Epoxy resin composition with hydrated alumina

A technology of hydrated alumina and epoxy resin, used in electrical components, circuits, electrical solid devices, etc., can solve the problems of reducing moisture resistance, fluidity, reliability, etc., and achieve the effect of excellent solder resistance

Active Publication Date: 2012-03-21
江苏中科科化新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the above flame retardant technology, the method of adding inorganic phosphorus and organic phosphine compounds will reduce the moisture resistance and cause a decrease in reliability. The use of metal hydroxides will cause a decrease in fluidity and mold release, and increasing the proportion of fillers will also lead to fluidity. falling problem
[0005] In addition, when aluminum hydroxide is added as a flame retardant in the semiconductor packaging material, due to the low thermal decomposition temperature of aluminum hydroxide, aluminum hydroxide releases water during the semiconductor infrared reflow soldering process, resulting in the separation of the package body and the lead frame. Floor
When magnesium hydroxide is used as a flame retardant, its high temperature resistance can meet the requirements, but due to its poor acid resistance, when the semiconductor package is molded through the immersion plating process, the magnesium hydroxide in the packaging material reacts with the acidic medium in the plating solution resulting in a change in color on the surface of the material

Method used

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  • Epoxy resin composition with hydrated alumina
  • Epoxy resin composition with hydrated alumina

Examples

Experimental program
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Effect test

Embodiment 1

[0038] O-cresol novolac epoxy resin A1 ("N-660" manufactured by DIC Corporation of Japan) 14wt%

[0039] Phenol novolac resin B1 ("TD-2131" manufactured by DIC Corporation of Japan) 6.56wt%

[0040] 2-Methylimidazole C1 0.05wt%

[0041] 1,8-diazabicyclo(5,4,0)undecene-7C2 0.45wt%

[0042] Silica powder D (d50 is 25um) 61.95wt%

[0043] Alumina monohydrate E (d50 is 2um) 12.62wt%

[0044] Carnauba wax 0.85wt%

[0045] γ-Glycidylpropyl ether trimethoxysilane 0.63wt%

[0046] Zinc borate (d50 is 1um) 0.43wt%

[0047] Bismuth oxide chelate 0.13wt%

[0048] Carbon black 0.66wt%

[0049] Liquid silicone oil 1.67wt%

[0050] After weighing and mixing according to the above ratio, melt and knead evenly on a double-roller mixer preheated at a temperature of 70-100°C, remove the uniformly mixed material from the double-roller mixer, cool naturally, and pulverize The powdery material was obtained, preformed into a cake, and the epoxy resin composition molding material was obtained...

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PUM

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Abstract

The invention relates to a resin for semiconductor packaging, and particularly to an epoxy resin composition which can improve soldering resistance of an epoxy resin composition molding material and comprises hydrated alumina (molecular formula AlOOH. The epoxy resin composition comprises the following components according to the following content: 3-14wt% of epoxy resin, 2.5-9wt% of phenolic resin, 0.05-0.5wt% of curing accelerator, 57-89.5wt% of silicon oxide, 0.5-21wt% of hydrated alumina, 0.1-1.5wt% of mold lubricant, and 0.3-1.5wt% of silane coupling agent. The epoxy resin composition with hydrated alumina according to the invention is a semiconductor packaging material with high soldering resistance. Simultaneously the epoxy resin composition has the following advantages: necessary fluidity, necessary moldability, necessary flame resistance and necessary mechanical properties.

Description

technical field [0001] The invention relates to a resin for semiconductor encapsulation, in particular to an epoxy resin composition containing aluminum oxide monohydrate (molecular formula AlOOH), which can improve the solder resistance of the molding material of the epoxy resin composition. Background technique [0002] In recent years, due to environmental protection requirements, the solder used in the installation of semiconductor integrated circuits or discrete devices is being promoted to be "lead-free". Correspondingly, the infrared reflow temperature of soldering has become higher, requiring packaging materials to have higher solder resistance; at the same time , The bromine-antimony flame retardant system in the traditional epoxy resin composition for semiconductor packaging will no longer be used, and it will be replaced by an environmentally friendly flame retardant technology. [0003] In response to the above-mentioned needs, there are methods using red phospho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L63/04C08L63/00C08L61/08C08L61/12C08K13/02C08K3/36C08K3/22H01L23/29
Inventor 王善学李刚卢绪奎包昀鑫王冰冰李海亮蔺力
Owner 江苏中科科化新材料股份有限公司
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