Copper super-hydrophobic surface with decay resistance and preparation method thereof
A corrosion-resistant and super-hydrophobic technology, applied in special surfaces, chemical instruments and methods, and devices for coating liquids on surfaces, etc., can solve the problems of molecular failure, acid insufficiency, easy detachment of hydrophobic films, etc., and achieve good stability. high performance, simple method and good hydrophobicity
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Embodiment 1
[0028] The following method is used to prepare a corrosion-resistant copper micro-array superhydrophobic material:
[0029] (1) Select copper sheet as the metal substrate, and degrease and pickle the surface;
[0030] (2) Put the metal substrate treated in step (1) in PdCl with a concentration of 0.15g / L 2 Activation treatment in solution;
[0031] (3) Put the metal substrate activated in step (2) into the chemical deposition solution for chemical deposition. The composition and concentration of the chemical deposition solution are: copper sulfate 0.05 mol / L, nickel sulfate 0.008 mol / L, lemon Trisodium acid 0.08mol / L, boric acid 0.5mol / L, sodium hypophosphite 0.4 mol / L, and polyethylene glycol 15ppm, adjust pH to 9 with sodium hydroxide, chemical deposition temperature is 50°C, chemical deposition time 25min;
[0032] (4) The metal plated sheet obtained by chemical deposition in step (3) is washed with deionized water, dried, and then placed in 0.015mol / L n-hexadecanthane s...
Embodiment 2
[0042] According to the method of Example 1, the concentration of the n-hexadecanethiol solution is changed to 0.025mol / L, and the contact angle between the surface of the prepared corrosion-resistant copper micro-array superhydrophobic material and water is greater than 150°, and the rolling angle is greater than 150°. less than 10°.
[0043]
Embodiment 3
[0045] The following method is used to prepare a corrosion-resistant copper micro-array superhydrophobic material:
[0046] (1) Aluminum sheet is selected as the metal substrate, and its surface is degreased and pickled;
[0047] (2) Put the metal substrate treated in step (1) in 0.35g / L PdCl 2 Activation treatment in solution;
[0048](3) Put the metal substrate activated in step (2) into the chemical deposition solution for chemical deposition. The composition and concentration of the chemical deposition solution are: copper chloride 0.02 mol / L, nickel chloride 0.01 mol / L , malic acid 0.08mol / L, boric acid 0.2mol / L, sodium hypophosphite 0.2mol / L, and polypropylene glycol 5ppm, adjust the pH to 8 with potassium hydroxide, the temperature of chemical deposition is 20°C, and the chemical deposition time is 60min ;
[0049] (4) The metal plated sheet obtained by chemical deposition in step (3) was washed with deionized water, dried, and then placed in a 0.01mol / L n-octadecyl ...
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