Method for modularizing crystal and heat sink in laser diode pumped solid laser

A technology of laser diodes and solid-state lasers, which is applied to lasers, laser components, laser components, etc., can solve problems such as the difficulty of effective heat dissipation of crystals, improve reliability and environmental adaptability, reduce assembly difficulty, and weaken thermal effects. Effect

Inactive Publication Date: 2011-01-26
XIDIAN UNIV
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Problems solved by technology

It can be seen that limited by the size of the crystal, the effective heat dissipation area is only the side area of ​​the crystal, and the thermal conductivity of the indium skin is much sma

Method used

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  • Method for modularizing crystal and heat sink in laser diode pumped solid laser
  • Method for modularizing crystal and heat sink in laser diode pumped solid laser
  • Method for modularizing crystal and heat sink in laser diode pumped solid laser

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Embodiment Construction

[0016] figure 2 In the schematic diagram of the embodiment shown, the crystal 1 is a non-coated crystal on the end face (because the crystal coating will affect the coating effect during the sintering process, or the coating will be burned, so the crystal 1 is a non-coated crystal on the end face, and finally the welded crystal and the crystal are heated sink the overall coating to obtain an integrated component that can be used directly.) The gold powder layer 5 with a thickness of about 5 microns is sintered on the side; the crystal heat sink upper assembly 3 and the crystal heat sink lower assembly 4 are processed from oxygen-free copper materials, and The crystal heat sink upper component 3 and the crystal heat sink lower component 4 are electroplated with a silver layer 6 with a thickness of about 15 microns on the connection surface of the crystal 1, and the silver layer 6 is mainly used as solder; the crystal 1 and the crystal heat sink after burning gold The upper com...

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Abstract

The invention relates to a laser diode pumped solid laser, in particular to a method for modularizing crystal and heat sink in laser diode pumped solid laser. The method is characterized in that the crystal and the crystal heat sink are welded into a whole at high temperature; the crystal heat sink comprises an upper crystal heat sink component and a lower crystal heat sink component; the crystal, the upper crystal heat sink component and the lower crystal heat sink component are assembled together, are closely pressed together by two large parallel free copper, are put into a vacuum furnace together, and then are heated until a silver layer is melted; the crystal, the upper crystal heat sink component and the lower crystal heat sink component are welded together to form a whole; and the welded crystal and the crystal heat sink are plated integrally to obtain an integral element which can be directly used. The method improves the heat conduction efficiency of the crystal side wall, reduces the influence of heat effect, improves the system reliability and the environmental adaptability, and is convenient for batch production of products.

Description

technical field [0001] The invention relates to a laser diode-pumped solid-state laser, in particular to a method for modularizing crystals and heat sinks in the laser diode-pumped solid-state laser. technical background [0002] In the design process of laser diode-pumped solid-state lasers, due to the existence of crystal thermal effects, it has an important impact on the stability and beam quality of the laser. Controlling or weakening crystal thermal effects is a problem that must be solved to obtain high-performance diode-pumped solid-state lasers. one. [0003] Laser crystals will generate a lot of waste heat during the working process, and the accumulation of waste heat caused by unfavorable heat dissipation is the root cause of the rapid enhancement of the thermal lens effect. Therefore, designing a reasonable and efficient heat dissipation channel is an effective means to reduce the accumulation of waste heat and then control the thermal effect. Generally, the siz...

Claims

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Application Information

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IPC IPC(8): H01S3/16H01S3/0941H01S3/06H01S3/042H01S3/02
Inventor 李兵斌文建国蔡德芳王石语过振
Owner XIDIAN UNIV
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