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Mutual non-solid-solution system metal infiltration process and device based ion implantation radiation damage

A technology of mutual insolubility and radiation damage, which is applied in the field of metal surface processing

Inactive Publication Date: 2011-08-03
TIANJIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Obviously, it is not feasible to use this method to prepare tungsten-silver composite metal materials for resistance spot welding electrodes.

Method used

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  • Mutual non-solid-solution system metal infiltration process and device based ion implantation radiation damage
  • Mutual non-solid-solution system metal infiltration process and device based ion implantation radiation damage
  • Mutual non-solid-solution system metal infiltration process and device based ion implantation radiation damage

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Embodiment Construction

[0057] The present invention is described in detail in conjunction with the embodiments and the accompanying drawings.

[0058] figure 1 It is a schematic diagram of silver ion implantation tungsten metal device, in which, 1-ion source, 2-ion beam, 3-implantation chamber, 4-tungsten metal sample, 5-target disc, 6-vacuum diffusion pump, 7-maintenance pump, 8- Mechanical pump, 9-high pressure and system control cabinet. The components of the ion implanter include ion source, vacuum implantation chamber, target plate, vacuum system, high voltage and control cabinet. Among them, the vacuum system is composed of a diffusion pump, a maintenance pump and a mechanical pump. The vacuum system is directly connected to the vacuum injection chamber through a valve; the target disk is located in the injection chamber; the ion source is located above the injection chamber and is obliquely opposite to the target disk. During implantation, the ion source is supplied with arc voltage, trigge...

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Abstract

The invention relates to a mutual non-solid-solution system metal infiltration process and device based ion implantation radiation damage. The process comprises the following steps of polishing and ultrasonic cleaning of pure tungsten metal, vacuum drying, silver metal plasma implantation, tungsten metal surface vacuum evaporation silver coating, vacuum drying, argon protection silver infiltration, hot-pressing infiltration supplementation, section scanning electron microscope (SEM) observation of a tungsten / silver composite metal material, section line scanning component analysis, Auger energy spectrum analysis of components along the material depth, welding strength test when the tungsten / silver composite metal material is used for spot-welding electrodes, and SEM observation of welding head tensile fractures. In the invention, a metal plasma implantation technology is utilized to combine with the vacuum evaporation technology, the high-temperature silver infiltration technology and the hot-pressing infiltration supplementation technology, thus silver metal is successfully infiltrated to the surface of a metal tungsten workpiece to prepare the tungsten / silver composite metal material. Test results show that when a tungsten / silver composite metal material electrode is utilized to carry out resistance spot welding on a silver metal interconnection sheet and an aerospace craft solar cell sheet, the single-spot welding strength is up to 450gf which excesses Chinese military standard and current enterprise standard, and the welding head tensile fractures is determined to be ductile fractures through SEM analysis.

Description

technical field [0001] The present invention relates to a metal surface processing technology, especially a metal infiltration process and device based on ion implantation and radiation damage. The mutual insolubility system here refers to the metal elements to be infiltrated and the metal elements of the workpiece. In the phase diagram, there is no solid solution and no alloy phase, such as tungsten-silver metal system. Specifically, it is a metal infiltration process and device based on ion implantation radiation damage mutually insoluble system for preparing tungsten / silver composite metal materials for resistance spot welding electrodes. Background technique [0002] Metal infiltration is a heat treatment process in which the workpiece is heated in a certain active medium to diffuse metal elements into the surface of the workpiece and change the chemical composition of the surface. [0003] Through the metal infiltration process, different structures and properties can ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/16C23C14/58C23C10/28C23C14/48C23C14/24
Inventor 黄远程保义孔德月呼文韬王玉林
Owner TIANJIN UNIV
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