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Thermosetting compound fluorine-containing polyimide resin and preparation method thereof

A polyimide resin and polyimide technology, applied in the field of thermosetting composite fluorine-containing polyimide resin and its preparation, can solve the problems of poor impact toughness, easy microcracks, and high water absorption of composite materials, and achieve Good heat resistance stability, improved solubility and processability, and good moldability

Active Publication Date: 2012-11-14
自贡中天胜新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, polyimide matrix resin also has some shortcomings, which affects its practical application to a certain extent.
The disadvantages of polyimide matrix resin mainly include: it is insoluble in most organic solvents, difficult to process, poor in cohesion, and high in water absorption; the impact toughness of composite materials prepared by polyimide matrix resin is poor, requiring Further improvement; the composite material prepared by polyimide matrix resin is prone to microcracks during use at high temperature
[0004] In order to improve the performance of polyimide, the present invention provides a kind of thermosetting composite fluorine-containing polyimide resin and its preparation method, and this resin and its preparation method have not been reported

Method used

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  • Thermosetting compound fluorine-containing polyimide resin and preparation method thereof
  • Thermosetting compound fluorine-containing polyimide resin and preparation method thereof
  • Thermosetting compound fluorine-containing polyimide resin and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0053] At room temperature, under the protection of nitrogen, put 36.6 g (0.1 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane and 460.0 g of N-methylpyrrolidone into the reaction kettle, stir and dissolve After completion, 44.4 g (0.1 mol) of 4,4'-(hexafluoroisopropene) diphthalic anhydride was added, stirred and reacted for 12-24 hours, and a homogeneous, transparent and viscous first resin solution was obtained. Then, add 460.0 g xylene to the first resin solution, azeotropically reflux water-dividing and stirring for 8-12 hours, then react to generate water and xylene to azeotropically distill off to obtain a bisphenol AF-based fluorine-containing polyimide solution. The solid content is 13wt%, namely A component, and the yield is 95%.

[0054] At room temperature, under nitrogen protection, 51.8 g (0.1mol) of 2,2-bis[4-(4-aminophenoxy)benzene]hexafluoropropane and 450.0 g of N-methylpyrrolidone were put into the reactor, After stirring and dissolving completely...

Embodiment 2

[0061] At room temperature, using nitrogen protection, 36.6 g (0.1mol) 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane and 460.0g N,N-dimethylacetamide were put into the reaction kettle , after stirring and dissolving completely, add 35.4 g (0.1mol) 1,4-bis(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride and stir for 12-24 hours to obtain a homogeneous Transparent viscous first resin solution. Then, add 460.0 g of toluene to the first resin solution, azeotropically reflux, separate water, stir and react for 8-12 hours, and then azeotropically distill off the reaction water and toluene to obtain bisphenol AF-based fluorine-containing polyimide solution, containing solid The amount is 12wt%, namely A component, and the yield is 93%.

[0062] At room temperature, under nitrogen protection, 51.8 g (0.1mol) of 2,2-bis[4-(4-aminophenoxy)benzene]hexafluoropropane and 450.0 g of N,N-dimethylacetamide were placed in In the reaction kettle, after stirring and dissolving ...

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Abstract

The invention discloses a thermosetting compound fluorine-containing polyimide resin and a preparation method thereof, which aim at further improving the heat stability, temperature resistance and cold resistance of materials. The thermosetting compound fluorine-containing polyimide resin is prepared by compounding a component A and a compound B, wherein the mass ratio of the component A to the compound B is 1:(1-4); the component A is bisphenol AF-matrix fluorine-containing polyimide solution with the solid content of 10wt%-20wt%; and the component B is bisphenol AF phenoxy fluorine-containing polyimide solution with the solid content of 10wt%-20wt%. The thermosetting compound fluorine-containing polyimide resin has high dissolubility, heat stability, mechanical properties and melt processing performance. Besides, the preparation method is simple to operate, low in cost and environment-friendly, and can be adapted to the requirements of industrial production.

Description

technical field [0001] The invention relates to new polymer materials and the field of preparation thereof, in particular to a thermosetting composite fluorine-containing polyimide resin and a preparation method thereof. Background technique [0002] Polyimide has particularly excellent heat resistance, low temperature resistance, flame retardancy, electrical and mechanical properties. Therefore, as a class of polymer materials with excellent comprehensive properties, it is widely used in electronic microelectronics, aerospace, space Technology, laser, optoelectronics and other high-tech fields, such as the internal channel, external channel, high-speed blades, jet valves of aero-engines, tail fins, instrument compartments, shells, etc. of cruise missiles. [0003] However, the polyimide matrix resin also has some disadvantages, which affect its practical application to a certain extent. The disadvantages of polyimide matrix resin mainly include: it is insoluble in most org...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08J3/24C08G73/10
Inventor 程杰
Owner 自贡中天胜新材料科技有限公司
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