Preparation method of MoS2 composite thin film with high hardness and loss abrasion on surface of substrate
A technology of composite thin film and high hardness, which is applied in the direction of ion implantation plating, coating, metal material coating process, etc., can solve the problems of low friction coefficient and wear rate, high hardness, low hardness, etc., and achieve low wear rate, The effect of improving the binding force of the membrane base and enhancing the structure density
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Embodiment 1
[0034] In this embodiment, high-speed steel is used as the substrate, and the metal Ti primer layer, TiN transition layer, and Ti / MoS are sequentially deposited on the substrate surface by high-power pulse magnetron sputtering technology. 2 Composite film, the specific process is as follows.
[0035] Ultrasonic clean the substrate with acetone and alcohol water for 15 minutes respectively, dry it, place it in the chamber of high-power pulse magnetron sputtering vacuum coating equipment, and evacuate the chamber so that the vacuum degree of the chamber is lower than 3.0×10 -5 After Torr, perform the following steps:
[0036] (1) Introduce argon gas with a flow rate of 100 sccm into the cavity, open the vacuum baffle to keep the air pressure in the cavity at 8.0mTorr, apply a pulsed negative bias of -500V to the substrate, and argon glow etching for 30 minutes;
[0037] (2) The substrate frame is placed at the fixture position in front of the Ti target position, and the rotation ...
Embodiment 2
[0053] In this embodiment, the cemented carbide is used as the substrate, and the metal Ti primer layer, TiN transition layer, and Ti / MoS are sequentially deposited on the surface of the substrate by high-power pulse magnetron sputtering technology. 2 Composite film, the specific process is as follows.
[0054] Ultrasonic clean the substrate with acetone and alcohol water for 15 minutes respectively, dry it, place it in the chamber of high-power pulse magnetron sputtering vacuum coating equipment, and evacuate the chamber so that the vacuum degree of the chamber is lower than 3.0×10 -5 After Torr, perform the following steps:
[0055] (1) Inject argon gas with a flow rate of 100 sccm into the cavity, open the vacuum baffle to keep the air pressure in the cavity at 10.0 mTorr, apply a pulsed negative bias of -500V to the substrate, and perform argon glow etching for 30 minutes;
[0056] (2) The substrate frame is placed at the fixture position in front of the Ti target, and th...
Embodiment 3
[0061] In this embodiment, stainless steel is used as the substrate, and the high-power pulse magnetron sputtering technology is used to deposit the metal Ti primer layer, TiN transition layer, and Ti / MoS 2 Composite film, the specific process is as follows.
[0062] Ultrasonic clean the substrate with acetone and alcohol water for 15 minutes respectively, dry it, place it in the chamber of high-power pulse magnetron sputtering vacuum coating equipment, and evacuate the chamber so that the vacuum degree of the chamber is lower than 3.0×10 -5 After Torr, perform the following steps:
[0063] (1) Introduce argon gas with a flow rate of 100 sccm into the chamber, open the vacuum baffle to keep the air pressure in the chamber at 8.5mTorr, apply a pulsed negative bias of -500V to the substrate, and perform argon glow etching for 30 minutes;
[0064] (2) The substrate frame is placed at the fixture position in front of the Ti target, and the rotation is turned on, and argon gas wit...
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