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Low-temperature low-stress electroless copper plating solution

An electroless copper plating, low-stress technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems affecting PCB performance, difficult bonding strength, large signal attenuation, etc., to achieve bright appearance, Low cost, good quality effect

Inactive Publication Date: 2013-04-03
SHAANXI NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the continuous thinning of printed board lines, it has become difficult to improve the bonding strength between the substrate and the chemical copper film by increasing the surface roughness of the substrate in the past.
If the surface roughness of the substrate is high, the copper interconnection line will produce large signal attenuation and low signal-to-noise ratio during high-frequency signal transmission, which will greatly affect the performance of the PCB.

Method used

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  • Low-temperature low-stress electroless copper plating solution
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Examples

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Effect test

Embodiment 1

[0029] Taking the preparation of electroless copper plating solution 1L of the present invention as an example, the raw materials used and their mass ratios are as follows:

[0030]

[0031] Above-mentioned electroless copper plating solution is to prepare according to the following method:

[0032] According to the mass ratio of the above raw materials, add copper sulfate pentahydrate and potassium sodium tartrate tetrahydrate into the beaker, add 900mL of distilled water until the solid is completely dissolved, then add formaldehyde, 5-hydroxytryptophan with a concentration of 0.4g / L, and a concentration of 0.4 g / L 1-(4-pyridyl)piperazine, 2 g / L nickel sulfate, 4 g / L N-cocoyl glutamic acid monosodium salt, 2.5 g NaOH for pH adjustment 12.5, stir evenly, dilute to 1L with distilled water, and prepare a low-temperature low-stress electroless copper plating solution.

Embodiment 2

[0034] Taking the preparation of electroless copper plating solution 1L of the present invention as an example, the raw materials used and their mass ratios are as follows:

[0035]

[0036] The preparation method of the above electroless copper plating solution is the same as that of Example 1.

Embodiment 3

[0038] Taking the preparation of electroless copper plating solution 1L of the present invention as an example, the raw materials used and their mass ratios are as follows:

[0039]

[0040] The preparation method of the above electroless copper plating solution is the same as that of Example 1.

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Abstract

The invention relates to a low-temperature low-stress electroless copper plating solution. The method is mainly as follows: an accelerator, an inhibitor, a nickel ion and an anionic surfactant are added into a basic system with copper sulphate as a main salt, potassium sodium tartrate tetrahydrate as a complexing agent and formaldehyde or glyoxalic acid as a reducing agent. With the method, an electroless copper coating with bright appearance, low stress, good quality and high bonding strength can be rapidly formed through deposition under the condition of low temperature, and the electroless copper plating solution provided by the invention has the advantages of stability, low cost and suitability for industrial application.

Description

Technical field [0001] The invention belongs to the technical field of printed circuit board (PCB) surface treatment, and is particularly an electroless copper plating solution with high deposition rate, good coating quality, low coating stress and stable plating solution at a lower temperature. Background technique [0002] Printed circuit board (PCB) has the advantages of high operational reliability, light weight, small size, and easy standardization. It is the core component of almost all electronic equipment. The electroless copper plating process is the key technology for metallization of printed circuits. With the continuous refinement of printed circuit board lines, it has become difficult to improve the bonding strength between the substrate and the chemical copper film by increasing the surface roughness of the substrate in the past. If the surface roughness of the substrate is high, the copper interconnect lines will produce greater signal attenuation and low sig...

Claims

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Application Information

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IPC IPC(8): C23C18/40
Inventor 王增林李喜荣李丽莎
Owner SHAANXI NORMAL UNIV
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