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Thermosetting double-sided adhesive film with excellent adhesive properties and heat resistance

A technology of adhesive performance and adhesive film, applied in the direction of film/sheet adhesive, adhesive type, heat-activated film/sheet, etc., can solve the problems of interface peeling, popcorn bursting, etc., and achieve Effects of preventing peeling of the interface, excellent adhesive performance and heat resistance

Active Publication Date: 2011-12-28
TORAY ADVANCED MATERIALS KOREA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, although conventional solder has a low melting point of about 220°C, since current lead-free solders have a higher melting point of about 260°C, water content absorbed inside the package may pass through processing at such high temperatures. High water vapor pressure during the high temperature, which in turn can cause problems such as popcorn popping of the package or delamination of the interface

Method used

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  • Thermosetting double-sided adhesive film with excellent adhesive properties and heat resistance
  • Thermosetting double-sided adhesive film with excellent adhesive properties and heat resistance
  • Thermosetting double-sided adhesive film with excellent adhesive properties and heat resistance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041]First, 50 parts by weight of novolac epoxy resin (epoxy equivalent 199), 150 parts by weight of phenolic resin represented by the following structural formula 1, and 10 parts by weight of hexamethoxymethylmelamine and 10 parts by weight of o-phthalic acid as curing agent Diformic anhydride was added to 120 parts by weight of NBR (containing 27% by weight of acrylonitrile and 5% by weight of carboxyl groups). Then 2 parts by weight of dicumyl peroxide as a rubber crosslinking agent was added, and by using an acetone solvent, the amount of acetone was adjusted so that the viscosity became 400CPS. After all the components in the solution prepared above were dissolved at room temperature, this adhesive solution was coated on both sides of a polyimide film having a thickness of 25 μm so that the thickness after drying was 12 μm. After a drying step (drying at 150° C. for 3 minutes), a polyethylene terephthalate film having a thickness of 38 μm was laminated thereon to prepare...

Embodiment 2

[0045] In the same manner as in Example 1, an adhesive solution prepared from the same composition as in Example 1 was used to manufacture an adhesive film, except that the phenolic resin shown in the following structural formula 2 was used instead of the phenolic resin used above. .

[0046] (Structural formula 2, softening point: 85°C)

[0047]

Embodiment 3

[0049] In the same manner as in Example 1, an adhesive solution prepared from the same composition as in Example 1 was used to manufacture an adhesive film, except that the phenolic resin shown in the following structural formula 3 was used instead of the phenolic resin used above. .

[0050] (Structure 3)

[0051]

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Abstract

The invention provides a thermosetting double-sided adhesive film having excellent adhesive property and heat resistant property, which is used for fixing a lead space without electrical interference so as to realize the bonding of stacked barechips. Meanwhile, the exfoliation or the popcorn type bursting of interfaces due to the high steam pressure of water internal content absorbed inside a package during the high-temperature processing process is also avoided. The thermosetting double-sided adhesive film is the adhesive film of an adhesive layer coated on the two sides of a polyimides film arranged between barechips, wherein for each 100 parts by weight of a solution containing 1-10 % by weight carboxyl NBR, the adhesive layer comprises 5-200 parts by weight of epoxy resin, 50-200 parts by weight of a phenolic resin and 2-40 parts by weight selected from the group consisting of amine or, anhydride curing agent in one or more curing agent. Measured by the universal method, the softening point of the phenolic-resin is 60-120 DEG C.

Description

technical field [0001] The present invention mainly relates to an adhesive film for stacked CSP (chip scale package), more particularly, the present invention relates to a thermosetting double-sided adhesive having excellent adhesive properties and heat resistance film, the double-sided adhesive film is a double-sided adhesive film used to fix the wire space to prevent electrical interference and provide adhesion between dies to be stacked, which has excellent adhesive performance and resistance Thermal, and it can prevent problems such as interfacial peeling or popcorn cracking phenomenon of the package caused by high water vapor pressure of the water content absorbed inside the package during high temperature processing. Background technique [0002] Recently, with the new trend of high integration and miniaturization of semiconductor chips, CSP (Chip Scale Package) has been developed. As can be noticed from its name, in such a chip scale package, the chip size is conside...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J163/04C09J113/00H01L23/29
CPCH01L2924/15311H01L2224/32145H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/00014H01L2924/00C09J7/25C09J7/35C09J9/00C09J161/00C09J163/00C09J2203/326C09J2301/304C09J2301/40
Inventor 金佑锡金相弼文基祯申铉民黄湳翊
Owner TORAY ADVANCED MATERIALS KOREA
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