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Curing agent of epoxy resin and synthesis method thereof

A technology for epoxy resin curing and compounding, which is applied in the field of high-performance epoxy resin curing agents, and can solve problems such as poor weather resistance, strong corrosion medium tolerance to be improved, and high exothermic temperature

Inactive Publication Date: 2012-12-19
HUNAN SHENLI IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resin also has its shortcomings: the cured epoxy resin has high crosslinking density and large internal stress, so it is brittle, has poor fatigue resistance, heat resistance, and impact resistance, and is difficult to meet engineering technical requirements; poor weather resistance , easy to pulverize; the medium resistance is average, and the resistance to strong corrosive media (strong acid, strong alkali, etc.) needs to be improved
The disadvantages are fast curing speed, high exothermic temperature, short operating time, large curing internal stress, high brittleness of the cured product, and poor impact resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Add polyetheramine Baxxodur TM EC301 460g (2mol), start stirring. Add 228g (1mol) of bisphenol A under stirring conditions, heat the material to 70-80°C, and keep warm until the bisphenol A is completely dissolved. Add 63.2 (2mol) g of paraformaldehyde with a main content of 95% under stirring conditions, and keep warm at 70-80°C until the paraformaldehyde is completely dissolved. The material is heated up to 95-100° C., and kept under reflux for 1-2 hours. Lower the temperature to 70-75°C, dehydrate by distillation under reduced pressure, control the vacuum degree to 50mmHg, the theoretical dehydration amount is 39.2g, and stop dehydration when the actual dehydration amount is 38.0g. Cool down to 40-50°C, and the product is obtained after discharging;

[0016] Amine value: 308mgKOH / g, active hydrogen equivalent: 120, yield: 94.9%.

[0017] Example: 2:

[0018] Add polyether amine JEFFAMINE ? HK-511 440g (2mol), start stirring. Add 228g (1mol) of bisphenol A un...

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PUM

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Abstract

The invention relates to a curing agent of epoxy resin and a synthesis method of the curing agent. The curing agent is prepared through Mannich reaction by using bisphenol A, an aldehyde compound and an ether amine compound as raw materials at a ratio of bisphenol A:the aldehyde compound:the ether amine compound of 1:(1-4):(1-4). The curing agent of epoxy resin prepared by the method has many benzene rings, phenolic structures, phenolic hydroxy groups, ether bonds and amino groups in the molecule. The benzene ring and the phenolic structure endue the cured product with higher mechanical strength and higher temperature resistance; the phenolic hydroxy group can accelerate the cure reaction so that the cure reaction can be carried out at a lower temperature; the ether bond can improve mechanical properties of the cured product so that the cured product has good flexibility. The product cured by the curing agent has good mechanical property, and also has good resistance to temperature, medium and aging.

Description

technical field [0001] The invention relates to an epoxy resin curing agent, in particular to a high-performance epoxy resin curing agent cured at room temperature. Background technique [0002] Epoxy resin is a kind of thermosetting polymer synthetic material with good adhesion, corrosion resistance, electrical insulation, high strength and other properties. It is widely used in the bonding of various metals and non-metals, corrosion-resistant coatings, electrical insulation materials, FRP / composite materials, etc. It plays an important role in electronics, electricity, machinery manufacturing, chemical anticorrosion, aerospace, shipping and other industrial fields, and has become an indispensable basic material in various industrial fields. However, epoxy resin also has its shortcomings: the cured epoxy resin has high crosslinking density and large internal stress, so it is brittle, has poor fatigue resistance, heat resistance, and impact resistance, and is difficult to m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62
Inventor 袁宏伟刘辉
Owner HUNAN SHENLI IND
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