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Silicone sealant used for electronic products, preparation method thereof, and application thereof

A technology for silicone sealants and electronic products, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of undisclosed sealant thermal conductivity, sealant does not have heat conduction effect, etc., to achieve inhibition Water vapor transmission performance, improved heat conduction effect, process requirements and equipment are not harsh

Active Publication Date: 2012-06-27
江苏明昊新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is not limited to the fact that none of the sealants disclosed in these patent documents has the heat conduction effect that the electronics industry is increasingly concerned about, and there is no technical revelation on how to improve the thermal conductivity of the sealant in the published patents and non-patent documents

Method used

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  • Silicone sealant used for electronic products, preparation method thereof, and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The steps of the preparation method of the silicone sealant for electronic products provided by the invention are as follows:

[0035] A. To prepare component A, 105 parts of α-ω-dihydroxypolydimethylsiloxane, 35 parts of methyl vinyl silicone oil, 5 parts of thermally conductive filler, active magnesium hydroxide and active hydroxide are oxidized in parts by weight After mixing 35 parts of aluminum according to 1:1, 20 parts of nano-active calcium carbonate treated with resin acid surface were added to the vacuum kneader. parts, and packaging (ie filling), the aforementioned fillers have an average particle size of 40-52nm, a purity greater than 99%, and a specific surface area of ​​43-44m 2 / g and the bulk density is 0.155-0.165g / cm 3 The thermally conductive filler, and the thermally conductive filler is composed of nano-silicon nitride, nano-magnesium nitride, nano-silicon carbide, nano-aluminum nitride, nano-boron nitride and aluminum oxide mixed in the same parts...

Embodiment 2

[0039] A. To prepare component A, prepare 110 parts of α-ω-dihydroxypolydimethylsiloxane, 25 parts of vinyl silicone oil, 7 parts of thermally conductive filler, 45 parts of active magnesium hydroxide and silane surface treatment in parts by weight 25 parts of nano-active calcium carbonate were added into a vacuum kneader, the vacuum of the kneader was at -0.06MPa, 105°C of kneading temperature, and after kneading for 60min, component A was obtained, and the rest were all the same as the description of step A of Example 1;

[0040]B. To prepare component B, 110 parts of vinyl silicone oil, 14 parts of methyl triisobutyl ketoximosilane, 3.5 parts of hexamethyldisiloxane, and 1.2 parts of dibutyltin dioctoate Put 1.8 parts of colored slurry with red color (type 902) into a double planetary high-speed mixer, and after blending for 50 minutes at a rotation speed of 450n / min and a revolution speed of 35n / min, component B is obtained, and the rest are the same as for Description of ...

Embodiment 3

[0043] A. To prepare component A, 106 parts of α-ω-dihydroxy polydimethylsiloxane, 30 parts of methyl vinyl silicone oil, 8 parts of thermal conductive filler, 55 parts of activated aluminum hydroxide and resin acid surface treatment Add 30 parts of nano-active calcium carbonate into a vacuum kneader, the vacuum degree of the kneader is -0.08MPa, the kneading temperature is 115°C, and after kneading for 90min, component A is obtained;

[0044] B. To prepare component B, mix 100 parts of methyl vinyl silicone oil, 15 parts of vinyl triisobutylketoximosilane, and 3.8 parts of γ-[2,3-epoxypropoxy]propyltrimethoxysilane Put 1.2 parts of dibutyltin dioctoate and 2.5 parts of colored slurry that is gray (brand number 902-1) into a double planetary high-speed mixer, and blend for 60 minutes at a rotation speed of 400n / min and a revolution speed of 40n / min Finally, component B is obtained.

[0045] The components A and B are mixed according to the weight ratio of A:B=9:1. The conten...

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Abstract

The invention relates to a silicone sealant used for electronic products. The invention belongs to the technical field of high-molecular materials. The sealant comprises a component A and a component B. The component A is composed of raw materials of, by weight: 100-110 parts of alpha-omega-dihydroxyl polydimethylsiloxane, 25-40 parts of silicone oil, 5-8 parts of a heat-conductive filling material, 35-65 parts of a fire-retarding filling material, and 20-35 parts of nano-grade calcium carbonate. The component B is composed of raw materials of, by weight: 90-110 parts of silicone oil, 12-15 parts of a cross-linking agent, 3-4 parts of a coupling agent, 1-1.5 parts of a catalyst, and 1.5-3 parts of a colored slurry. The silicone sealant is advantaged in excellent fire retardance, improved heat conductivity, ideal steam-penetration inhibiting capacity, excellent electrical property, excellent weathering resistance, and ideal corrosion resistance. A provided preparation method is advantaged in simple technology, and non-harsh requirements on technologies and equipments. With a provided application method, a mixing effect of the components A and B can be ensured.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a silicone sealant for electronic products, and also relates to a preparation method and a use method thereof. Background technique [0002] With the rapid development of the electronics industry, electronic equipment is developing in the direction of miniaturization, high capacity and high performance. High integration and ultra-thin electronic components have become a trend, especially with the integration of precision and closed With the popularization of circuits, the protection requirements for electronic products are getting higher and higher. Specifically, the application environment of integrated circuits is becoming more and more harsh. Good cooling effect. [0003] Putting the aforementioned electronic products in a closed environment to run, for example, equipped with a sealing device can have a certain dust-proof effect, but the heat dissipation...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/06C09J183/04C09J183/07C09J11/04
Inventor 韩仁明王益昌费志刚
Owner 江苏明昊新材料科技股份有限公司
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