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Method for preparing silica and alumina sol type activator used for activating nonmetal materials

A technology of non-metallic materials and silica-alumina sol, applied in metal material coating process, liquid chemical plating, coating, etc., can solve problems such as uncertain treatment effect, unstable activation solution, tin ion interference, etc. The effect of good performance, wide application range and strong activation ability

Inactive Publication Date: 2011-04-06
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of unstable activation solution, tin ion interference, complicated operation and uncertain treatment effect in the non-metallic activation process.

Method used

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  • Method for preparing silica and alumina sol type activator used for activating nonmetal materials
  • Method for preparing silica and alumina sol type activator used for activating nonmetal materials

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preparation example Construction

[0030] The preparation method and activation process flow of sol-type activation solution in the present invention are as follows: figure 2 shown. In order to cooperate with the implementation of the present invention, the electroless nickel plating solution and the electroless copper plating solution are respectively used to carry out the process operation of electroless plating on the non-metallic materials that have been activated by the sol-type activation solution. The specific proportions are as follows:

[0031] (1) Electroless nickel plating solution

[0032] Citric acid 6g / L Sodium succinate 5g / L

[0033] Ammonium acetate 4.5g / L Glycine 1g / L

[0034] Lactic acid 8ml / L NiSO 4 ·6H 2 O 25g / L

[0035] NaH 2 PO 2 ·H 2 O 25g / L

[0036] Ammonia water to adjust the pH of the plating solution: 4.8 to 5.4 Temperature: 80 to 83°C

[0037] (2) Electroless copper plating solution

[0038] CuSO 4 ·5H 2 O 16g / L NaKC 4 h 4 o 5 4H 2 O 14g / L

[0039] Disodium EDTA 1...

Embodiment 1

[0043] Electroless nickel plating on glass surface

[0044] (1) Preparation of sol-type activation solution: add 2.5% (v / v) sulfuric acid dropwise to 1L of 80g / L sodium silicate solution while stirring until the pH value is 6.7, and stir for 10min to obtain a silica sol solution; Add 0.001 g of aluminum sulfate to the silica sol solution, stir for 10 minutes to obtain a mixed solution containing silica sol and silica-alumina sol; add deionized water to dilute the mixed glue solution at a volume of 1:1 and perform filtering and rinsing operations twice, Remove metal ions and acid radical ions in the mixed glue to obtain a coagulated mixed sol; prepare 3 g / L sodium carboxymethyl cellulose solution, add 1L sodium carboxymethyl cellulose solution to the coagulated mixed sol, Stir for 20 minutes, add dropwise 30g / L sodium hydroxide solution to pH 10 while stirring, and age in a water bath at 50°C for 60 minutes to obtain a solution-state transparent mixed glue, add 0.0005g of palla...

Embodiment 2

[0050] Electroless Nickel Plating on Ceramic Surface

[0051] (1) Preparation of sol-type activation solution: Add 7.4% (v / v) hydrochloric acid dropwise to 1L of 100g / L sodium silicate solution while stirring until the pH value is 7.0, and stir for 5min to obtain a silica sol solution; Add 0.01 g of aluminum chloride to the silica sol solution, stir for 20 minutes, and obtain a mixed solution containing silica sol and silica-alumina sol; add deionized water to the mixed glue solution according to the volume of 1:1 to dilute and perform filtration and rinsing operations 3 times , remove the metal ions and acid radical ions in the mixed glue, and prepare the mixed sol of the condensed state; prepare a mixed solution containing 3g / L sodium carboxymethylcellulose and 2g / L β-cyclodextrin, and mix the sol in the condensed state Add 1 L of mixed solution of sodium carboxymethylcellulose and β-cyclodextrin to the sol, stir for 20 minutes, add 30 g / L sodium hydroxide solution dropwise ...

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Abstract

The invention discloses a method for preparing a silica and alumina sol type activator used for activating nonmetal materials. The silica and alumina sol type activator is composed of the silica and alumina sol, a silica sol, catalytic metal ions and water and has good stability; even if the activator is unstable to form the sol, the sol still has a regeneration capacity; after the activator is regenerated, activating capacity does not reduce; after an activating film formed by processing the sol type activator is dried, the activating film has strong activating capacity, good binding force with base materials and washing resistance; and the chemical plating of the nonmetal materials which are subject to the activating treatment has good performances. The activator prepared by the method of the invention can meet the requirements of the existing chemical plating on the activating technology.

Description

technical field [0001] The invention belongs to the field of chemical plating activation, in particular to a method for preparing a silica-alumina sol-type activation solution for activation treatment of non-metallic materials. Background technique [0002] The electroless plating process is a self-catalyzed chemical reaction process, and there is no problem of the thickness difference of the plating layer caused by the uneven current distribution in the electroplating process. Electroless plating technology has been widely used in almost every field of the national economy, making it known and developed as an important technical process. Electroless plating is a chemical treatment method that uses a reducing agent to selectively deposit metal ions in solution on the surface of a catalytically active substrate. Some metal materials, such as gold, silver, copper, nickel, palladium, platinum, etc., have catalytic activity for electroless plating, and other metal and non-metal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18
Inventor 胡光辉唐锋潘湛昌魏志钢徐慎颖
Owner GUANGDONG UNIV OF TECH