A kind of preparation method of porous cathode substrate
A porous cathode and substrate technology, which is applied in the field of powder metallurgy, can solve the problems of high cost, low material utilization rate, and long cycle, and achieve the effects of overcoming the influence of harmful impurities, improving electron emission performance, and high material utilization rate
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0017] The Fischer particle size of the tungsten powder is 4-6 μm, and the metal impurity content is less than 0.01%. The adhesive used is a wax-based adhesive. According to the proportion of powder volume fraction of 52%, the powder and binder are mixed on a disc high shear force mixer, the mixing temperature is 160 ℃, and the time is 2 hours, so that the binder and powder particles are mixed and dispersed uniform. The binder and powder mixture are further mixed on a twin-screw extruder and made into pelletized feed. The feed material is shaped on an injection molding machine to obtain a shaped blank. Dissolve and remove the soluble components such as paraffin wax and polystyrene in trichlorethylene, and the solvent degreasing time is 4 hours. After solvent degreasing, remove the remaining binder by heating and decomposing. The thermal decomposing temperature is from room temperature to 600°C. The binder is removed by a certain heating system, while avoiding the occurrence...
Embodiment 2
[0019] The Fischer particle size of the tungsten powder is 1-2 μm, and the metal impurity content is less than 0.01%. The spherical tungsten powder is obtained after the tungsten powder is treated with plasma spheroidization equipment. The binder used is a wax-based binder. According to the proportion of spherical tungsten powder with a volume fraction of 65%, the powder and binder are mixed on a disc high-shear mixer, and the mixing temperature is 160°C. , the time is 2 hours, so that the binder and the powder particles are mixed and dispersed evenly. The binder and powder mixture are further mixed on a twin-screw extruder and made into pelletized feed. The feed material is shaped on an injection molding machine to obtain a shaped blank. Dissolve and remove the soluble components such as paraffin wax and polystyrene in trichlorethylene, and the solvent degreasing time is 6 hours. After solvent degreasing, remove the remaining binder by heating and decomposing. The thermal d...
Embodiment 3
[0021] The tungsten powder with a mass fraction of 80% and a Fischer particle size of 4-6 μm and the iridium powder with a mass fraction of 20% and a Fischer particle size of 8-10 μm are ball milled and mixed for 240 minutes to obtain uniformly mixed raw material powder. According to the powder volume fraction of 55%, the binder and the powder are mixed on a disc high-shear mixer, the mixing temperature is 160 ° C, and the time is 2 hours, so that the binder and the powder particles are mixed and dispersed evenly. The binder and powder mixture are further mixed on a twin-screw extruder and made into pelletized feed. The feed material is shaped on an injection molding machine to obtain a shaped blank. Dissolve and remove the soluble components such as paraffin wax and polystyrene in trichlorethylene, and the solvent degreasing time is 6 hours. After solvent degreasing, remove the remaining binder by heating and decomposing. The thermal decomposing temperature is from room temp...
PUM
Property | Measurement | Unit |
---|---|---|
particle size | aaaaa | aaaaa |
particle size | aaaaa | aaaaa |
particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com