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Thermosetting compound fluorine-containing polyimide resin and preparation method thereof

A polyimide resin and polyimide technology are applied in the field of thermosetting composite fluorine-containing polyimide resin and its preparation, which can solve the problems of poor impact toughness, easy generation of micro-cracks, poor adhesion and the like of composite materials. To achieve good thermal stability, improve thermal oxidation stability, improve the effect of flexibility

Active Publication Date: 2013-11-06
自贡中天胜新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, polyimide matrix resin also has some shortcomings, which affects its practical application to a certain extent.
The disadvantages of polyimide matrix resin mainly include: it is insoluble in most organic solvents, difficult to process, poor in cohesion, and high in water absorption; the impact toughness of composite materials prepared by polyimide matrix resin is poor, requiring Further improvement; the composite material prepared by polyimide matrix resin is prone to microcracks during use at high temperature
[0004] In order to improve the performance of polyimide, the present invention provides a kind of thermosetting composite fluorine-containing polyimide resin and its preparation method, and this resin and its preparation method have not been reported

Method used

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  • Thermosetting compound fluorine-containing polyimide resin and preparation method thereof
  • Thermosetting compound fluorine-containing polyimide resin and preparation method thereof
  • Thermosetting compound fluorine-containing polyimide resin and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0053] At room temperature, under the protection of nitrogen, put 36.6 g (0.1 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane and 460.0 g of N-methylpyrrolidone into the reaction kettle, stir and dissolve After completion, 44.4 g (0.1 mol) of 4,4'-(hexafluoroisopropene) diphthalic anhydride was added, stirred and reacted for 12-24 hours, and a homogeneous, transparent and viscous first resin solution was obtained. Then, add 460.0 g xylene to the first resin solution, azeotropically reflux water-dividing and stirring for 8-12 hours, then react to generate water and xylene to azeotropically distill off to obtain a bisphenol AF-based fluorine-containing polyimide solution. The solid content is 13wt%, namely A component, and the yield is 95%.

[0054] At room temperature, under nitrogen protection, 51.8 g (0.1mol) of 2,2-bis[4-(4-aminophenoxy)benzene]hexafluoropropane and 450.0 g of N-methylpyrrolidone were put into the reactor, After stirring and dissolving completely...

Embodiment 2

[0061] At room temperature, using nitrogen protection, 36.6 g (0.1mol) 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane and 460.0g N,N-dimethylacetamide were put into the reaction kettle , after stirring and dissolving completely, add 35.4 g (0.1mol) 1,4-bis(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride and stir for 12-24 hours to obtain a homogeneous Transparent viscous first resin solution. Then, add 460.0 g of toluene to the first resin solution, azeotropically reflux, separate water, stir and react for 8-12 hours, and then azeotropically distill off the reaction water and toluene to obtain bisphenol AF-based fluorine-containing polyimide solution, containing solid The amount is 12wt%, namely A component, and the yield is 93%.

[0062] At room temperature, under nitrogen protection, 51.8 g (0.1mol) of 2,2-bis[4-(4-aminophenoxy)benzene]hexafluoropropane and 450.0 g of N,N-dimethylacetamide were placed in In the reaction kettle, after stirring and dissolving ...

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Abstract

The invention discloses a thermosetting compound fluorine-containing polyimide resin and a preparation method thereof, which aim at further improving the heat stability, temperature resistance and cold resistance of materials. The thermosetting compound fluorine-containing polyimide resin is prepared by compounding a component A and a compound B, wherein the mass ratio of the component A to the compound B is 1:(1-4); the component A is bisphenol AF-matrix fluorine-containing polyimide solution with the solid content of 10wt%-20wt%; and the component B is bisphenol AF phenoxy fluorine-containing polyimide solution with the solid content of 10wt%-20wt%. The thermosetting compound fluorine-containing polyimide resin has high dissolubility, heat stability, mechanical properties and melt processing performance. Besides, the preparation method is simple to operate, low in cost and environment-friendly, and can be adapted to the requirements of industrial production.

Description

technical field [0001] The invention relates to new polymer materials and the field of preparation thereof, in particular to a thermosetting composite fluorine-containing polyimide resin and a preparation method thereof. Background technique [0002] Polyimide has particularly excellent heat resistance, low temperature resistance, flame retardancy, electrical and mechanical properties. Therefore, as a class of polymer materials with excellent comprehensive properties, it is widely used in electronic microelectronics, aerospace, space Technology, laser, optoelectronics and other high-tech fields, such as the internal channel, external channel, high-speed blades, jet valves of aero-engines, tail fins, instrument compartments, shells, etc. of cruise missiles. [0003] However, the polyimide matrix resin also has some disadvantages, which affect its practical application to a certain extent. The disadvantages of polyimide matrix resin mainly include: it is insoluble in most org...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08J3/24C08G73/10
Inventor 程杰
Owner 自贡中天胜新材料科技有限公司
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