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Heat-resisting phenolic moulding compound

A technology of phenolic molding compound and high temperature resistance, which is applied in the field of thermosetting molding compound, can solve problems such as unseen technical revelations and troubles, and achieve the effects of improving adaptability, appropriate dosage, and reasonable selection of raw materials

Active Publication Date: 2011-02-16
常熟东南塑料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, what kind of surface modifier can be used to achieve the ultimate effect of the interface between the resin and the reinforcing fiber, as well as the optimal selection and mutual intake of various raw materials for the phenolic molding compound formulation have always puzzled the industry, although this application People have conducted extensive searches, but there is no technical inspiration that can be used for reference in the patents and non-patent literature that have been published so far

Method used

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  • Heat-resisting phenolic moulding compound

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] In parts by weight:

[0026] 35 parts of phenolic resin;

[0027] 5 parts of epoxy resin;

[0028] 6 parts of hexamethylenetetramine;

[0029] 15 parts of glass fiber;

[0030] 0.5 part of titanate coupling agent;

[0031] 0.5 parts of aluminum stearate;

[0032] Zinc stearate 2 parts;

[0033] 2 parts of magnesium oxide;

[0034] 5 parts mica powder;

[0035] 20 parts of stone powder;

[0036] Talcum powder 6 parts.

[0037] During preparation, the above-mentioned various raw materials are crushed, passed through a 60-200 mesh screen, fed into the kneader according to the formula requirements and mixed evenly to obtain a mixture, and then the mixture is heated on a rubber mixer, rolled, and masticated Gel forming, plasticizing roller temperature 70-150°C, plasticizing time 5-10 minutes, roller spacing 2-6mm, cooling the glue, and then crushing and granulating for packaging. The high-temperature-resistant phenolic molding compound of the present invention obta...

Embodiment 2

[0039] Each raw material is by weight ratio:

[0040] 40 parts of phenolic resin;

[0041] 5 parts of epoxy resin;

[0042] 5 parts of unsaturated resin;

[0043] 8 parts of hexamethylenetetramine;

[0044] 20 parts wood flour;

[0045] 0.8 part of silane coupling agent;

[0046] 1 part calcium stearate;

[0047] 1.0 parts of stearic acid;

[0048] Kaolin 5 parts;

[0049] 15 parts of high temperature resistant mineral powder;

[0050] Calcium Hydroxide 3 parts.

[0051] 0.5 parts of magnesium hydroxide;

[0052] All the other are the same as the description to embodiment 1.

Embodiment 3

[0054] Each raw material is calculated by weight:

[0055] 25 parts of phenolic resin;

[0056] 8 parts of melamine formaldehyde resin;

[0057] 3 parts of hexamethylenetetramine;

[0058] 40 parts of bamboo powder;

[0059] 1 part of titanate coupling agent;

[0060] 0.5 parts of aluminate coupling agent;

[0061] Borate coupling agent 0.5 parts

[0062] 0.3 parts of calcium stearate;

[0063] 0.3 parts of ethylene bis stearic acid amide;

[0064] 0.5 parts of magnesium oxide;

[0065] 20 parts of calcium carbonate;

[0066] 20 parts of asbestos powder.

[0067] All the other are the same as the description to embodiment 1.

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Abstract

The invention discloses a heat-resisting phenolic moulding compound belonging to the technical field of thermoset moulding compound. The heat-resisting phenolic moulding compound is composed of the following raw materials in parts by weight: 25-40 parts of phenolic resin, 2-10 parts of thermosetting resin, 3-8 parts of curing agent, 1-3 parts of accelerator, 15-40 parts of reinforcing fibre, 0.5-2 parts of interface modifier, 0.5-2.5 parts of releasing agent and 10-40 parts of inorganic filler. Because in the technical scheme of the invention, raw material selection is reasonable and the use amount of each raw material is proper, the invention can ensure that the eat-resisting phenolic moulding compound has excellent curing system and the flame retardant property reaches V-0 level. The heat-resisting phenolic moulding compound is suitable for manufacturing handles, handle knobs and the like of daily necessities, such as cookers and the like, can satisfy strict requirements on product heat resistance by electronic parts, electrical appliance parts, mechanical parts, automobile parts and the like, improves the adaptability of the moulding process, and can be moulded by injection and mould pressing.

Description

technical field [0001] The invention belongs to the technical field of thermosetting molding compounds, in particular to a high temperature resistant phenolic molding compound. Background technique [0002] The phenolic molding compound, known as bakelite, is widely used in civil products such as handles and knobs of cooking utensils, as well as industrial products such as electronic Mechanical and chemical equipment, electrical appliances and auto parts, etc. However, there is a lag between the high temperature resistance of phenolic molding compounds and the increasingly stringent comprehensive technical requirements of the aforementioned electronics, electrical appliances and auto parts, and many tiny parts In the process of processing, it needs to go through tin ironing process, and the current phenolic molding compound is not enough to meet the high temperature resistance requirements of V-0 level for flame retardancy expected by downstream enterprises. In patent liter...

Claims

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Application Information

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IPC IPC(8): C08K3/34C08K7/14C08L61/06C08K13/04C08K3/22C08K5/17C08L61/28C08L97/02C08L63/00
Inventor 朱叶刚魏卫王伟江杨乐恩
Owner 常熟东南塑料有限公司
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