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Integrated circuit (IC) card packaging special hot melting adhesive tape and preparation method thereof

A technology of hot-melt adhesive film and polyamide hot-melt adhesive, which is applied in the direction of adhesive, adhesive type, film/sheet adhesive, etc., which can solve the problem of limited bonding ability, separation of chip module and card substrate, etc. Problems, to achieve fast melting, meet the requirements of production efficiency and bonding effect, reasonable design effect

Active Publication Date: 2012-11-07
TIANJIN BOYUAN NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above-mentioned PA hot-melt adhesive film has the advantages of fast melting and good bonding effect on the chip module, it can meet the requirements for packaging in the IC card production process to a certain extent, but, due to the common PA hot-melt adhesive The bonding ability of PVC material is limited, so the IC card produced is prone to the problem of separation of the chip module and the card substrate after a period of use

Method used

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Effect test

preparation example Construction

[0020] A preparation method of a special hot-melt adhesive film for IC card packaging, comprising the following steps:

[0021] ⑴Preparation of modified polyamide hot melt adhesive solution: add dibasic acid and dibasic amine into the reaction vessel, react for 1 to 2 hours under an inert atmosphere, then drop to normal pressure, add small molecule dibasic alcohol to react 3 ~ 8 hours, then remove excess small molecular diols by distillation under reduced pressure to obtain amide diols; then add the gained amide diols and two functional group isocyanates, catalysts and solvents to another reaction vessel, in an inert The modified polyamide hot-melt adhesive solution is obtained after reacting at a temperature of 70-90°C for 3-5 hours under the atmosphere;

[0022] (2) Preparation of thermally conductive filler dispersion: Add dispersion aid, solvent and thermally conductive filler into a stirred container, and stir for more than 2 hours to obtain thermally conductive filler di...

Embodiment 1

[0026] (1) Preparation of modified polyamide hot-melt adhesive solution: under nitrogen atmosphere, add 71g of sebacic acid, 78g of dimer fatty acid, 58g of hexamethylenediamine, 86g of decanediamine into a pressure vessel equipped with a stirrer, control The pressure inside the reactor is 10×10 5 Pa, the temperature is 200 ° C, after 1.5 hours of reaction, it is reduced to normal pressure, and then 76g of 1,3-propanediol is added, and the pressure is controlled to be 10×10 5 Pa, the temperature is 200°C, after 4 hours of reaction, reduce to normal pressure and remove unreacted small molecule diols by vacuum distillation to obtain amides diols; under nitrogen environment, 90.8g amides obtained above Dihydric alcohol, 26.7g isophorone diisocyanate, 0.5g dibutyltin dilaurate and 120g butanone are added in the reaction vessel, and the temperature is controlled at 85°C under an inert atmosphere for 3 hours and then cooled to room temperature to obtain the modified Polyamide hot m...

Embodiment 2

[0030] (1) Preparation of modified polyamide hot melt adhesive solution: under nitrogen atmosphere, add 71g glutaric acid, 78g adipic acid, 70g pimelic acid, 58g hexamethylenediamine, 86g Decanediamine, control the pressure in the reactor to 10×10 5 Pa, the temperature is 200 ° C, after 1.5 hours of reaction, it is reduced to normal pressure, and then 76g of 1,3-propanediol is added, and the pressure is controlled to be 10×10 5 Pa, the temperature is 200°C, after 4 hours of reaction, reduce to normal pressure and remove unreacted small molecule diols by vacuum distillation to obtain amides diols; under nitrogen environment, 90.8g amides obtained above Dihydric alcohol, 26.7g isophorone diisocyanate, 0.5g dibutyltin dilaurate and 120g butanone are added in the reaction vessel, and the temperature is controlled at 85°C under an inert atmosphere for 3 hours and then cooled to room temperature to obtain the modified Polyamide hot melt adhesive solution.

[0031] (2) Preparation ...

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Abstract

The invention relates to an integrated circuit (IC) card packaging special hot melting adhesive tape and a preparation method thereof. The IC card packaging special hot melting adhesive tape and the preparation method thereof are characterized in that the IC packaging special hot melting adhesive tape is composed of, by weight, 75-90 parts of modified polyamide hot melting adhesives and 10-25 parts of heat conduction fillers, and the preparation method of the hot melting adhesive tape includes preparing a modified polyamide hot melting adhesive solution, compounding a heat conduction filler dispersing liquid, uniformly mixing the modified polyamide hot melting adhesive solution and the heat conduction filler dispersing liquid based on a proportion, and performing a coating so as to prepare the hot melting adhesive tape. The IC card packaging special hot melting adhesive tape and the preparation method thereof have the advantages that the design is reasonable, the modified polyamide hot melting adhesive and the modified heat conduction fillers are utilized to prepare the hot melting adhesive tape, the melting and the cooling are rapid, besides, a molecular structure contains carbamic acid ester which is a basic group of a polyurethane material, a continued and effective adhesive bonding between the hot melting adhesive tape and a polyvinyl chloride (PVC) material can be achieved, and hot melting adhesive tape can greatly meet requirements for production efficiency and adhesive bonding effect of the IC card packaging.

Description

technical field [0001] The invention belongs to the technical field of polymer synthesis, in particular to a special hot-melt adhesive tape for IC card packaging and a preparation method thereof. Background technique [0002] Compared with magnetic cards, integrated circuit cards (IC cards) have the advantages of large information storage capacity and high storage security, and their application prospects are extremely broad. In the IC card manufacturing process, fast and effective bonding of the chip module (mainly epoxy resin fiber composite material) and the card substrate (mainly PVC material) is a key step in determining product production efficiency and quality. At present, domestic and foreign card manufacturers mainly use ordinary polyamide (PA) hot-melt adhesive films to realize the bonding and packaging of chip modules and card substrates. Although the above-mentioned PA hot-melt adhesive film has the advantages of fast melting and good bonding effect on the chip ...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J175/04C09J11/04C08G18/60
Inventor 李春刚鹿秀山刘柏松李维张兰月訾严吕树仁
Owner TIANJIN BOYUAN NEW MATERIALS
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