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Preparation method of thermal-sensitive ceramic sputtered film electrode

A heat-sensitive ceramic and sputtering film technology, which is applied in the field of sputtering to prepare heat-sensitive ceramic electrode films, can solve the problems of low impact current resistance, high production cost, and high cost, and achieve excellent high-temperature welding performance and sputtering film formation The effect of fast speed and low production cost

Inactive Publication Date: 2012-06-20
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Electroless nickel plating methods include ultrasonic cleaning, roughening, SnCl 2 Sensitization treatment, PdCl 2 Activation treatment, hypophosphite pre-plating, immersion in nickel plating solution, heat treatment and other processes, the process is complicated and there is environmental pollution; the firing infiltration alloy method is to coat the prepared slurry on the ceramic surface first, and then sinter, the process is simple , but the product has low impact current resistance and poor aging and humidity resistance; the screen printing silver paste sintering process is similar to the firing infiltration alloy method, which is made by screen printing silver paste on ceramic chips and then sintering at high temperature. , A large amount of expensive silver is required, and the production cost is high. In addition, the metal film layer contains harmful elements such as lead
The above-mentioned processes all have the disadvantages of high energy consumption, high pollution, high cost, and poor reliability, which are contrary to the current development trend of building a conservation-oriented society and green technology, and are no longer suitable for continued application in the production of ceramic electrodes.

Method used

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  • Preparation method of thermal-sensitive ceramic sputtered film electrode
  • Preparation method of thermal-sensitive ceramic sputtered film electrode

Examples

Experimental program
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Effect test

preparation example Construction

[0020] The preparation method of the heat-sensitive ceramic sputtering film electrode of the present invention mainly adopts technical steps such as ceramic cleaning, mask mounting, vacuuming, filling with working gas, and sputtering electrode film; the contents of each step are as follows:

[0021] Ceramic cleaning: The pressed and sintered ceramic substrate 1 should be cleaned before the electrode layer is prepared on its surface to obtain a clean surface; cleaning is divided into rough cleaning, fine, drying, and drying steps; rough cleaning is carried out in a ball mill, and the Put the ceramic substrate 1 in a ball mill filled with running water and wash it for about 15-60 minutes to remove the burrs and heavy pollutants on the surface of the ceramic substrate 1, then put it into tap water and deionized water respectively, and ultrasonically clean it for 10-20 minutes each , and finally centrifugally dried, and dried in an environment of 120°-150°C; the ceramic is BaTiCO ...

Embodiment 1

[0031] Put the 20mm×20mm×4mm PTC heating ceramic body 1 into a ball mill for half an hour, then put it into tap water and deionized water for ultrasonic cleaning 3 times, 20 minutes each time. Then dry at 120°C for 20min;

[0032] Vacuuming: Put the cleaned PTC ceramics in the multi-target magnetron sputtering equipment to vacuumize to make the vacuum degree reach 10 -3 Pa level;

[0033] Filling with working gas: PTC ceramics are placed in the vacuum chamber of the multi-target magnetron sputtering coating machine, and the vacuum chamber is pumped to 8×10 -3 After the Pa vacuum state, then dynamically input inert gas such as Ar into the vacuum chamber to maintain the pressure in the vacuum chamber at 5×10 -1 Pa;

[0034] Sputtering electrode film: The bottom transition layer is sputtered on the front and back surfaces of the ceramic substrate by magnetron sputtering. The material is a Cr film with a thickness of 300nm and an intermediate barrier layer of 300nm. Layer Ag f...

experiment example 2

[0037] The difference between this embodiment and Embodiment 1 lies in the structure of the intermediate barrier layer. In this example, after the bottom electrode is sputtered, the Cr target and the NiCu target are sputtered simultaneously, that is, the structure of the intermediate barrier layer is an alloy of Cr-NiCu; The remaining steps are the same as in Experimental Example 1, and will not be repeated here;

[0038] In this embodiment, the final film layer structure is Cr / CrNiCu / Ag, and the film thicknesses are 300nm / 700nm / 300nm respectively. After testing, the electrode and BaTiO 3The ohmic contact resistance formed by PTC heating ceramics is less than 0.4Ω, the bonding force is greater than 6.4MPa, and the electrode can withstand 350 o C4 seconds of high temperature lead-free solder erosion; after 250 o After aging for 10 hours at C, there is little change in the ohmic contact resistance.

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Abstract

The invention belongs to the technical field of electronic materials, and particularly relates to a method for sputtering a film electrode on thermal-sensitive ceramic at room temperature, which is characterized by mainly comprising the following steps: cleaning the ceramic, racking a mask, vacuumizing, charging a working gas, and sputtering the electrode film. Compared with the prior art, the invention has the advantages of reasonable technological design, high sputtering film-forming speed, low production cost and pollution-free production process; and the prepared film has the advantages of firm combination, favorable high-temperature welding performance and the like. The invention provides an ideal preparation method of a thermal-sensitive ceramic electrode.

Description

[0001] Technical field The invention belongs to the technical field of electronic materials, in particular to a method for sputtering to prepare a heat-sensitive ceramic electrode film. Background technique [0002] As a mainstream product for various temperature sensing, temperature compensation, overheating, and overloading, thermal sensitive ceramics (PTC) have a wide range of applications in electronic products. Ceramic electrode manufacturing (commonly known as ceramic metallization) is a key technology in the production of electronic ceramics, which directly affects the key technical performance of ceramic devices such as ohmic contact resistance, withstand voltage, life and reliability. The existing methods for ceramic metallization mainly include electroless nickel plating method, firing infiltration alloy method, and screen printing silver paste sintering method. Electroless nickel plating methods include ultrasonic cleaning, roughening, SnCl 2 Sensitization treatmen...

Claims

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Application Information

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IPC IPC(8): C04B41/88
Inventor 金浩王德苗任高潮岑嘉宝冯斌沈小虎
Owner ZHEJIANG UNIV
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