Method for electroplating plastic base material
A plastic base material and base material technology, applied in the field of plastic surface treatment, can solve the problems of wasting water resources, large environmental pollution, and polluting the natural ecological environment, so as to reduce the discharge of waste water, reduce the harm to the environment and human beings, and reduce discharge Effect
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Embodiment 1
[0034] (1) Implement dry cleaning method to degrease and decontaminate plastic substrates
[0035] Implement dry cleaning method on ABS plastic substrate, adopt plasma flame treatment and then conduct electrostatic treatment to remove oil and dust on the surface of ABS plastic substrate;
[0036] (2) PVD (Physical Vapor Deposition) metallization of plastic substrates
[0037] PVD (Physical Vapor Deposition) metallization is carried out on the ABS plastic substrate, and PVD plasma modification, metal plating bottom layer, metal transition layer and metal conductive layer are carried out in sequence. The plasma modification process conditions are ion source current 0.5A, bias voltage 80V, duty cycle 80%, argon flow rate 50SCCM, oxygen flow rate 50SCCM, vacuum pressure in the furnace 0.2Pa, activation time 5min to achieve the purpose of cleaning and activating the surface of the substrate, metal-plated bottom layer, metal transition layer and metal conductive layer are Using a h...
Embodiment 2
[0054] (1) Implement dry cleaning method to degrease and decontaminate plastic substrates
[0055] Implement dry cleaning method on the plastic substrate, and use hydrocarbon vacuum cleaning to remove oil and dust on the surface of the plastic substrate;
[0056] (2) PVD (Physical Vapor Deposition) metallization of plastic substrates
[0057] Perform PVD (Physical Vapor Deposition) metallization on plastic substrates, and sequentially implement PVD plasma modification, metal plating bottom layer, metal transition layer and metal conductive layer. The plasma modification process conditions are ion source current 0.4A, bias voltage 100V , the duty cycle is 70%, the argon flow rate is 50SCCM, the oxygen flow rate is 80SCCM, the vacuum pressure in the furnace is 0.3Pa, and the activation time is 6min to achieve the purpose of cleaning and activating the substrate surface. High-power medium-frequency pulse power supply, metal-plating bottom current is 300 amperes, voltage is 500 v...
Embodiment 3
[0075] (1) Implement dry cleaning method to degrease and decontaminate plastic substrates
[0076] Implement dry cleaning method on the plastic substrate, use dry ice degreasing treatment and then conduct electrostatic treatment to remove oil and dust on the surface of the plastic substrate;
[0077] (2) PVD (Physical Vapor Deposition) metallization of plastic substrates
[0078] Perform PVD (Physical Vapor Deposition) metallization on plastic substrates, and sequentially implement PVD plasma modification, metal plating bottom layer, metal transition layer and metal conductive layer. The plasma modification process conditions are ion source current 0.5A, bias voltage 80V , the duty cycle is 80%, the argon flow rate is 80SCCM, the oxygen flow rate is 80SCCM, the vacuum pressure in the furnace is 0.2Pa, and the activation time is 8min to achieve the purpose of cleaning and activating the substrate surface. High-power intermediate frequency pulse power supply, metal plating bott...
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