High-strength aluminum nitride ceramic substrate and preparation method thereof

A high-strength aluminum nitride ceramic technology, applied in the field of ceramic materials, can solve the problem of low bending strength

Active Publication Date: 2021-07-16
FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, in view of the above content, the present invention provides a high-strength aluminum nitrid

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A high-strength aluminum nitride ceramic substrate, including the following raw materials in parts by weight: 78 parts of modified aluminum nitride powder, 11 parts of acetone, 25 parts of isopropanol, 1.2 parts of ammonium polyacrylate, 8 parts of binder, 1.5 parts of dimethyl phthalate, 0.5 parts of PEG-6000, the binder is composed of ethyl cellulose, polymethyl acrylate and ethylene-methyl acrylate copolymer in a mass ratio of 28:12:3.

[0042] The modified aluminum nitride powder is prepared according to the following method: (1) aluminum sulfate, citric acid, glycine, aluminum powder, and lanthanum nitrate are added to deionized water in sequence, and the aluminum sulfate, citric acid, glycine, aluminum powder, lanthanum nitrate, and deionized water in a mass ratio of 35:40:8:1:0.2:165, stirred and mixed evenly to form a sol, and dried at 80°C for 36 hours to obtain a gel; (2) put the mixture into In an alumina crucible and placed in a muffle furnace, the temperatu...

Embodiment 2

[0060] A high-strength aluminum nitride ceramic substrate, including the following raw materials in parts by weight: 80 parts of modified aluminum nitride powder, 16 parts of acetone, 23 parts of isopropanol, 1.6 parts of castor oil, 10 parts of binder, 2.4 parts of dimethyl phthalate and 0.6 parts of PEG-8000. The binder is composed of ethyl cellulose, polymethyl acrylate and ethylene-methyl acrylate copolymer in a mass ratio of 30:15:4.

[0061] The modified aluminum nitride powder is prepared according to the following method: (1) aluminum sulfate, citric acid, glycine, aluminum powder, and lanthanum nitrate are added to deionized water in sequence, and the aluminum sulfate, citric acid, glycine, aluminum Powder, lanthanum nitrate, and deionized water have a mass ratio of 36:42:9:2:0.4:175, stir and mix evenly to form a sol, and dry at 85°C for 30 hours to obtain a gel; (2) Put the mixture into In an alumina crucible, and placed in a muffle furnace, the temperature was rais...

Embodiment 3

[0079] A high-strength aluminum nitride ceramic substrate, including the following raw materials in parts by weight: 85 parts of modified aluminum nitride powder, 21 parts of acetone, 21 parts of isopropanol, 2 parts of phosphate ester dispersant (Akzo Nobel PE169 Anionic phosphate ester wetting and dispersing agent), 11 parts of binder, 3.6 parts of dimethyl phthalate, 0.4 parts of PEG-10000, said binder is composed of ethyl cellulose, polymethyl acrylate, ethylene-acrylic acid The methyl ester copolymer is composed of a mass ratio of 32:18:6.

[0080] The modified aluminum nitride powder is prepared according to the following method: (1) aluminum sulfate, citric acid, glycine, aluminum powder, and lanthanum nitrate are added to deionized water in sequence, and the aluminum sulfate, citric acid, glycine, aluminum Powder, lanthanum nitrate, and deionized water have a mass ratio of 38:45:10:3:0.6:185, stir and mix evenly to form a sol, and dry at 90°C for 24 hours to obtain a g...

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Abstract

The invention relates to the technical field of ceramic materials, and provides a high-strength aluminum nitride ceramic substrate and a preparation method thereof. The high-strength aluminum nitride ceramic substrate comprises the following raw materials by weight: 78-85 parts of modified aluminum nitride powder, 36-42 parts of a solvent, 1.2-2 parts of a dispersant, 8-11 parts of a binder and 2-4 parts of a plasticizer; and the aluminum nitride ceramic substrate is prepared through the procedures of ball milling, vacuum foaming, tape casting, isostatic pressing, rubber discharging, primary sintering and secondary sintering in sequence. The thermal conductivity of the prepared aluminum nitride ceramic is 180 W/(m.K) or above, the bending strength is 520 MPa or above, and the problem that the bending strength of the aluminum nitride ceramic is not high in the prior art is solved.

Description

technical field [0001] The invention relates to the technical field of ceramic materials, in particular to a high-strength aluminum nitride ceramic substrate and a preparation method thereof. Background technique [0002] With the rapid development of electronic integration and packaging technology, electronic components and equipment are developing in the direction of miniaturization and miniaturization, which puts forward higher and higher requirements for the heat dissipation performance of electronic packaging materials. Aluminum nitride is an emerging ceramic material with excellent comprehensive properties such as excellent thermal conductivity, low dielectric constant and dielectric loss, high volume resistivity, non-toxicity, and a thermal expansion coefficient similar to silicon. The theoretical thermal conductivity of aluminum nitride ceramics is as high as 320W / (m K), which is 5-10 times that of aluminum oxide for traditional electronic packaging substrates, and i...

Claims

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Application Information

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IPC IPC(8): C04B35/582C04B35/622C04B35/624C04B35/626C04B35/638C04B35/64
CPCC04B35/581C04B35/622C04B35/624C04B35/626C04B35/638C04B35/64C04B2235/3227C04B2235/661C04B2235/666C04B2235/658C04B2235/6562C04B2235/6567C04B2235/96C04B2235/9607
Inventor 杨大胜施纯锡冯家伟
Owner FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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