High heat-resistant, high-insulation and heat-conductive aluminum-based copper-clad laminate glue composition and preparation process
An aluminum-based copper-clad laminate and high-insulation technology, applied to a high-insulation and heat-conducting adhesive layer, a composition of a high-heat-resistant, high-insulation, and heat-conducting aluminum-based copper-clad laminate, and a high-heat-resistant, high-insulation, and heat-conducting aluminum-based copper-clad laminate glue In the field of composition, it can solve the problems of poor insulation, complicated processing technology, and low heat resistance, and achieve high heat resistance, low glue viscosity, and excellent heat resistance.
Inactive Publication Date: 2016-10-05
XIANYANG TIANHUA ELECTRONICS SCI & TECH
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Problems solved by technology
[0003] The purpose of the present invention is to solve the problem of low heat resistance, poor insulation and complex processing technology of aluminum-based copper-clad laminates in the prior art, thereby providing a new technical solution
Method used
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[0039] The present invention is described in further detail with specific embodiment now in conjunction with accompanying drawing:
[0040] The raw material prescription used in the present invention and preparation technology thereof are:
[0041] A raw material composition:
[0042]
[0043] B raw material recipe:
[0044] Dicyandiamide 83%
[0045] KH-560 silane coupling agent 17%
[0046] C raw material recipe:
[0047]
[0048] (a) Mix the raw materials from the raw material recipe A to prepare the prepolymer glue A.
[0049] (b) Prepared by mixing B raw materials: curing agent and auxiliary agent B.
[0050] (c) Prepared by mixing the raw materials of C: high-insulation and heat-conducting powder C.
[0051] According to the ratio of each raw material in the A raw material formula, weigh each raw material component respectively, the total amount is 30 kg, and put it into a stainless steel reactor with jacketed heating and stirring equipment. Turn on the stir...
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Abstract
The present invention relates to a formula and a preparation process of a heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation, and belongs to the technical field of chemical product manufacturing. The copper-clad plate comprises raw materials of TDE-85 epoxy resin, E-51 epoxy resin, hydroxyl-terminated polybutadiene liquid rubber, benzyl dimethylamine, dual nitrile amine, KH-560 silane coupling agent, nitride boron powder, alumina powder, aluminum nitride powder and silicon nitride powder. The preparation process comprises steps of mixing, stirring, heating, coating, drying and laminating. A product can be a copper foil layer, an aluminum substrate., and an intermediate high insulating heat-conducting adhesive coating. The product produced by the invention has a high long-term heat resistance and can be used at a high temperature of 150 DEG C for a long time. The product has excellent electric insulation, small dielectric constant and dielectric loss, and high breakdown voltage, and is suitable for occasions requiring high insulation. The heat-conducting adhesive coating has the advantages of simple preparation process, convenient coating construction and cost saving.
Description
technical field [0001] The invention relates to a composition and a manufacturing method of a high-heat-resistant, high-insulation and heat-conducting aluminum-based copper-clad laminate, in particular to a high-heat-resistant, high-insulation and heat-conducting aluminum-based copper-clad laminate glue composition and a preparation process, belonging to chemical products In the field of manufacturing technology, its products can be copper foil layers, aluminum substrates, and high-insulation and heat-conducting adhesive layers in the middle. Background technique [0002] At present, the heat-conducting aluminum-based copper-clad laminates in the market, such as those produced by Taiwan Clear Technology and Zhuhai Quanbao Electronics, are mainly formulated with epoxy resin, plasticizer or nitrile rubber or thermoplastic engineering plastics as tougheners, and bis-nitrile Amine is used as a curing agent, combined with inorganic heat-conducting powders such as boron nitride an...
Claims
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IPC IPC(8): C08L63/00C08L63/02C08L9/00C08K13/02C08K5/18C08K5/31C08K3/38C08K3/22C08K3/28C08K3/34C09J163/00C09J163/02C09J109/00C09J11/04B32B15/092B32B15/20
Inventor 周文英张祥林
Owner XIANYANG TIANHUA ELECTRONICS SCI & TECH