Method for preparing silver-coated copper powder through radiation reduction

A technology of silver-plated copper powder and copper powder, which is applied in the field of preparation of silver-plated copper powder through radiation reduction, can solve the problems of high price, loose silver layer with holes, and increased coating resistance, so as to achieve low production cost and anti-corrosion Good oxidizing property and growth promoting effect

Inactive Publication Date: 2012-11-14
EAST CHINA UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the silver-based paste is not only expensive, but also the electromigration of silver ions under hot and humid conditions will lead to an increase in coating resistance and a decrease in conductivity; therefore, in order to reduce costs and maintain good conductivity of silver powder, people In the study of using silver-plated copper powder as a substitute for silver powder
Chinese patent document (publication number CN 1425738) discloses " a kind of method utilizing tin protochloride to be sensitizer repeated silver plating " to prepare silver-coated copper powder, and this method needs repeated silver plating when preparing silver-plated copper powder, The efficiency of silver plating is reduced, and the silver-plated copper powder prepared by this method needs to undergo high-temperature heat treatment to make the surface smooth and dense, which increases the possibility of silver powder bonding during heat treatment
However, this process requires a large amount of organic reagents to clean the surface of the powder, so its industrial application is difficult
Chinese patent literature (publication number CN 101244459A) discloses a method for improving the catalytic activity of copper powder...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Example 1 Preparation of 0.5μm silver-coated copper powder

[0020] Prepare silver-plated copper powder by described preparation method, its step is:

[0021] (1) First, add 125g of copper sulfate, 50g of polyvinylpyrrolidone (PVP), and 50g of sodium hydroxide into 1.5L of water to dissolve, and place in a water bath at 70°C; then, add 0.5L of an aqueous solution containing glucose (240g / L) Slowly add it dropwise to the copper sulfate aqueous solution, react at 70°C for half an hour, then add 0.1L hydrazine hydrate to the system, and continue the reaction for half an hour; after the reaction, wash with dilute sulfuric acid and deionized water to obtain clean copper powder ;

[0022] (2) Take 20 g of the copper powder obtained in step (1) and place it in 100 g of deionized water containing 10 g / L of dispersant polyvinylpyrrolidone (PVP), stir and disperse; add 0.5 L of silver ammonia solution (20 g / L), Add active particle capture agent (accounting for 0.5% of solve...

Embodiment 2

[0023] Example 2 Preparation of 2.0 μm silver-coated copper powder

[0024] Prepare silver-plated copper powder by described preparation method, its step is:

[0025] (1) First, add 125g of copper sulfate and 20g of polyvinylpyrrolidone (PVP) into 0.5L of water to dissolve, add 0.15L of ammonia water, and place in a water bath at 70°C; then, add 0.5 L is slowly added dropwise to an aqueous solution of copper sulfate, reacted at 70°C for 3 hours, and washed with dilute sulfuric acid and deionized water after the reaction to obtain clean copper powder;

[0026] (2) Take 20 g of the copper powder obtained in step (1) and place it in 100 g of deionized water containing 10 g / L of dispersant polyvinylpyrrolidone (PVP), stir and disperse; add silver ammonia solution (20 g / L) 0.4L , add active particle capture agent (accounting for 0.5% of solvent weight fraction), pass nitrogen gas for 5 minutes, then put into Co-60 source irradiation, irradiation dose rate and irradiation absor...

Embodiment 3

[0027] Example 3 Preparation of 6.5μm silver-coated copper powder

[0028] Prepare silver-plated copper powder by described preparation method, its step is:

[0029] (1) First, add 300g of copper sulfate and 20g of polyvinylpyrrolidone (PVP) into 1.0L of water to dissolve, add 0.45L of ammonia water, and place in a water bath at 70°C; then, add 1.0 L was added dropwise into an aqueous solution of copper sulfate, reacted at 70°C for 5 hours, and washed with dilute sulfuric acid and deionized water after the reaction to obtain clean copper powder;

[0030] (2) Take 30 g of the copper powder obtained in step (1) and place it in 100 g of deionized water containing 20 g / L of dispersant polyvinylpyrrolidone (PVP), stir and disperse; add silver ammonia solution (20 g / L) 0.3L , add active particle capture agent (accounting for 0.5% of solvent weight fraction), pass nitrogen gas for 5 minutes, then put into Co-60 source irradiation, irradiation dose rate and irradiation absorbed d...

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Abstract

The invention provides a method for preparing silver-coated copper powder through radiation reduction, comprising the following steps of (1) preparing the copper powder: adding ammonia water into copper sulphate solution, dripping a reducing agent solution into the copper sulphate solution, reacting at 70-80 DEG C, and washing obtained copper powder by using dilute sulphuric acid and deionized water so as to obtain clean copper powder; (2) preparing the silver-coated copper powder through the radiation reduction: adding the clean copper powder into the deionized water which contains a dispersing agent, after adding silver ammonia solution and an active particle catcher and feeding an inert gas, placing the mixture in a radiation source to perform a radiation reduction reaction in a stirring state, wherein the irradiation dose rate is 0.8-6.0 kGy/h, and the absorbed dose is 10-30 kGy; and finally washing a reaction product by using the deionized water to obtain the silver-coated copper powder with a grain size of 0.5 mum-6.5 mum. The plating layer of the silver-coated copper powder prepared by the method is compact without hole corrosion, the conductive performance is good, the process is simple, the production cost is low, and the method is in favour of the development of electronic industry.

Description

technical field [0001] The invention relates to the technical field of using nuclear radiation technology to prepare metal powder materials, in particular to a preparation method for preparing silver-plated copper powder through radiation reduction. Background technique [0002] With the rapid development of the electronics industry, there is an increasing demand for electronic pastes with silver powder as the main functional phase. However, the silver-based paste is not only expensive, but also the electromigration of silver ions under hot and humid conditions will lead to an increase in coating resistance and a decrease in conductivity; therefore, in order to reduce costs and maintain good conductivity of silver powder, people In the study, silver-plated copper powder is used as a substitute for silver powder. Chinese patent literature (publication number CN 1425738) discloses "a method for multiple silver plating using stannous chloride as a sensitizer" to prepare silver...

Claims

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Application Information

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IPC IPC(8): B22F9/24
Inventor 方斌葛学平杨云霞杨存忠刘华蓉
Owner EAST CHINA UNIV OF SCI & TECH
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