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Copper foil for processing copper clad laminate, copper clad laminate and printed wiring board equipped with copper clad laminate

A technology of copper clad laminates and copper foils, applied in printed circuit parts, layered products, metal layered products, etc., can solve the problems of reduced peel strength, less penetration, circuit peeling, and falling off, and achieve peel strength. The effect of reducing the deterioration rate, high industrial applicability, and strong peel strength

Active Publication Date: 2011-10-12
FUKUKA METAL FOIL & POWDER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the manufacture of printed wiring boards, there is a step of etching the treated copper foil in order to form a copper circuit, and when the amount of roughening treatment of the treated copper foil is large, etching residues (dissolved roughened particles remaining) will be generated. , Etching factor reduction and other defects. Therefore, in order to improve the peel strength characteristics, the amount of roughening treatment cannot be excessively increased to improve the surface roughness. In particular, with the thinner and smaller electronic devices, fine pitch Therefore, it is necessary to suppress the occurrence of etching residue as much as possible. Therefore, it is an effective method to reduce the amount of roughening treatment and reduce the surface roughness of the foil surface.
[0006] That is, for the treated copper foil provided with a roughening treatment layer for printed wiring boards, it is necessary to increase the amount of roughening treatment to improve the surface roughness from the perspective of peel strength characteristics, and from the perspective of etching characteristics It is necessary to reduce the amount of roughening treatment to reduce the surface roughness, so it is difficult to satisfy these two characteristics
[0007] However, in the printed wiring board manufacturing process, there are various processes such as cleaning processes using sulfuric acid, hydrochloric acid, and caustic soda, tin plating processes, electroless nickel plating processes, and electroless gold plating processes, including etching processes using etching solutions. Multiple steps of active treatment liquid, when the peel strength of the treated copper foil is weak, the active treatment liquid penetrates from the bonding interface between the treated copper foil and the insulating resin base material, which is likely to cause a reduction (deterioration) of the peel strength, If the peeling strength is reduced, in the printed wiring board manufactured, especially in the printed wiring board with fine pitch, the peeling and falling off of the circuit caused by thermal shock and mechanical shock will easily occur. Treated copper foil that does not decrease in peel strength after liquid immersion and has little infiltration

Method used

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  • Copper foil for processing copper clad laminate, copper clad laminate and printed wiring board equipped with copper clad laminate
  • Copper foil for processing copper clad laminate, copper clad laminate and printed wiring board equipped with copper clad laminate
  • Copper foil for processing copper clad laminate, copper clad laminate and printed wiring board equipped with copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0122] Under the following electrolyte composition, additives, electrodes, liquid temperature, and electrolytic conditions, untreated electrolytic copper foil was produced.

[0123] (Manufacturing method of untreated electrolytic copper foil)

[0124] Adjust the sulfuric acid-copper sulfate aqueous solution that sulfuric acid is 100g / L, copper sulfate pentahydrate to 280g / L, and add as additives: 20mg / L polyethylene glycol (average molecular weight: 20000; Sanyo Chemical Co., Ltd. manufacture), 20mg / L polyethylene glycol Ethyleneimine (trade name: Epomin (ェポミン); product code: PP-061; average molecular weight: 1200; manufactured by Nippon Shokubai Co., Ltd.), 6 μmol / L sodium 3-mercapto-1-propanesulfonate, 20 mg / L chloride ion . The electrolyte solution containing the additive is filled between the insoluble anode made of titanium coated with platinum metal oxide and the titanium cathode roll as the cathode, and the current density is 50A / dm 2 , A current was passed at a liqui...

Embodiment 2～6 and comparative example 1～6

[0139] (untreated electrolytic copper foil)

[0140] The same untreated electrodeposited copper foil as used in Example 1 was used.

[0141] (first stage coarsening layer)

[0142] According to table 1, change the concentration of each additive added in the electrolytic solution that forms the first stage roughening treatment layer, change the current density and the electric quantity, in addition, adopt the same conditions and methods as the foregoing embodiment 1 to obtain The first stage coarsens the layer.

[0143] (Second stage coarsening layer)

[0144] According to the same electrolyte composition, liquid temperature, electrodes, and electrolysis conditions as in Example 1, the second-stage roughening treatment layer is set.

[0145] (chromate layer)

[0146] According to the same electrolyte composition, liquid temperature, pH, electrodes, and electrolysis conditions as in Example 1, a chromate layer was set.

[0147] (silane coupling agent layer)

[0148] Accord...

Embodiment 7

[0182] (untreated electrolytic copper foil)

[0183] The same untreated electrodeposited copper foil as used in Example 1 was used.

[0184] (first stage coarsening layer)

[0185]According to the same electrolyte composition, additives, liquid temperature, electrodes, and electrolysis conditions as in Example 3, the first-stage roughening treatment layer is set.

[0186] (Second stage coarsening layer)

[0187] According to the same electrolyte composition, liquid temperature, electrodes, and electrolysis conditions as in Example 1, a second-stage roughening treatment layer is set.

[0188] Next, in accordance with the electrolyte composition, liquid temperature, pH, electrodes, and electrolysis conditions shown below, the surface of the aforementioned second stage roughened layer is roughened, and a nickel layer containing molybdenum is applied.

[0189] (nickel layer containing molybdenum)

[0190] Adjust nickel sulfate hexahydrate to 45g / L, disodium molybdenum (VI) dih...

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Abstract

The invention provides a treatment copper foil, which is low in roughness and high in peeling strength with an insulating resin substrate. After an absorption treatment, an active processing liquid after being impregnated is low in deterioration rate of the peeling strength, less in penetration amount and excellent in etching property. The copper foil is characterized in that the surface of the copper foil is sequentially equipped with a roughening treatment layer, a chromate layer and a silane coupling agent layer. The ten-point average roughness Rz of the copper foil surface is 1.0 mu m to 2.7 mu m. Meanwhile, the average interval S of local peaks is below 0.0230 mm and S does not include 0.

Description

technical field [0001] The present invention relates to a treated copper foil for a copper-clad laminate, a copper-clad laminate obtained by bonding the treated copper foil to an insulating resin base material, and a printed wiring board using the copper-clad laminate. Copper laminates are suitable as printed wiring board materials used in electronic equipment. Background technique [0002] As is well known, in rolled copper foil and electrolytic copper foil used for printed wiring boards, various treatment layers such as roughening treatment layer, heat-resistant treatment layer, and rust-proof treatment layer are provided according to the use of the copper foil (hereinafter referred to as Copper foil with a treated layer is called "treated copper foil", and copper foil without a treated layer is called "untreated copper foil"). [0003] In addition, for the processed copper foil used in the printed wiring board which is a representative application of the copper-clad lami...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/09B32B9/04B32B15/20
Inventor 真锅久德冈本健
Owner FUKUKA METAL FOIL & POWDER CO LTD
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