Packaging of LED area light source

Abstract

The invention relates to a technology for packaging an LED area light source. In the technology for packaging the LED area light source, a transparent ceramic wafer, a substrate, a bracket and a plurality of chips are provided, the chips are subjected to eutectic welding to be arranged in a groove of the substrate in series-parallel way through gold wires or copper wires by adopting a COM (Chip on Metal) area light source packaging technology, the transparent ceramic wafer is platy, covers above the chips and is combined with the bracket fixed above the substrate through the modes of gluing, close-fitting or clamping and the like, and a certain distance is reserved between the transparent ceramic wafer and the chips to form a hollow isolation layer. After energization, light emitted by the chips excites rare-earth ions in the transparent ceramic wafer to emit mixed transmission light form white light; and the color temperature of the emitted white light is changed by changing the concentration of the rare earth ions and the thickness of the transparent ceramic wafer.

Description

technical field [0001] The invention relates to an LED surface light source packaging technology, which is an innovative LED packaging technology, which is different from the existing packaging method in which yellow phosphor powder is excited by three primary colors or blue light to generate white light. Background technique [0002] ① In 1962, the joint laboratory of GE, Monsanto, and IBM developed a red-emitting gallium arsenide phosphide (GaAsP) semiconductor compound, and since then visible light-emitting diodes have entered the process of commercial development. [0003] ②In 1965, the world's first commercial light-emitting diode was born. It was made of germanium and could emit infrared light. The unit price at that time was about 45 US dollars. Shortly thereafter, Monsanto and Hewlett-Packard introduced commercial red LEDs made of GaAsP materials. The efficiency of this LED is about 0.1 lumens per watt, which is more than 100 times lower than the 15 lumens per watt ...

AI Technical Summary

Problems solved by technology

[0013] At present, the market generally uses blue light chips to excite yellow phosphors to produce white light to produce high-power LEDs. The laboratory luminous efficiency has reached 120lm / W, and the commercial luminous efficiency can reach up to 100lm / W, and this data is still showing rapid growth in a short period of time. Growth, lighting application prospects are broad. Under the premise of a bright market prospect, experts in the field of LEDs in various countries are also actively seeking new packaging materials and technologies, because there are various factors that restrict the development of LEDs due to the use of blue light chips to excite yellow phosphors: ①Patent Being monopolized by Nichia and Osram, it is difficult for merchants to form their own sovereignty; ②There is no method to control the thickness, uniformity and regularity of the phosphor powder coated on the blue light chip very accurately, and the stability of LED color temperature is very high. Difficult to achieve consistency, uneven phosphor coating can easily cause the light emitted by the LED to form a yellow circle or macula, affecting the light color; ③The phosphor powder coated on the chip is AB silica gel and phosphor powder in a ratio of 6:6:1 Compared with the mixture, what we call silica gel is generally organic silica gel. Organic silica gel is a compound of a biological component and an organic chemical component (auxiliary component). Silicone products are based on silicon-oxygen (Si-O) The bond is the main chain structure, the bond energy of the C-C bond is 82.6 kcal / molecule, and the bond energy of the Si-O bond is 121 kcal / molecule in silicone, so the thermal stability of silicone products is high, high temperature Under (or radiation irradiation) the chemical bonds of the molecules do not break or decompose, and the thermal conductivity is almost 0. In this way, the heat generated by the LED chip covered under the silica gel due to 75% of the incoming electricity cannot be exported through the upper channel, but is mixed. The glue is trapped inside, which increases the heat dissipation load of the LED and affects the life of the LED

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