Two-layer micrometering bolometer and manufacturing method thereof

A microbolometer and double-layer technology, which is applied in the field of uncooled terahertz detection, can solve the problems such as changes in electrical properties of thermistor materials, unevenness, and effects on device performance.

Active Publication Date: 2012-03-28
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Inhomogeneous temperature will lead to inhomogeneous changes in the electrical properties of the thermistor material (such as vanadium oxide) in the lower bridg

Method used

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  • Two-layer micrometering bolometer and manufacturing method thereof
  • Two-layer micrometering bolometer and manufacturing method thereof
  • Two-layer micrometering bolometer and manufacturing method thereof

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Embodiment Construction

[0072] Below in conjunction with accompanying drawing and embodiment the present invention will be further described:

[0073] A microbolometer, comprising a micro-bridge structure, the micro-bridge structure is composed of two independent bridge decks, an upper deck and a lower deck, the upper deck is provided with one or more layers of light-absorbing materials, and the lower deck The bridge deck includes supporting and insulating layers, metal electrodes, thermistor films, passivation and control layers, the lower optical resonant cavity is formed between the lower bridge deck and the substrate, and the upper optical resonant cavity is formed between the upper bridge deck and the lower bridge deck , which is characterized in that the upper deck and the lower deck are connected by four connecting columns, and the surface of the lower deck is provided with a heat transfer layer made of metal.

[0074] Making a kind of double-layer microbolometer embodiment of the present ...

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Abstract

The invention discloses a two-layer micrometering bolometer and a manufacturing method thereof. The two-layer micrometering bolometer comprises a microbridge structure for a micrometering bolometer of an uncooled infrared detector or an uncooled terahertz detector, and is characterized in that: the microbridge consists of two independent bridge decks, namely an upper bridge deck and a lower bridge deck; a light absorbing material is positioned on the upper bridge deck; a thermistor material is positioned on the lower bridge deck; and four upper and lower bridge deck connecting posts on the upper bridge deck of the microbridge are connected with a metal heat transfer layer of the lower bridge deck of the microbridge. The upper bridge deck of the microbridge comprises one or more layers of light absorbing materials. The two-layer microbridge has higher light absorption rate and filling factor, and also has higher temperature uniformity and mechanical stability. The two-layer micrometering bolometer and the manufacturing method thereof can overcome the defects in the prior art, the working performance of a device is improved, and the two-layer micrometering bolometer is suitable for large-scale industrial production.

Description

technical field [0001] The invention relates to the technical fields of uncooled terahertz detection and uncooled infrared detection, in particular to a microbolometer and a preparation method thereof. Background technique [0002] Infrared detectors convert invisible infrared heat radiation into detectable electrical signals to realize the observation of external affairs. Infrared detectors are divided into two categories: quantum detectors and thermal detectors. Thermal detectors, also known as uncooled infrared detectors, can work at room temperature and have many advantages such as light weight, high integration, low cost, and high reliability. They have broad application prospects in military, commercial, and civilian fields. Uncooled infrared detectors mainly include three types: pyroelectric, thermocouple, and thermistor. Among them, the microbolometer focal plane detector based on thermistor has developed very rapidly in recent years and is widely used. uncooled in...

Claims

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Application Information

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IPC IPC(8): G01J5/20B81B3/00B81C1/00
Inventor 许向东杨卓蒋亚东何琼樊泰君黄龙敖天宏马春前陈超
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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