Improved method for preparing silicon nitride anti-reflecting film of crystalline silicon solar cell
A technology of solar cells and anti-reflection films, applied in circuits, electrical components, gaseous chemical plating, etc., can solve the problems of insufficient passivation effect and anti-reflection effect, poor compactness of SiNx, etc., and improve the photoelectric conversion efficiency. , improve uniformity and density, and improve the effect of absorption
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[0020] Select the polysilicon raw silicon wafer with a resistivity of 0.5~6 and a crystal plane of (100), and the specific process is as follows:
[0021] 1. Wafer pretreatment:
[0022] (1) Chemical cleaning removes the surface damage of the silicon wafer and forms anti-reflection corrosion pits;
[0023] (2) The liquid phosphorus source diffuses to form a PN junction;
[0024] (3) Plasma etching to remove the PN junction at the edge of the silicon wafer;
[0025] (4) Secondary cleaning to remove the phosphosilicate glass on the surface of the silicon wafer;
[0026] 2. Deposition of SiN by plasma enhanced chemical vapor deposition (PECVD) x Anti-reflective coating, the coating process is:
[0027] Heat the furnace tube to a certain temperature, place the graphite boat filled with silicon wafers in the furnace tube, heat to the preset temperature, pump the cavity to a vacuum state, and feed a certain flow of NH 3 Pre-deposit the silicon wafer for 3 minutes, and feed NH a...
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