Preparation method of copper/modal fiber composite material

A modal fiber and composite material technology is applied in the field of preparation of copper/modal fiber composite materials, which can solve the problems of heavy wearability, high copper fiber density and high cost, and achieve the effect of reducing costs.

Inactive Publication Date: 2013-04-24
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Among all conductive fibers, inorganic copper fibers have the best conductivity and the lowest resistivity, less than 10 -5 , but th

Method used

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  • Preparation method of copper/modal fiber composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Wash the modal fiber cloth with a weight of 1.3g and an area of ​​10cm×10cm with deionized water, dry it, place it in an aqueous solution of citric acid with a concentration of 10%, soak it for 24 hours, take it out, and bake it at 100°C for 3 hours, cooling, washing, and drying to obtain surface-modified modal fibers.

[0020] Put the modified modal fiber in a copper sulfate aqueous solution with a concentration of 50g / L for 12 hours, take it out, wash it, put it in a sodium borohydride aqueous solution with a temperature of 0°C and a concentration of 0.1g / L for 10 minutes, take it out, Wash to obtain surface-activated modal fibers.

[0021] Dissolve 5g of copper sulfate, 8g of sodium potassium tartrate, 5g of ethylenediaminetetraacetic acid disodium salt, 1g of dimethylaminoborane, and 0.1g of polyethylene glycol (relative molecular weight 4000) in 500mL of deionized water. After the dissolution is complete, add deionized water until the volume of the solution is 1 L...

Embodiment 2

[0024] Wash the modal fiber cloth with a weight of 1.3g and an area of ​​10cm×10cm with deionized water, dry it, place it in an aqueous solution of malic acid with a concentration of 25%, soak it for 12 hours, take it out, and bake it at 120°C for 3 hours, cooling, washing, and drying to obtain surface-modified modal fibers.

[0025] Put the modified modal fiber in a copper sulfate aqueous solution with a concentration of 100g / L for 3 hours, take it out, wash it, put it in a sodium borohydride aqueous solution with a temperature of 5°C and a concentration of 0.3g / L for 5 minutes, take it out, Wash to obtain surface-activated modal fibers.

[0026] Dissolve 8g of copper sulfate, 10g of sodium potassium tartrate, 8g of ethylenediaminetetraacetic acid disodium salt, 1.5g of dimethylaminoborane, and 0.2g of polyethylene glycol (relative molecular weight 4000) in 500mL of deionized water. Add deionized water until the volume of the solution is 1 L to obtain a copper electroless pl...

Embodiment 3

[0029] Wash the modal fiber cloth with a weight of 1.3g and an area of ​​10cm×10cm with deionized water, dry it, place it in a methanol solution of tartaric acid with a concentration of 15%, soak it for 18 hours, take it out, and bake it at 100°C for 3 hours, cooling, washing, and drying to obtain surface-modified modal fibers.

[0030] Put the modified modal fiber in an aqueous copper sulfate solution with a concentration of 80g / L for 6 hours, take it out, wash it, put it in an aqueous solution of sodium borohydride at a temperature of 3°C and a concentration of 0.2g / L for 8 minutes, take it out, Wash to obtain surface-activated modal fibers.

[0031] Dissolve 6g of copper sulfate, 9g of sodium potassium tartrate, 6g of ethylenediaminetetraacetic acid disodium salt, 1.2g of dimethylaminoborane, and 0.15g of polyethylene glycol (relative molecular weight 4000) in 500mL of deionized water. Add deionized water until the volume of the solution is 1 L to obtain a copper electrole...

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Abstract

The invention belongs to the field of conductive composite fiber materials and relates to a preparation method of a copper/modal fiber composite material. The preparation method provided by the invention refers to covering a copper-plated layer on a surface of a modal fiber substrate, and the specific processes comprise modal fiber washing, drying, surface modification, copper ion absorption and reduction, chemical copper plating and the like. The composite material provided by the invention has the following advantages: (1) the mechanical property is good, and the intensity is better than that of the copper/cotton composite material; (2) the associativity between the copper-plated layer and modal fibers is good and can pass the test of a Scotch adhesive tape in the Minnesota Mining and Manufacturing (3M) Company; (3) the electric conductivity is high and is 0.01-0.3 times that of blocky pure copper; and (4) the absorption capacity is strong and is 50% higher than that of the copper/cotton fiber composite material. The conductive composite fiber material provided by the invention can be extensively applicable to the field of industry, such as antistatic clothing, solar battery electrode, electromagnetic shielding and radar absorbing, and national defence.

Description

technical field [0001] The invention belongs to the technical field of conductive composite fiber materials, and in particular relates to a preparation method of copper / modal fiber composite materials. Background technique [0002] Modal fiber is a cellulose regenerated fiber of viscose fiber with high wet modulus. The raw material of the fiber is wood pulp made of spruce and beech, which is processed into fiber through a special spinning process. The raw materials of the fiber are all natural materials, which belong to cellulose fiber like cotton, are harmless to human body, can be decomposed naturally, and are harmless to the environment. Modal fiber can be processed by traditional cellulose fiber pretreatment, bleaching and dyeing processes. The color of its fabric is better, bright and bright, and it can be mercerized with cotton blending, and the dyeing is even and dense, and the color remains long-lasting. The tougher and stronger natural fiber-based conductive comp...

Claims

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Application Information

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IPC IPC(8): C23C18/20C23C18/38
Inventor 吕银祥
Owner FUDAN UNIV
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