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CO2 cured alkaline phenolic resin and preparation method thereof

A phenolic resin and alkaline technology, which is applied in the field of reducing the viscosity of the adhesive at room temperature, can solve the problems of high resin viscosity, low bonding strength, and affecting production efficiency, and achieve the goals of reducing viscosity, increasing molecular weight, and high bonding strength Effect

Active Publication Date: 2013-04-24
SHENYANG RES INST OF FOUNDRY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Currently, the CO used in the domestic market 2 A general disadvantage of hardened alkaline phenolic resin is that the viscosity of the resin is relatively high, many of which exceed 150mPa s (25°C). It is not easy to mix the resin and silica sand evenly when making cores, and the performance is not good; some CO 2 The viscosity of hardened alkaline phenolic resin is low, but its bonding strength is also low, and it is prone to collapse when the mold is ejected, which affects production efficiency

Method used

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  • CO2 cured alkaline phenolic resin and preparation method thereof
  • CO2 cured alkaline phenolic resin and preparation method thereof
  • CO2 cured alkaline phenolic resin and preparation method thereof

Examples

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Effect test

Embodiment 1

[0024] Add 195kg of melted phenol and 300kg of formaldehyde solution (37%) into the reaction kettle, add 20kg of sodium hydroxide solution (50% concentration), heat up to 65°C at a rate of less than 1°C / min, and keep it for 30 minutes. Add 50kg of triethylene glycol and 80kg of potassium hydroxide solution (50%), increase the temperature to 100℃, and keep the temperature for 60min. Cool to 85°C, and dehydrate 50kg under reduced pressure at -0.06MPa~-0.08MPa pressure. Add 300kg of potassium hydroxide solution (50%). Cool down to 60°C, add 60kg of borax, and stir evenly. Cool down to 40°C, add 3 kg of γ-(2,3) epoxy(propoxy)propyltrimethoxysilane, stir evenly, and discharge.

Embodiment 2

[0026] Add 150kg of melted phenol, 30kg of bisphenol A, 250kg of formaldehyde aqueous solution (37%) and 20kg of paraformaldehyde into the reactor, add 20kg of sodium hydroxide solution (50%), and heat up to 65 at a rate of less than 1°C / min ℃, keep for 60min. Add 50kg furfuryl alcohol and 80kg potassium hydroxide solution (50%), raise the temperature to 100°C, and keep the temperature for 45min. Cooled to 85℃, dehydrated 30kg under reduced pressure at -0.06MPa~-0.08MPa pressure. Add 300kg of potassium hydroxide solution (50%). Cool down to 60°C, add 60kg of borax, and stir evenly. Cool down to 40°C, add 3 kg of γ-(2,3) epoxy (propoxy) propyl trimethoxysilane, stir evenly, and discharge.

Embodiment 3

[0028] Add 165kg of melted phenol, 15kg of resorcinol, 270kg of formaldehyde solution (37%) and 20kg of glyoxal into the reaction kettle, add 35kg of sodium hydroxide solution (50%), and heat up to a temperature of less than 1°C / min At 65°C, keep for 60 minutes. Add 35kg of furfuryl alcohol, 15kg of ethylene glycol, and 80kg of potassium hydroxide solution (50%), heat up to 100°C, and keep for 90min. Cooled to 85℃, dehydrated 40kg under reduced pressure at -0.06MPa~-0.08MPa pressure. Add 250kg of potassium hydroxide solution (50%). Cool down to 60°C, add 55kg of borax and 5kg of calcium hydroxide, and stir well. Cool down to 40°C, add 5 kg of γ-aminopropyltriethoxysilane, stir evenly, and discharge.

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Abstract

The invention aims to provide a CO2 cured alkaline phenolic resin and a preparation method thereof. The CO2 cured alkaline phenolic resin is characterized by being prepared from the following components in parts by weight: 150-200 parts of phenol compounds, 250-300 parts of aldehyde compounds, 30-50 parts of a modifier, 300-400 parts of 50% aqueous alkali, 50-70 parts of a hardening accelerating agent and 3-5 parts of a silane coupling agent. Compared with viscosity of 150mPa.s at the temperature of more than 25 DEG C of the CO2 cured alkaline phenolic resin in the prior art, the viscosity of the CO2 cured alkaline phenolic resin provided by the invention is reduced below 100mPa.s at the temperature of 25 DEG C. In addition, the CO2 cured alkaline phenolic resin can ensure that the strength of resin-bonded sand is high and the use performance is improved and can greatly facilitate the operation of sanding mixing during modeling and core making.

Description

Technical field [0001] The invention relates to a binder used in the process of casting production modeling and core making. The binder uses CO 2 Gas hardens. The invention also relates to a method for preparing the adhesive, in particular to a method for reducing the viscosity of the adhesive at room temperature. Background technique [0002] CO 2 Hardened alkaline phenolic resin is a new type of binder that has been used in domestic foundry production in the 1990s. CO 2 The hardened alkaline phenolic resin does not contain nitrogen, sulfur, and phosphorus elements, and has little adverse effect on the casting; the curing agent used is CO 2 Gas, less toxic and harmful gas, less environmental pollution, no need for expensive purification equipment for modeling and core making, and obvious advantages in environmental protection performance. In addition, CO 2 The curing process of hardened alkaline phenolic resin is simple, easy to operate, blowing CO 2 Gas hardening, short blowin...

Claims

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Application Information

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IPC IPC(8): C08L61/14C08K5/544C08K5/5435C08K5/5419C08G8/28
Inventor 谭锐李汉锟张海东李玲于志勇
Owner SHENYANG RES INST OF FOUNDRY