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Halogen-free phosphate-free high-heat-resistance thermosetting resin composition as well as bonding sheet and copper clad laminate prepared from same

A resin composition, high heat resistance technology, applied in the direction of epoxy resin glue, film/sheet adhesive, adhesive, etc., can solve the problems of non-adhesive force, high resin brittleness, etc., achieve low cost, high heat Decomposition temperature, effect of good dielectric properties

Active Publication Date: 2012-07-11
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the simple bismaleimide resin is very brittle and has no cohesive force. It must be toughened and viscosified in order to retain its heat resistance and electrical properties and improve its toughness and cohesiveness.

Method used

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  • Halogen-free phosphate-free high-heat-resistance thermosetting resin composition as well as bonding sheet and copper clad laminate prepared from same
  • Halogen-free phosphate-free high-heat-resistance thermosetting resin composition as well as bonding sheet and copper clad laminate prepared from same
  • Halogen-free phosphate-free high-heat-resistance thermosetting resin composition as well as bonding sheet and copper clad laminate prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Add 25g of diaminodiphenylmethylether (DDE) and 200g of diphenylmethane bismaleimide (BDM) into a three-necked flask, start stirring, react at a constant temperature of 150°C for 50 minutes under condensing and reflux, and cool to room temperature to obtain Viscous liquid resin. In this resin solution, add 150g of biphenyl epoxy, 1.0g of dicyandiamide curing agent, 0.4g of catalyst 2-methyl-4-ethylimidazole, 20g of core-shell structure flexible components, and then add 60g of aluminum hydroxide , after 80 g of fused silicon dioxide and an appropriate amount of solvent N, N-dimethylformamide, adjust the solid content to 65%, and then stir and mix evenly.

[0046] After impregnating the above resin solution with glass cloth, bake it in an oven at 155° C. for 6 minutes to obtain a semi-cured adhesive sheet. Stack 8 adhesive sheets together, cover both sides with copper foil, and heat press in a vacuum press at 220°C for 90 minutes to obtain a copper-clad laminate (copper-...

Embodiment 2

[0048] Add 25 g of diaminodiphenylmethyl ether (DDE) and 260 g of diphenylmethane bismaleimide (BDM) into a three-necked flask, start stirring, react at a constant temperature of 150°C for 60 minutes under condensing and reflux, and cool to room temperature to obtain Viscous liquid resin. In this resin solution, add 120g of biphenyl epoxy, 1.0g of dicyandiamide curing agent, 0.35g of catalyst 2-methyl-4-ethylimidazole, 20g of core-shell structure flexible components, and then add 80g of aluminum hydroxide , after 60 g of fused silicon dioxide and an appropriate amount of solvent N, N-dimethylformamide, adjust the solid content to 65%, and then stir and mix evenly. Then a copper clad laminate was made according to the method in Example 1, and its properties are shown in Table 1.

Embodiment 3

[0050] Add 25 g of diaminodiphenylmethyl ether (DDE) and 300 g of diphenylmethane bismaleimide (BDM) into a three-necked flask, start stirring, react at a constant temperature of 150°C for 70 minutes under condensing and reflux, and cool to room temperature to obtain Viscous liquid resin. In this resin solution, add 100g of biphenyl epoxy, 1.0g of dicyandiamide curing agent, 0.3g of catalyst 2-methyl-4-ethylimidazole, 20g of core-shell structure flexible components, and then add 100g of aluminum hydroxide , after 40 g of fused silicon dioxide and an appropriate amount of solvent N, N-dimethylformamide, adjust the solid content to 65%, and then stir and mix evenly. Then a copper clad laminate was made according to the method in Example 1, and its properties are shown in Table 1.

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Abstract

The invention discloses a halogen-free phosphate-free high-heat-resistance thermosetting resin composition as well as a bonding sheet and a copper clad laminate prepared from the thermosetting resin composition. The halogen-free phosphate-free high-heat-resistance thermosetting resin composition comprises the following components: an aromatic amine compound, a bismaleimide compound, biphenyl epoxy resin, an amine curing agent, a catalyst, a flexible component composed of spherical particles with a core-shell structure, a filler and a solvent; the bonding sheet comprises a base material and the halogen-free phosphate-free high-heat-resistance thermosetting resin composition attached to the base material after impregnation drying; and the copper clad laminate comprises a plurality of overlaid bonding sheets and copper foils pressed and covered on one surface or two surfaces of the overlaid bonding sheets. The halogen-free phosphate-free high-heat-resistance thermosetting resin composition has the halogen-free, phosphate-free and environmentally-friendly characteristics and has the excellent characteristics of extremely high heat resistance, high glass-transition temperature, high thermal decomposition temperature, long thermal stratification time, good drilling machining property and the like; and the coefficient of thermal expansion of the halogen-free phosphate-free high-heat-resistance thermosetting resin composition can be lowered to be below 2.0% so as to satisfy the manufacture requirement of high multiples of layer (more than 20 layers) of PCB (Printed Circuit Board).

Description

technical field [0001] The invention relates to a resin composition, in particular to a halogen-free, phosphorus-free, high-heat-resistant thermosetting resin composition and an adhesive sheet and a copper-clad laminate made of the composition. Background technique [0002] After several years of development, at present, there are two main technical approaches to realize the halogen-free flame retardant of copper clad laminates. The first approach is to use phosphorus-containing epoxy resin as the main resin, and then use dicyandiamide or phenolic resin as the main resin. Curing agent, add a certain amount of inorganic fillers such as aluminum hydroxide, and use dicyandiamide as the curing agent of phosphorus-containing epoxy resin, the heat resistance of the board is poor, water absorption is large, and phenolic resin is used as the curing agent of phosphorus-containing epoxy resin The prepreg has poor appearance, high brittleness of the board, and poor processability; the ...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L63/00C09J179/08C09J163/00C09J7/04B32B15/08H05K1/03
Inventor 吴奕辉方克洪
Owner GUANGDONG SHENGYI SCI TECH
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