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Composite molding nano plate and preparation method thereof

A technology of composite mold and nano-board, applied in the direction of building components, heat preservation, etc., to achieve the effects of good flexibility, high combustion level, and ultra-low water absorption

Active Publication Date: 2013-04-24
湖北邱氏节能建材高新技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Existing building insulation boards, such as Chinese patent application number: 201210290547.0 (formwork integrated insulation board and its processing method); such as Chinese patent application number: 201220144731.X (a continuous foam insulation fireproof board); such as Chinese patent Application number: 201230106460.4 (polystyrene foam for heat insulation (EPS insulation board - black)); they mainly use materials such as styrene, gypsum, foaming agent, fiber, etc., but their thermal conductivity, combustion performance level, water absorption, Comprehensive properties such as tensile strength and flexibility need to be improved

Method used

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  • Composite molding nano plate and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0041] Composite molded nanoplates, which consist of styrene, deionized water, dibenzoyl peroxide (BPO), tert-butyl perbenzoate (T-BPB), hydroxyethyl cellulose (HEC), calcium hydroxyphosphate ( TCP), sodium pyrophosphate, pentane, sodium butylnaphthalene sulfonate and expandable graphite raw materials are produced by batch suspension polymerization process to form an expandable polymer, and then pre-foamed and molded into a board that is convenient for engineering construction type (i.e. composite molded nanoplate); the mass parts of each raw material are: 100 parts of styrene, 120 parts of deionized water, 0.4 parts of dibenzoyl peroxide (BPO), tert-butyl perbenzoate (T -BPB) 0.07 parts, hydroxyethyl cellulose (HEC) 0.1 parts, calcium hydroxyphosphate (TCP) 0.4 parts, sodium pyrophosphate 0.02 parts, pentane 8 parts, sodium butylnaphthalene sulfonate 8 parts, expandable graphite 1.0 share.

[0042] The styrene mentioned is produced by BASF (China) Co., Ltd.

[0043] The said ...

Embodiment 2

[0070] Basically the same as Example 1, the difference is that the mass parts of each raw material are different, the present embodiment: the mass parts of each raw material are: 100 parts of styrene, 120 parts of deionized water, dibenzoyl peroxide (BPO) 0.3 parts, tert-butyl perbenzoate (T-BPB) 0.08 parts, hydroxyethyl cellulose (HEC) 0.1 parts, hydroxycalcium phosphate (TCP) 0.5 parts, sodium pyrophosphate 0.02 parts, pentane 8 parts , 8 parts of sodium butylnaphthalene sulfonate, and 1.5 parts of expandable graphite.

[0071] Its preparation method is the same as that of Example 1 (only the mass parts of each raw material are different).

[0072] The composite molded nanoplate prepared in this embodiment is tested as follows:

[0073] 1. Thermal conductivity test: According to GB / T 10294 test, the experimental result is 0.0279 W / ﹙m*k﹚, which shows that the thermal conductivity of the present invention is low.

[0074] 2. Breaking bending load test: according to GB / T 8812...

Embodiment 3

[0082] Basically the same as Example 1, the difference is that the mass parts of each raw material are different, the present embodiment: the mass parts of each raw material are: 100 parts of styrene, 120 parts of deionized water, dibenzoyl peroxide (BPO) 0.4 parts, tert-butyl perbenzoate (T-BPB) 0.06 parts, hydroxyethyl cellulose (HEC) 0.1 parts, hydroxycalcium phosphate (TCP) 0.4 parts, sodium pyrophosphate 0.02 parts, pentane 8 parts , 8 parts of sodium butylnaphthalene sulfonate, and 1.2 parts of expandable graphite.

[0083] Its preparation method is the same as that of Example 1 (only the mass parts of each raw material are different).

[0084] The composite molded nanoplate prepared in this embodiment is tested as follows:

[0085] 1. Thermal conductivity test: According to GB / T 10294 test, the experimental result is 0.0279 W / ﹙m*k﹚, which shows that the thermal conductivity of the present invention is low.

[0086] 2. Breaking bending load test: according to GB / T 8812...

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Abstract

The invention belongs to the technical field of architectural heat-preservation materials. A composite molding nano plate is characterized in that the nano plate is prepared from the following raw materials in parts by mass: 100 parts of styrene, 120 parts of deionized water, 0.3-0.5 part of dibenzoyl peroxide, 0.04-0.08 part of t-butyl perbenzoate, 0.1-0.2 part of hydroxyethyl cellulose, 0.3-0.5 part of hydroxyapatite, 0.02 part of sodium pyrophosphate, 8 parts of pentane, 2-8 parts of sodium butylnaphthalenesulfonate, and 1.0-1.5 parts of graphite. The composite molding nano plate has the effects of nano pore diameter, low heat conductivity coefficient, good flexibility, good chemical resistance, high combustion level, high tensile strength and low water absorption, and is convenient for architectural heat-preservation engineering construction.

Description

technical field [0001] The invention belongs to the technical field of building thermal insulation materials, and in particular relates to a composite molded nanometer board and a preparation method thereof. Background technique [0002] In recent years, the method of using insulation panels on the walls of buildings to ensure the energy-saving performance of buildings has been more and more widely used. Existing building insulation boards, such as Chinese patent application number: 201210290547.0 (formwork integrated insulation board and its processing method); such as Chinese patent application number: 201220144731.X (a continuous foam insulation fireproof board); such as Chinese patent Application number: 201230106460.4 (polystyrene foam for heat insulation (EPS insulation board - black)); they mainly use materials such as styrene, gypsum, foaming agent, fiber, etc., but their thermal conductivity, combustion performance level, water absorption, Comprehensive properties ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/06C08F112/08C08F2/18C08K3/04C08J9/228C08J9/20C08J9/14E04B1/80
Inventor 邱杰儒
Owner 湖北邱氏节能建材高新技术股份有限公司
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