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Lead-free solder for hot dipping of solar battery and preparation method thereof

A solar cell, lead-free solder technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of decreased product competitiveness and increased solder production costs, to improve utilization and improve surface quality. , the effect of good development prospects

Inactive Publication Date: 2011-08-17
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This alloy has excellent physical properties and high temperature stability, especially the eutectic alloy has good solder wettability, high strength and plasticity, and excellent thermal fatigue resistance, so it has become the first choice in various lead-free soldering processes Alternate solder, but Sn-Ag-Cu alloy has a higher Ag content, and the high price of silver directly leads to the increase of solder production cost and the decline of product competitiveness

Method used

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  • Lead-free solder for hot dipping of solar battery and preparation method thereof
  • Lead-free solder for hot dipping of solar battery and preparation method thereof
  • Lead-free solder for hot dipping of solar battery and preparation method thereof

Examples

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Effect test

example 1

[0019] Heat tin, bismuth and antimony with a purity of 99.99% in a mass ratio of 98.9:1.0:0.1 in a vacuum melting furnace under the protection of argon to 800°C for melting, and at the same time add magnetic stirring to make the alloy composition uniform, and then condense and solidify . Then the alloy is turned over and reheated to 500° C. to melt, and at the same time, it is magnetically stirred and water-cooled, so that the Sn-1%Bi-0.1%Sb lead-free solder is obtained by repeating this at least four times. Its microstructure is as figure 1 As shown, the matrix is ​​in the β-Sn phase, and the particles are in the SnSb phase. This alloy has high electrical conductivity, fine structure, good ductility, and a melting point of about 206°C.

example 2

[0021] Heat tin, bismuth and antimony with a purity of 99.99% in a mass ratio of 93.5:4:2.5 in a vacuum melting furnace under the protection of argon to 800°C for melting, and at the same time add magnetic stirring to make the alloy composition uniform, and then water-cool and solidify . Then the alloy is turned over and reheated to 500° C. to melt, and at the same time, it is magnetically stirred and water-cooled, so that the Sn-4%Bi-2.5%Sb lead solder is obtained by repeating this for at least four times. Its microstructure is as figure 2 As shown, the matrix is ​​β-Sn phase, the particles are SnSb phase, and the white particles are Bi particles. The alloy has a lower melting point, higher microhardness and tensile strength. The addition of Bi reduces the melting point of the alloy to about 190°C, which has excellent wettability, and Sb makes the alloy have better tensile properties.

example 3

[0023] The tin, bismuth, antimony, and silver with a purity of 99.99% are heated to 800°C in a vacuum melting furnace under the protection of argon in a mass ratio of 96.5:2:1.5, and are magnetically stirred at the same time to make the alloy composition uniform, and then The water freezes. Then the alloy is turned over and reheated to 500° C. to melt, and at the same time, it is magnetically stirred and water-cooled, so that the Sn-2%Bi-1.5%Sb lead-free solder is obtained by repeating this at least four times. Its microstructure is as image 3 As shown, the dark gray particles are the SnSb phase, and the white enriched regions are Bi. This alloy has moderate wettability, superior tensile properties, good ductility, and high electrical conductivity.

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Abstract

The invention relates to a lead-free solder for hot dipping of a solar battery and a preparation method thereof. The lead-free solder contains a Sn-Bi-Sb lead-free solder with the purity of 99.99% and the Sn: Bi: Sb mass ratio of (98.9 to 93.5): (1 to 4): (0.1 to 2.5), wherein In 0 to 3 wt%, Ag 0 to 0.5 wt%, Zn 0 to 2 wt%, Cu 0 to 2 wt%, Al 0 to 1 wt%, rear earth elements 0 to 1 wt%, and P 0 to 1 wt% are added into the Sn-Bi-Sb lead-free solder. Using Sb used as the substitute of Ag can greatly reduce the cost of the solder alloy, keep the advantages of the conventional Sn-Pb solder, improve the utilization rate of the solder, save the material, and improve the weldability. The surface quality is improved by plating tin on a copper sheet so as to improve the production level and the product quality of a solar battery to a new level. The high-performance solder alloy has a good development prospect when being taken as a studying object to strive for meeting the industrial application requirement.

Description

technical field [0001] The invention relates to low-cost, high-performance tin-bismuth-antimony-based lead-free solder for thermal dipping of solar cells, which belongs to the lead-free electronic packaging technology. Background technique [0002] Solar energy is an inexhaustible clean energy source. At present, the main way to convert solar energy into electrical energy is solar cells. All countries in the world generally attach importance to and develop solar energy. This is an important development strategy. Since the beginning of the 21st century, global solar cell production has grown rapidly, and China's solar cell production has continued to expand rapidly. In 2009, China's solar cell production ranked first in the world, estimated to exceed 40% of the world's total. Encapsulation is a key step in solar cells, and a good encapsulation process can ensure the life of the battery and enhance the resistance of the battery. The copper sheet used as the busbar needs to be...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40
Inventor 刘永长董明杰高志明余黎明
Owner TIANJIN UNIV
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