Composite material for packaging and preparation method thereof

Abstract

The invention relates to a composite material for packaging and a preparation method thereof. The composite material comprises 60-90 wt% of inorganic powder filler, 10-40 wt% of organic component for bonding and consolidating, wherein the filler refers to inorganic powders with 2-5 grain size values which are mixed uniformly according to selected grain size-value combination and grain size-weight combination, a coupling layer formed in the presence of a long-chain alkyl silane coupling agent exists between the inorganic powder surface and the organic component. According to the invention, through the proper matching of inorganic fillers with different grain sizes, the dispersion viscosity of the inorganic fillers in an organic system can be reduced effectively so as to improve the flowability of the inorganic fillers, so that more inorganic fillers can be filled under the same viscosity or same forming conditions, thereby further reducing packaging cost, improving packaging efficiency, improving the thermal conductivity of a package and reducing the thermal expansion coefficient of the package; through the adoption of a novel coupling agent, the surface modification effect of powder can be improved, compatibility between the inorganic filler and the organic component and bonding force between interfaces can be enhanced remarkably, and the overall water absorption of the composite material and the package can be reduced.

Description

technical field [0001] The invention relates to a composite material, more specifically, the invention relates to a composite material for sealing and insulating components and a manufacturing method thereof. Background technique [0002] The purpose of electronic packaging includes: reasonably arranging, assembling, bonding, and connecting the various internal components of electronic components or integrated circuits according to the specified requirements, and then using packaging materials to isolate the interior from the external environment to protect them from moisture. , dust and harmful gases invade and damage the interior of electronic devices or integrated circuits, and also slow down vibration, prevent external force damage and stabilize component parameters. [0003] With the rapid development of modern electronic information technology, higher and higher requirements are put forward for the miniaturization, portability, multi-function and high reliability of el...

AI Technical Summary

Problems solved by technology

[0005] At present, the organic components in composite materials for plastic packaging are mostly based on o-cresol novolac epoxy resin, which has increasingly exposed the following problems in actual production and products: 1. When curing, the thermal expansion coefficient of the epoxy composite material is greater than that of the chip Such metal materials will cause thermal stress inside the integrated circuit, which will easily lead to damage to the integrated circuit; 2. The increase in chip integration will generate more and more heat when the electronic device is working. If the proportion of resin components in the composite material composition is too high High, it will inevitably lead to difficulty in heat dissipation of electronic devices, which will affect the reliability of the circuit; 3. During the surface mounting process, the soldering process will make the surface temperature of the integrated circuit exceed 200 ° C. If the integrated circuit is in a hygroscopic state, the high temperature will make the moisture inside the integrated circuit Vaporization will generate a large vapor pressure, which will lead to internal peeling or overall cracking of the integrated circuit

[0006] If the proportion of inorganic powder filler in the composite material is increased, it can reduce the expansion coefficient and increase the thermal conductivity, but the inorganic filler also reduces the fluidity of the molding compound, thereby increasing the pressure required for packaging and increasing the Process difficulty; the increase in the proportion of inorganic fillers will also make the material more hydrophilic, which will increase the water absorption rate of the plastic package

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