Cleaning agent for silicon wafer of photovoltaic cell and preparation method for cleaning agent

Abstract

The invention discloses a cleaning agent for a silicon wafer of a photovoltaic cell and a preparation method for the cleaning agent. The cleaning agent mainly comprises potassium hydroxide, sodium carbonate, sodium silicate, sodium borate, diethylenetriamine pentaacetic acid, sodium dodecyl benzene sulfonate, C12 / C18 fatty alcohol-polyoxyethylene ether, C13 / C15 straight-chain carbonyl alcohol oxyethylene ether, tetramethylammonium hydroxide, a triethanolamine oleic soap, deionized water and the like. The cleaning agent is alkaline, is used in a one-component mode, has good decontamination andcleaning performance, does not have any pungent smell, has a long using period, can effectively remove surface grease generated by linearly cutting monocrystalline silicon, metal impurities in silicon wafers, and dust and other particles which are adhered to the surfaces of the silicon wafers, and is non-corrosive to the silicon wafers; organic solvents and phosphorus additives are not contained;the pH value of a working solution is 9 to 11; the cleaning rate is up to 99 percent; and the cleaning process is simple. Compared with the traditional silicon wafer cleaning agent, the cleaning agent has the advantage that the unit cost is reduced by 60 percent.

Description

technical field [0001] The invention relates to the technical field of photovoltaic cell silicon chip production, in particular to a cleaning agent for photovoltaic cell silicon chip and a preparation method thereof. Background technique [0002] The appearance of silicon wafers for photovoltaic cells should be silver-gray before use, and interlayers, blackening, oxidation, fingerprints, and stains or impurities are not allowed. Therefore, in the preparation process of high-efficiency monocrystalline silicon solar wafers, in order to obtain high For high photoelectric conversion efficiency, there must be a silicon wafer with a clean surface, and the metal pollution on the surface must be reduced below the harmful value. At present, the processing of silicon wafers adopts multi-wire cutting machines. The multi-wire cutting machines use steel wires to drive silicon carbide abrasives to cut silicon wafers, which will cause organic contamination, particle contamination, and meta...

AI Technical Summary

Problems solved by technology

[0004] There are mainly the following types of silicon wafer cleaning technologies for photovoltaic cells. The RCA cleaning method was commonly used in the early days. However, due to the high cost of reagents used in RCA cleaning, the surface of silicon wafers after cleaning is rough, and it is harmful to the environment and human body, so it is not suitable for photovoltaic cells. Cleaning of silicon wafers

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