activation centers on the non-metallic substrate in order to induce subsequent electroless plating. Activation not only determines the quality of the electroless coating, but also determines the quality of the coating. [0003] The catalytic activity of the acidic colloidal palladium activation solution is longer, but the preparation is more troublesome, and the acidic colloidal palladium activation solution is easily ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/30
CPCC23C18/28C23C18/30
Inventor 宫清韦家亮连俊兰
Owner 深圳市新合富力科技有限公司
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