Method for manufacturing circuit substrates and circuit boards with high heat dissipation and high heat conductivity

Abstract

The invention relates to a method for manufacturing circuit substrates and circuit boards with high heat dissipation and high heat conductivity. The method comprises the steps as follows: firstly mixing boron nitride powder with an inorganic bonding agent containing silicon, aluminum and zirconium to prepare insulating paint; applying the insulating paint on a substrate made of metal or alloy, and heating for curing to form an insulating layer with good heat conductivity and in excellent combination with the substrate; and applying conductive material on the insulating layer to form a circuit pattern with a scheduled circuit layout in a screen printing or sputtering mode to prepare a circuit substrate with high heat dissipation and high heat conductivity. Through the insulating layer with good heat conductivity and in excellent combination with the substrate, heat energy generated by actuating electronic components in electric connection to the circuit pattern can be quickly conducted to the substrate, thereby achieving the effects of fast heat conduction and high heat dissipation rate.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit substrate, in particular to a method for manufacturing a circuit substrate and a circuit board with high heat dissipation and high thermal conductivity characteristics. Background technique [0002] Generally speaking, the electronic components installed on the circuit board will generate waste heat during operation. If the heat dissipation is not carried out properly to keep the electronic components and the circuit board at normal operating temperature, the overheated operating temperature will cause the characteristics of the electronic components Changes will make the electronic components unable to achieve the expected working performance, and more serious cases will greatly affect the service life of the electronic components. Especially the current electronic components are developing towards high power. At the same time, high-power light-emitting components, such as light-emitting di...

AI Technical Summary

Problems solved by technology

[0003] However, the current printed circuit boards, such as FR4 printed circuit boards, or the developing metal core printed circuit boards (called MCPCB in the industry), still mostly use organic polymer materials such as epoxy resin as insulating materials in circuit boards. The main components, but the thermal conductivity of epoxy resin and polymer materials is low, and there is also a problem of deterioration under long-term light irradiation, so the existing printed circuit boards are gradually not enough to support this kind of heat generation. High temperature but for temperature sensitive electronic components

[0004] In addition, because organic polymer materials such as epoxy resins are polluting the environment during the manufacturing process or subsequent recycling operations, and the circuits of current printed circuit boards are made of copper foil (and / or aluminum foil) after acid treatment. Washing, so as to etch away part of the copper foil to form a predetermined circuit pattern. The acid waste liquid generated after etching not only contains metal ions, causing serious environmental pollution problems, but also the etched metal cannot be easily recycled and reused, resulting in a lot of waste Therefore, the current printed circuit board needs to be improved, and environmental protection issues should be considered under the premise of improving thermal conductivity and heat dissipation, so as to reduce the harm to the environment or human body during the process.

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