Method for preparing tungsten copper alloy wire materials by using hot-swage technology

A tungsten-copper alloy and hot swaging technology, which is used in metal/alloy conductors, manufacturing tools, metal processing equipment, etc. The production cost is reduced and the preparation process is simple.

Inactive Publication Date: 2011-10-26
SHANXI LIGONG MECHANICAL & ELECTRICAL TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to overcome the defects of the above-mentioned prior art, the object of the present invention is to provide a method for preparing tungsten-copper alloy wire by hot swaging technology, which solves the problem of complex process and high production cost of preparing slender tungsten-copper materials in the prior art. question

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  • Method for preparing tungsten copper alloy wire materials by using hot-swage technology

Examples

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Embodiment 1

[0017] Wires of tungsten-copper alloy W70Cu30 with a diameter of 3 mm, a length of 300 mm, and a weight percentage of 70 and 30 were prepared.

[0018] This embodiment includes the following steps:

[0019] Step 1, ingredients: first weigh 20 grams of copper powder, 35 grams of tungsten powder, the particle size of the copper powder is 74 μm, and the particle size of the tungsten powder is 6 μm, and then add 6.05 ml of 11wt% of the total weight of the copper powder and the tungsten powder Glycerin was used as an additive, and the mixture was stirred mechanically for 6 hours;

[0020] Step 2, molding: put the viscous liquid mixed in step 1 with a certain fluidity into the cavity of a graphite mold with a diameter of 10 mm and a length of 200 mm at a high speed of 10 m / s;

[0021] Step 3, sintering: put the blank in step 2 together with the graphite mold in the vacuum sintering furnace, the vacuum degree is not more than 10 -2 Pa, temperature 1700±10°C, hold for 1.5 hours for ...

Embodiment 2

[0026] Wires of tungsten-copper alloy W85Cu15 with a diameter of 2 mm and a length of 400 mm and a weight percent of 85 and 15 were prepared.

[0027] This embodiment includes the following steps:

[0028] Step 1, ingredients: First weigh 11.25 grams of copper powder, 29.75 grams of tungsten powder, the particle size of the copper powder is 74 μm, and the particle size of the tungsten powder is 5 μm, and then add 4.92 ml of 12 wt% of the total weight of the copper powder and tungsten powder Glycerin is used as an additive, and the common stirring machine is mixed for 4 hours;

[0029] Step 2, molding: put the viscous liquid mixed in step 1 with a certain fluidity into the cavity of a graphite mold with a diameter of 10 mm and a length of 200 mm at a high speed of 10 m / s;

[0030] Step 3, sintering: put the blank in step 2 together with the graphite mold in the vacuum sintering furnace, the vacuum degree is not more than 10 -2 Pa, temperature 1800±10°C, hold for 2 hours for s...

Embodiment 3

[0035] A wire of tungsten-copper alloy W80Cu20 with a diameter of 3 mm and a length of 500 mm is prepared.

[0036] This embodiment includes the following steps:

[0037]Step 1, ingredients: first weigh 15 grams of copper powder, 40 grams of tungsten powder, the particle size of the copper powder is 74 μm, and the particle size of the tungsten powder is 4 μm, and then add 8.25 ml of 15wt% of the total weight of the copper powder and the tungsten powder Glycerol was used as an additive, and the stirring machine was mixed together for 5 hours;

[0038] Step 2, molding: put the viscous liquid mixed in step 1 with a certain fluidity into the cavity of a graphite mold with a diameter of 10 mm and a length of 200 mm at a high speed of 8 m / s;

[0039] Step 3, sintering: put the blank in step 2 together with the graphite mold in the vacuum sintering furnace, the vacuum degree is not more than 10 -2 Pa, temperature 1750±10°C, hold for 1.8 hours for sintering;

[0040] Step 4. Infilt...

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Abstract

The invention discloses a method for preparing tungsten copper alloy wire materials by using hot-swage technology, comprising the following steps: weighing copper powder, tungsten powder and weighing glycerol as additive by weight percentage, mechanically mixing the three ingredients; putting the mixed viscous fluid with a certain fluidity in a graphite die; pre-buring in a vacuum sintering furnace; sintering the infiltrated copper in the furnace under the protection of hydrogen or helium; finally processing by hot-swage and centerless grinding to obtain wire materials with a certain diameter and random lengths. The invention has the advantages of simple technology, convenient operation, low cost, and stable performace, high quality and high yield of the products, solves the problems of complicate technology and high cost of preparing slender tungsten copper material existed in the prior art, and can be widely used in material processing of electrode, LED lamp and plasma.

Description

technical field [0001] The invention belongs to the technical field of new material manufacture, and in particular relates to a method for preparing tungsten-copper alloy wires by hot swaging technology for electrodes, LED lamps and plasmas. Background technique [0002] Tungsten copper alloy is widely used as electrode material, electronic packaging and electrical contact material because of its good electrical conductivity, thermal conductivity and arc corrosion resistance. When used as an electrode, it is often required to have a diameter of about 3mm, and the longer the length, the better. Now In the prior art, the preparation of tungsten-copper alloy wire is generally molded and pressed by cold isostatic pressing equipment to form a rod several times larger than required, and then sintered and then machined to obtain the required alloy wire. At present, because tungsten-copper alloy is a pseudo-alloy, coupled with the high hardness and high melting point of tungsten, it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21C37/04B22F1/00B22F3/16B21J7/16H01B13/00H01B1/02H01B5/02
Inventor 陈文革罗晓东张敏
Owner SHANXI LIGONG MECHANICAL & ELECTRICAL TECH
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