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Conductive silver adhesive for high-power LED (light-emitting diode) and preparation method and curing and using method thereof

A conductive silver glue, high-power technology, applied in the direction of conductive adhesives, circuits, adhesives, etc., can solve the problems of poor solubility and fusibility, unsatisfactory anti-aging performance, poor flame retardancy, etc., and achieve high temperature resistance Excellent, good application prospects, strength and other indicators to enhance the effect

Inactive Publication Date: 2014-02-19
NEW MATERIAL INST OF SHANDONG ACADEMY OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Epoxy resin has the advantages of good adhesion, small shrinkage, good electrical properties, and good process adaptability, but it is subject to some restrictions in some places with higher requirements for application environments, poor flame retardancy, brittle quality, and anti-aging performance not ideal, low strength
Polyamide-imide is an emerging high-temperature-resistant polymer material with outstanding strength performance, but ordinary polyamide-imide has poor solubility and fusibility, and cannot be fully and uniformly fused with a large proportion of epoxy resin, nor can it satisfy For curing conditions below 190 degrees, in the prior art, a small amount of functional group polyamideimide with curing effect is added in the form of a curing agent to increase the strength in a small amount

Method used

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  • Conductive silver adhesive for high-power LED (light-emitting diode) and preparation method and curing and using method thereof
  • Conductive silver adhesive for high-power LED (light-emitting diode) and preparation method and curing and using method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Add 10g of epoxy resin E-44 and 2.2g of fluorine-containing polyamideimide to an appropriate amount of N,N'-dimethylacetamide, stir and dissolve evenly, add 0.8g of diaminodiphenylmethane, and Add 2g of polyimide, add 80g of conductive silver powder, 4g of carbon fiber with a length of 10 microns, 1g of KH550 coupling agent, grind and mix evenly, heat at 170°C for one hour, and heat at 190°C for one hour to cure. The tensile strength is 120MPa, and the resistance value 12 μΩ·cm, thermal decomposition temperature 402℃.

[0026] The curing agent is one or more mixtures of amino-terminated polyimide, amino-terminated polyamide-imide, polyamines, polybasic anhydrides and bismaleimide curing agents.

Embodiment 2

[0028] The similarities between this example and Example 1 will not be repeated. The difference is that 10g of phenolic modified epoxy resin F-44 and 7g of fluorine-containing polyamideimide are added to an appropriate amount of N,N'-two In methyl acetamide, dissolve evenly, add 8g of amino-terminated polyamideimide, 65g of conductive silver powder, 9g of carbon fiber, 1g of KH560 coupling agent, grind and mix evenly, heat at 170°C for one hour, and heat at 190°C for one hour to cure. The tensile strength is 160MPa, the resistance value is 14 μΩ·cm, and the thermal decomposition temperature is 414°C.

Embodiment 3

[0030] The similarities between this example and Example 1 will not be repeated. The difference is that 10g of cycloaliphatic epoxy resin and 7.7g of fluorine-containing polyamideimide are added to an appropriate amount of N,N'-dimethyl In acetamide, dissolve evenly and add maleic anhydride 0.8g, amino-terminated polyetherimide 2g, conductive silver powder 70g, carbon fiber 9g, KH550 coupling agent 0.5g, grind and mix evenly, keep warm at 170°C for one hour, 190°C ℃ for one hour to cure, the tensile strength is 155MPa, the resistance value is 13 μ Ω cm, and the thermal decomposition temperature is 412℃.

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Abstract

The invention discloses a conductive silver adhesive for a high-power LED (light-emitting diode). The conductive silver adhesive comprises the following components in parts by weight: 18 to 25 parts of base resin and curing agent, 0.5 to 2 parts of coupling agent, 65 to 80 parts of conducting particles and 1 to 10 parts of carbon fiber, wherein the proportion of the base resin and the curing agent is determined according to the stoichiometric ratio of reaction functional groups, i.e. 1:1; and the base resin is a mixture consisting of 40 to 80 percent of epoxy resin and 20 to 50 percent of fluorine-containing fusible and soluble polyamide-imide resin. The conductive silver adhesive has very high tensile strength, heat resistance and flame resistance and can work in a working environment with high temperature and high pressure, and the service life of electronic appliances can be obviously prolonged. Therefore, the conductive silver adhesive has very good application prospect.

Description

technical field [0001] The invention belongs to the field of microelectronic packaging materials, in particular to a conductive silver glue for high-power LED packaging. Background technique [0002] Conductive silver glue is a kind of conductive adhesive. After it is cured, it can connect a variety of conductive materials to form an electrical path, replacing the original welding process, and has been widely used in electronic products. At present, there are basically two types of conductive adhesives: one is intrinsic conductive adhesives, and the other is composite conductive adhesives. Intrinsically conductive adhesives are conjugated polymers whose molecular structure itself has conductive functions. Most of them are composed of compounds based on polyphenylene and polyacetylene. Although great progress has been made in research, their resistivity is high and their conductivity stability is poor. , the use value is very limited. Composite conductive adhesive is a high...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J179/08C09J9/02C09J11/04C08G73/14H01L33/56
Inventor 张利律微波孟宪铎李金辉王林张荣军牟秋红
Owner NEW MATERIAL INST OF SHANDONG ACADEMY OF SCI
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