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Epoxy compound with nitrogen-containing ring

A technology of epoxy compound and curable composition, which is applied in the direction of organic chemistry, can solve the problems of insufficient satisfaction and limited application range, and achieve the effects of good filling, large degree of freedom, and stable crosslinking density

Inactive Publication Date: 2013-04-24
NISSAN CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, depending on the application used, there are also fields where molding cannot be performed unless the composition is not liquid, such as casting molding. Conventional crystalline epoxy resins are limited to applications using solid materials such as transfer molding, so the range of use is limited.
[0006] In addition, conventional liquid epoxy resins used in liquid molding such as casting molding are used for potting, coating, Casting, etc., but the requirements in the fields of bonding, injection molding, sealing, molding, lamination, etc. have recently become more and more stringent, and the requirements for improving cured properties such as heat resistance cannot fully meet the requirements.

Method used

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  • Epoxy compound with nitrogen-containing ring
  • Epoxy compound with nitrogen-containing ring
  • Epoxy compound with nitrogen-containing ring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0112]75 g of hydantoin, 750 ml of N,N-dimethylformamide, and 332 g of potassium carbonate were added to a 3 L flask, and 347 g of 5-bromopentene was added dropwise at room temperature while stirring under a nitrogen atmosphere. After completion of the dropwise addition, it was heated at an internal temperature of about 90° C. for 24 hours. After cooling the reactor at room temperature, the contents were filtered, and the obtained filtrate was washed with water three times and then concentrated to obtain a red-black liquid. This liquid was purified with a silica gel column to obtain 144 g of bis(4-pentenyl)hydantoin (red liquid, yield 81%) as an intermediate.

[0113] Next, 144 g of di(4-pentenyl)hydantoin and 6 L of dichloromethane were added to a 10 L flask, and 784 g of m-chloroperoxybenzoic acid was added while cooling to 3° C. under a nitrogen atmosphere, and stirred for 7 hours. Then, 2.8 L of 10% sodium sulfite aqueous solution was used to treat excess peracid in the r...

Embodiment 2

[0116] To 24.51 g of bis(4,5-epoxypentyl)hydantoin (epoxy value = 7.26) obtained in Example 1, MH-700 (manufactured by Shin Nippon Chemical Co., Ltd., the composition of which is 29.2 g of 4-methylhexahydrophthalic anhydride and hexahydrophthalic anhydride in a molar ratio of 70:30, stirring and defoaming for 30 minutes while heating in an oil bath at 90°C . Add 245 mg of Hikolin PX-4ET (manufactured by Nippon Chemical Industry Co., Ltd., tetrabutyldiethyl dithiophosphate), stir to defoam, and pour into a glass plate sandwiched with 3mm silicone rubber (release agent: SR Between -2410 (Toray Dow Corning Co., Ltd. treatment), pre-curing: 100° C. for 2 hours, post-curing: 150° C. for 5 hours, was cured.

[0117] The physical properties of the obtained cured product are as follows: flexural strength: 169.4MPa, flexural modulus of elasticity: 3369MPa, bending at break: 13.59mm, linear expansion rate (30-80°C): 65.5ppm / °C, Tg(TMA) : 126.5°C, transmittance (400nm): 22.0%, boiling ...

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Abstract

Provided is an epoxy compound that can be heat-cured into a cured product with both high transparency and high bending strength, whilst maintaining good handling properties in a liquid state. Also provided is a production method for a composition using said epoxy compound. Specifically provided are an epoxy compound indicated by a formula (1) (wherein n1 and n2 each indicate an integer of 2-6, n3 and n4 each indicate an integer of 2, n5 and n6 each indicate an integer of 1, and R4-R7 are alkyl groups with 1-10 hydrogen or carbon atoms. X1 indicates a group indicated by formulas (2-4) (wherein R1-R4 indicate alkyl groups with 1-10 hydrogen or carbon atoms, etc.)) and a curable composition that includes said epoxy compound and a curing agent.

Description

technical field [0001] The present invention relates to thermosetting epoxy compounds. Furthermore, it relates to a thermally polymerizable resin composition useful for obtaining a cured product having excellent characteristics such as high adhesion to a substrate, high transparency (transparency to visible light), hard coat property, and high heat resistance (Resin compositions for electronic materials and optical materials) and methods for producing cured products thereof (composite cured products). Background technique [0002] Until now, epoxy resins have been widely used in the field of electronic materials as epoxy resin compositions combined with curing agents. [0003] In the field of such electronic materials, for example, high refractive index layers of antireflection films (antireflection films for liquid crystal displays, etc.), optical films (reflectors, etc.), sealing materials for electronic parts, printed wiring boards, interlayer For applications such as i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07D405/14C08G59/26
CPCC08G59/26C07D405/14C08G59/4284C08G59/4215C08G59/3245
Inventor 笠井干生武山敏明远藤勇树
Owner NISSAN CHEM CORP
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