II-VI-group diluted oxide semiconductor thin film solar cell
A technology of oxide semiconductor and thin-film solar cells, applied in semiconductor devices, circuits, photovoltaic power generation, etc., can solve the problem of high optical loss
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Embodiment 1
[0024] 1. ZnSe substrate (S1) pretreatment
[0025] Firstly, the ZnSe wafer (S1) was cleaned with trichlorethylene, acetone, and methanol, blown dry with nitrogen, and then placed in the MBE deposition chamber with BCl 3 (99.999%) plasma etching (power density 1W / cm 2 ), and finally in a vacuum environment for 600 0 C, heat treatment for 10 minutes.
[0026] 2. Deposition of PIN structures
[0027] Substrate (S1) temperature 275 0 C, n-ZnSe:Cl(N) grown by molecular beam epitaxy with a carrier concentration of 1×10 18 / cm 3 , with a thickness of 1000 nm; then deposited a layer of ZnSeO with a thickness of 1000 nm and an atomic percentage of oxygen of 3%; then deposited p-ZnSe:N(P) with a carrier concentration of 1×10 18 / cm 3 , with a thickness of 100 nm.
[0028] 3. Deposition of transition layer (B)
[0029] Subsequently, the transition layer ZnTe is sequentially grown in the deposition chamber 0.1 Se 0.9 and HgSe thin film (B), the thickness of the former ...
Embodiment 2
[0033] 1. ZnSe substrate (S1) pretreatment
[0034] Firstly, the ZnSe wafer (S1) was cleaned with trichlorethylene, acetone, and methanol, blown dry with nitrogen, and then placed in the deposition chamber with BCl 3 (99.999%) plasma etching (power density 1W / cm 2 ), and finally vacuum environment for 600 0 C, heat treatment for 10 minutes.
[0035] 2. Deposition of PIN structures
[0036] Substrate (S1) temperature 275 0 C, The heavily doped layer n-ZnSe:Cl(N) was grown by molecular beam epitaxy, and the carrier concentration was 1×10 18 / cm 3 , with a thickness of 500 nm, followed by a lightly doped layer of n-ZnSe:Cl(N) with a carrier concentration of 1×10 17 / cm 3 , with a thickness of 500 nm; then deposit the intrinsic layer ZnSeO(I) with a thickness of 1000 nm and an atomic percentage of oxygen of 6%; then deposit a lightly doped layer of p-ZnSe:N(P) with a carrier concentration of 4 ×10 17 / cm 3 , with a thickness of 100 nm, followed by a heavily doped lay...
Embodiment 3
[0042] 1. ZnSe substrate (S1) pretreatment
[0043] Firstly, the ZnSe wafer (S1) was cleaned with trichlorethylene, acetone, and methanol, blown dry with nitrogen, and then placed in the deposition chamber with BCl 3 (99.999%) plasma etching (power density 1W / cm 2 ), and finally vacuum environment for 600 0 C, heat treatment for 10 minutes.
[0044] 2. Deposition of PIN structures
[0045] Substrate (S1) temperature 275 0 C, The heavily doped layer n-ZnSe:Cl(N) was grown by molecular beam epitaxy, and the carrier concentration was 1×10 18 / cm 3 , with a thickness of 500 nm, followed by a lightly doped layer of n-ZnSe:Cl(N) with a carrier concentration of 1×10 17 / cm 3 , with a thickness of 500 nm; then deposit the intrinsic layer ZnSeO(I) with a thickness of 1000 nm and an atomic percentage of oxygen of 6%; then deposit p-ZnSe:N(P) with a carrier concentration of 7×10 17 / cm 3 , with a thickness of 100 nm.
[0046] 3. Deposition of transition layer (B)
[0047]...
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