Tape casting slurry for laminated sheet type electronic component and preparation method for tape casting slurry

A technology for electronic components and casting slurry, which is applied to the field of casting slurry for laminated chip electronic components and its production, can solve the problem of increase in slurry viscosity, increase in green density of membrane, deterioration in membrane performance, etc. problem, to achieve the effect of enhanced ductility, increased density, and excellent dispersibility

Inactive Publication Date: 2013-01-16
SHENZHEN GUDIAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the deficiencies in the above-mentioned technologies, the present invention provides a casting slurry for laminated chip electronic components and its manufacturing method, which can solve the problems of a sharp increase in viscosity of the slurry and a sharp deterioration of the performance of the diaphragm caused by the addition of boron , at the same time, the resulting casting slurry has low viscosity, excellent dispersion, increased density of the film green body, and enhanced ductility

Method used

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  • Tape casting slurry for laminated sheet type electronic component and preparation method for tape casting slurry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A, by weight percentage ceramic powder 75%, castor oil 0.2%, ethanol 14.64%, butanone 9.76%, isohexanediol 0.2% and silane coupling agent 0.2% weighed by weight percentage, add ball mill together and mix 24 ±4 hours to obtain a uniform slurry;

[0036] B. After weighing 42.0% of ethanol, 28.0% of methyl ethyl ketone, 20% of polyvinyl butyral, 5% of triethylene glycol diisocaprylate and 5% of glycerol, the solvent and plasticizer Mix the binder, then add the binder while stirring at room temperature, and stir for 5±1 hours to obtain a uniform binder solution;

[0037] C. Add uniform binder solution B into A at a ratio of 1:2, and continue ball milling for 20±4 hours to obtain the casting slurry required by the patent;

[0038] D. Tape-cast the prepared slurry and dry at 50-60° C. for 5±1 minutes.

Embodiment 2

[0040] A. 70% by weight of ceramic powder, 0.3% of fish oil, 24.23% of propyl acetate, 4.97% of isobutanol, 0.4% of isohexanediol and 0.1% of silane coupling agent are weighed by weight, and then added to the ball mill for mixing 24±4 hours to obtain a uniform slurry;

[0041]B. After weighing 58.10% of propyl acetate, 11.90% of isobutanol, 18% of polyvinyl butyral, 8% of dioctyl phthalate and 4% of glycerol, the solvent and Mix the plasticizer, then add the binder while stirring at room temperature, and stir for 5±1 hours to obtain a uniform binder solution;

[0042] C. Add uniform binder solution B into A at a ratio of 1:2, and continue ball milling for 20±4 hours to obtain the casting slurry required by the patent;

[0043] D. Tape-cast the prepared slurry and dry at 55-80° C. for 5±1 minutes.

Embodiment 3

[0045] A. Ferrite powder 80% by weight, polyethylene glycol octyl phenyl ether 0.4%, ethanol 11.88%, butanone 6.92%, isohexanediol 0.5% and silane coupling agent 0.3% by weight After weighing, add it to the ball mill and mix for 24±4 hours to obtain a uniform slurry;

[0046] B. After weighing 45.0% ethanol, 30.0% methyl ethyl ketone, 19% polyvinyl butyral and 6% dibutyl phthalate by weight percentage, first mix the solvent and plasticizer, and then mix the solvent and plasticizer at room temperature Add the binder while stirring, and stir for 5±1 hours to obtain a uniform binder solution;

[0047] C. Add uniform binder solution B into A at a ratio of 1:2, and continue ball milling for 20±4 hours to obtain the casting slurry required by the patent;

[0048] D. Tape-cast the prepared slurry and dry at 50-60° C. for 5±1 minutes.

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Abstract

The invention discloses tape casting slurry for a laminated sheet type electronic component and a preparation method for the tape casting slurry. The tape casting slurry comprises 45 to 55 weight percent of ceramic or ferrite powder, 0.1 to 1.0 weight percent of dispersing agent, 30 to 48 weight percent of solvent, 3 to 8 weight percent of adhesive, 3 to 5 weight percent of plasticizer, 0.1 to 0.5 weight percent of 2-methyl-2,4-pentendiol serving as an addition agent a and 0.1 to 0.5 weight percent of silane coupling agent serving as an addition agent b. The 2-methyl-2,4-pentendiol is added, so that the problems that the viscosity of the slurry is rapidly increased, and the performance of a membrane is rapidly deteriorated because boric is added are solved; the silane coupling agent is added, so that the slurry is low in viscosity and high in dispersing performance, the green density of the membrane is increased, and the ductility is enhanced; and the finally prepared slurry is uniform, stable and suitable for large-scale production.

Description

technical field [0001] The invention relates to the technical field of manufacturing electronic components, in particular to a casting slurry for laminated electronic components and a manufacturing method thereof. Background technique [0002] Tape casting refers to a molding method in which solvents, dispersants, binders, plasticizers and other components are added to ceramic powder to obtain a uniformly dispersed and stable slurry, and a film of required thickness is obtained on a casting machine. . It has the following advantages: ① single-phase or multi-phase ceramic sheet materials can be prepared; ② small defect size; ③ small fluctuations in product composition, stable performance; ④ high production efficiency, continuous operation; Suitable for industrial production; ⑥Suitable for forming large thin-plate ceramic or metal parts, which are almost impossible or difficult to form by pressing or extrusion, but it is very easy to manufacture blanks of various sizes and sh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/26C04B35/00C04B35/622
Inventor 梁晓斌
Owner SHENZHEN GUDIAN ELECTRONICS
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