Room-temperature cured epoxy resin flexible sealant and preparation method thereof

An epoxy resin, flexible sealing technology, applied in the direction of epoxy resin glue, chemical instruments and methods, adhesives, etc., can solve the problems that LED products cannot be bent and installed at will, the sealing surface is difficult to repair, and the elongation at break is low. To achieve the effect of excellent flexibility, high light transmittance and good fluidity

Inactive Publication Date: 2012-04-18
CHANGSHA LANXING CHEM NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy resins for this purpose usually use acid anhydrides as curing agents, and the curing reaction generally needs to be carried out above 100°C, which consumes more energy. Although the cured product has good light transmittance and physical and chemical properties, its hardness is relatively high. High, poor flexibility, low elongation at break, packaged LED products cannot be bent and installed at will, and once the sealing surface is damaged, it will be difficult to repair

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The components of room temperature curing epoxy resin flexible sealant in this embodiment are composed of components A: E51 epoxy resin 60 g, C 12-14 Alkyl monoglycidyl ether AGE 22 g, bisphenol A 16 g, 2,6-di-tert-butyl-4-methylphenol 0.5 g, 3-glycidyl ether epoxypropyl trimethoxysilane 1.0 g, Defoamer BYK-141 0.5 g; B component: polyoxypropylene diamine D400 30 g, polyoxypropylene diamine D2000 70 g.

[0022] Preparation:

[0023] (1) Preparation of component A: mix 60 g of E51 epoxy resin, 22 g of C 12-14 Alkyl monoglycidyl ether AGE, 16 g bisphenol A, 0.5 g 2,6-di-tert-butyl-4-methylphenol were put into a ceramic reaction kettle, heated to 80°C and fully stirred (stirrer speed 100 rpm, Stirring time 1.5 hours), after the solid raw material is completely dissolved, add 1.0 g 3-glycidyl ether epoxy propyl trimethoxy silicon, 0.5 g defoamer BYK-141, stir fully (stirrer speed 100 rpm, stirring time 30 minutes) to make it into a transparent and clear liquid, vacuum ...

Embodiment 2

[0028] This example consists of room temperature curing epoxy resin flexible sealant components, component A: E54 epoxy resin 50 g, butyl glycidyl ether 30 g, dibutyl phthalate 18 g, 2,6-di-tert Butyl-4-methylphenol 0.6 g, amine ethyl aminopropyl trimethoxy silicon 1.0 g, defoamer BYK-141 0.4 g; B component: polyoxypropylene diamine D230 12 g, polyoxypropylene diamine Amine D2000 88 g.

[0029] Preparation:

[0030] (1) Preparation of component A: 50 g E54 epoxy resin, 30 g butyl glycidyl ether, 18 g dibutyl phthalate, 0.6 g 2,6-di-tert-butyl-4-methylphenol Put it into a ceramic reaction kettle, heat it to 80°C and stir it fully (the speed of the mixer is 100 rpm, and the stirring time is 1 hour). After the solid raw material is completely dissolved, add 1.0 g of aminoethylaminopropyl trimethoxy silicon, 0.4 g of Foaming agent BYK-141, fully stirred (preferably mixer speed 100 rpm, stirring time 30 minutes) to make it into a transparent clear liquid, vacuum defoaming (va...

Embodiment 3

[0035] This example consists of room temperature curing epoxy resin flexible sealant components, component A: E51 epoxy resin 50 g, E44 epoxy resin 18 g, bianyl glycidyl ether 15 g, bisphenol A 15 g, 2,6 - Di-tert-butyl-4-methylphenol 0.3 g, methacryloxypropyl trimethoxy silicon 1.2 g, defoamer BYK-141 0.5 g; B component: polyoxypropylene diamine D2000 80 g 20 g of butyl glycidyl ether modified diethylenetriamine.

[0036]Preparation:

[0037] (1) Preparation of component A: 50 g E51 epoxy resin, 18 g E44 epoxy resin, 15 g benzyl glycidyl ether, 15 g bisphenol A, 0.3 g 2,6-di-tert-butyl-4- Pour methylphenol into the ceramic reaction kettle, heat to 80°C and stir well (mixer speed 100 rpm, stirring time 1.5 hours), after the solid raw material is completely dissolved, add 1.2 g of methacryloxypropyl trimethoxy Silicone, 0.5 g defoamer BYK-141, fully stirred (preferably mixer speed 100 rpm, stirring time 30 minutes) to make it into a transparent clear liquid, vacuum defoam...

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Abstract

The invention discloses a room-temperature cured epoxy resin flexible sealant and a preparation method thereof. The room-temperature cured epoxy resin flexible sealant comprises a component A and a component B, wherein, the component A comprises 40-80 weight portions of epoxy resin, 10-40 weight portions of diluent, 10-30 weight portions of plasticizer, 0.5-5.0 weight portions of silane coupling agent, 0.05-2.0 weight portions of antifoaming agent, and 0.2-2.0 weight portions of anti-oxidant, the component B comprises 10-50 weight portions of aliphatic short-chain amine curing agent and 30-90 weight portions of aliphatic long-chain amine curing agent, and the weight ratio of the component A to the component B is (0.8-1.0):1.0. The invention further discloses a preparation method of the epoxy resin flexible sealant. The epoxy resin flexible sealant disclosed herein has moderate mixing viscosity and good levelability, and can be rapidly cured at room temperature. The cured substance has good light transmittance and flexibility, and can be applied for surface coating of LED strip light, LED path light, LED mold strip and other technology products.

Description

technical field [0001] The invention relates to an epoxy resin sealant and a preparation method thereof, in particular to a room temperature curing epoxy resin flexible sealant and a preparation method thereof. Background technique [0002] In recent years, epoxy resin has been widely used in the sealing of optoelectronic semiconductor components such as LEDs and digital / dot matrix display modules. Epoxy resins for this purpose usually use acid anhydrides as curing agents, and the curing reaction generally needs to be carried out above 100°C, which consumes more energy. Although the cured product has good light transmittance and physical and chemical properties, its hardness is relatively high. High, poor flexibility, low elongation at break, packaged LED products cannot be bent and installed at will, and once the sealing surface is damaged, it will be difficult to repair. At present, reports on LED flexible light strips / strips are limited to the encapsulation and molding o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/06C09J11/08C09K3/10
Inventor 林益军朱祖钊姚宪法
Owner CHANGSHA LANXING CHEM NEW MATERIAL
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