Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of conducting paste by using oxides as adhesive

A technology of conductive paste and binder, which is used in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve problems such as export restrictions, and achieve good adhesion, good conductivity, The effect of high adhesion

Inactive Publication Date: 2012-09-19
IRICO
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the binders contained in the existing electronic pastes are glass powders, among which harmful elements such as lead and cadmium are mostly used to lower the melting point, and the export is restricted by the above-mentioned directives

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] 1) Preparation of binder: Bi 2 o 3 45%; ZnO 30%; B 2 o 3 20%; AgO 2%; NiO 2 3% mixed evenly, the average particle size of the binder after mixing is below 5μm;

[0021] 2) Preparation of organic vehicle: add 10% ethyl cellulose resin to 90% terpineol by mass percentage, heat to 85°C in a constant temperature water bath until the ethyl cellulose resin is completely dissolved, filter through 250 mesh, get an organic carrier;

[0022] 3) preparation of slurry: 65% silver powder, 5% binding material, 20% organic vehicle, 9.5% propylene glycol methyl ether acetate and 0.5% polyethylene wax dispersant in planetary or Mix evenly in other mixers, then disperse on a three-roller machine to below 10μm, and finally filter in a 250-mesh screen to obtain conductive paste with oxide as a binder.

Embodiment 2

[0024] 1) Preparation of binder: Bi 2 o 3 55%; ZnO 20%; B 2 o 3 21%; NiO 0.5%; NiO 2 0.5%; AgO 3% mixed evenly, the average particle size of the binder after mixing is below 8μm;

[0025] 2) Preparation of organic vehicle: add 20% ethyl cellulose resin to 80% ethyl carbitol by mass percentage, heat to 95°C in a constant temperature water bath until the ethyl cellulose resin is completely dissolved, 250 mesh Filter to obtain an organic carrier;

[0026] 3) preparation of slurry: by mass percentage, 74% silver powder, 10% bonding material, 10% organic vehicle, 1% propylene glycol methyl ether acetate, 3% ethylene glycol ether, 1% pine oil Alcohol and 1% zinc stearate dispersant are mixed evenly in a planetary or other mixer, and then dispersed on a three-roller machine to less than 10 μm, and finally filtered in a 250-mesh sieve to obtain a conductive paste with oxide as a binder .

Embodiment 3

[0028] 1) Binder preparation: by mass percentage, Bi 2 o 3 45%; ZnO 30%; B 2 o 3 20%; NiO 0.5%; CuO 1%; AgO 3.5% mixed evenly, the average particle size is below 7μm;

[0029] 2) Preparation of organic vehicle: add 30% ethyl cellulose resin to 70% ethyl carbitol acetate by mass percentage, heat to 85° C. in a constant temperature water bath until the ethyl cellulose resin is completely dissolved, 250 mesh filtration, obtain organic carrier;

[0030] 3) preparation of slurry: by mass percent, 55% silver powder, 10% caking material, 24% organic vehicle, 5% butyl carbitol solvent, 5% sherwood oil and 0.5% microcrystalline paraffin Mix evenly with 0.5% zinc stearate dispersant in a planetary or other mixer, then disperse on a three-roll machine to below 10 μm, and finally filter in a 250-mesh screen to obtain a conductive paste with oxide as a binder .

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention provides a preparation method of conducting paste by using oxides as an adhesive, which comprises the following steps: (1) preparation of the adhesive: mixing Bi2O3, ZnO, B2O3, NiO, NiO2, CaO, CuO and AgO according to a certain percentage by mass to obtain the adhesive; (2) preparation of an organic carrier: adding ethyl cellulose resin into the mixed liquor of ethyl carbitol, ethylcarbitol acetate and terpineol in any proportion, dissolving and filtering to obtain the organic carrier; (3) and preparation of paste: uniformly mixing silver powder, the adhesive, the organic carrier, a solvent and a dispersant according to a certain percentage by mass, rolling and filtering to obtain the conducting paste by using oxides as an adhesive. By changing the addition proportion and components of the adhesive, the invention can regulate the conductivity, printing property and adhesion force of the paste; and by changing the addition proportion of the organic carrier, the inventioncan regulate the viscosity and printing property of the paste.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a preparation method of conductive paste with oxide as a binder. Background technique [0002] With the development of electronic technology, electronic information technology is developing in the direction of miniaturization, high integration, high frequency and multi-dimensionalization. New electronic components are developing in the direction of high power, miniaturization, light weight, multi-function, green and low cost. Integrated circuits are the crystallization of the development achievements of modern electronic technology, mainly including thick film hybrid integrated circuits, thin film hybrid integrated circuits and semiconductor integrated circuits. Semiconductor integrated circuits take the lead in digital circuits and are suitable for mass production; thin-film hybrid integrated circuits have obvious advantages in microwave and high-freque...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00C09D11/02
Inventor 李驰
Owner IRICO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products