Epoxy structure adhesive for rotor blades and preparation method thereof
A technology of epoxy structural glue and wind rotor blades, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of high brittleness, severe curing heat release, and severe curing heat release of epoxy resin adhesive. Achieve the effects of low exothermic peak temperature, high toughness and long operating period
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Embodiment 1
[0029] Accurately weigh the following raw materials, bisphenol A epoxy resin 58g, bisphenol F epoxy resin 10g, hyperbranched polyurethane acrylate CN968 5g, fumed silicon 12g, triphenylphosphine oxide 5g, 1,4- Butanediol diglycidyl ether 10g, the above-mentioned components are sequentially added into the dual planetary power mixing mixer, vacuumed to -0.1MPa, the rotation speed is 1000 revolutions per minute, and the revolution speed is 10 revolutions per minute. Stir for 1.5 hours to obtain component A, mix evenly to obtain component A of the epoxy resin adhesive, pack and place it for use; mix curing agents such as 3g of diethylenetriamine, 42g of isophoronediamine, 37g of polyetheramine, bis Mix 13g of (4-amino-3-methylcyclohexyl)methane and 5g of thixotropic agent such as fumed silicon evenly to obtain component B of the epoxy resin adhesive, which is packaged and placed for use.
[0030] The hyperbranched urethane acrylate is a highly branched three-dimensional dendritic ...
Embodiment 2
[0036] Accurately weigh the following raw materials, bisphenol A epoxy resin 50g, bisphenol F epoxy resin 10g, hyperbranched polyurethane acrylate CN968 10g, fumed silicon 18g, triphenylphosphine oxide 2g, 1,4-butyl Diol diglycidyl ether 10g, the above-mentioned components are sequentially added into the double planetary power mixing mixer, vacuumed to -0.1MPa, under the condition that the rotation speed is 1000 rpm and the revolution speed is 8 rpm, mechanically Stir for 2 hours to obtain component A, mix evenly to obtain component A of the epoxy resin adhesive, pack and place it for use; mix curing agents such as 3g of N-aminoethylpiperazine, 39g of isophoronediamine, polyetheramine 37g, 13g of bis(4-amino-3-methylcyclohexyl)methane, and 8g of a thixotropic agent such as fumed silicon are mixed evenly to obtain component B of the epoxy resin adhesive, which is packaged and placed for use.
[0037] When in use, mix the prepared component A and component B uniformly at a weight ...
Embodiment 3
[0039] Accurately weigh the following raw materials, bisphenol A epoxy resin 50g, bisphenol F epoxy resin 10g, hyperbranched polyurethane acrylate CN9006 2g, fumed silicon 23g, resorcinol 10.5g, 1,6-hexyl Diol diglycidyl ether 9.5g, add the above-mentioned components into the double planetary power mixing mixer in turn, vacuumize to -0.1MPa, under the condition that the rotation speed is 1000 rpm and the revolution speed is 10 rpm, Mechanically stirred for 2 hours to obtain component A, mixed evenly to obtain component A of the epoxy resin adhesive, packaged and placed for use; curing agents such as isophorone diamine 42g, polyetheramine 32g, bis(4-aminocyclic Hexyl)methane 7g, diaminodiphenylmethane 9g, and thixotropic agent such as fumed silicon 10g are mixed evenly to obtain the B component of the epoxy resin adhesive, which is packaged and placed for use.
[0040] When in use, mix the prepared component A and component B uniformly at a weight ratio of 100:49.5, cure at 68°...
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