Method for chemically plating nickel at textile surface without using palladium

Abstract

The invention relates to a method for chemically plating nickel at textile surface without using palladium; the method comprises the following steps of: (1), carrying out roughening treatment on the textile surface; (2), adding acetic acid solution drop by drop into chitosan liquid, at the end of the dripping process, stirring, de-foaming by ultrasonic wave, dripping glutaraldehyde solution, stirring, reacting, obtaining cross linking modified chitosan CCTS, and keeping on stirring; (3), immersing the textile into CCTS solution, taking out the textile, roll compacting, and baking to obtain the pretreated textile; and (4), immersing the textile into nickel salt solution, activating, drying, immersing into boron hydride salt solution, reducing, drying, and then carrying out chemical nickel plating in a chemical nickel system, finally the product is obtained. By adopting the method, the raw material cost of the chemical metal plating at the textile surface is reduced, the noble metal pollution is reduced, the using property of the textile is improved, and the shielding effectiveness of the prepared textile is 50-70dB within the range from 300KHz to 3000MHz, and therefore the method has an excellent practical prospect.

Description

technical field [0001] The invention belongs to the field of preparation of metallized functional textiles, in particular to a method for palladium-free electroless plating of metal nickel on the surface of textiles. Background technique [0002] The electroless plating method is one of the main methods to prepare metallized functional textiles. Electroless plating requires the help of a reducing agent to reduce and deposit metal ions in solution on a non-conductive substrate near the surface of the adsorbed catalytically active substance. Ordinary textiles do not have electrical conductivity, especially for chemical fiber textiles, the surface lacks active groups and catalytic centers, so pretreatment and activation treatment before electroless plating are essential steps, which will directly affect the deposition quality of subsequent electroless plating And the bonding fastness between the metal layer and the textile matrix even affects the original flexible style of the...

AI Technical Summary

Problems solved by technology

This method is likely to cause the following problems: (1) Cross-contamination between the components of each solution. If the water washing is insufficient, the solution is easily carried into the next step; if the washing degree is too large, the formed sensitization and activation layer has been destroyed. , affecting the deposition quality of the metal coating

(2) The price of noble metal salt in the activation solution is relatively high, and there is a problem of poor stability, which virtually increases the cost of the electroless plating process

(3) SnCl 2 The sensitized hydrolysis film mainly relies on physical adsorption to combine with the surface of polyester and polyamide fabrics. After the subsequent activation and electroless plating process, the metal bonding fastness is not enough, and the performance of washing and friction resistance is poor.

There are also some reports on electroless plating using CTS and its derivatives as pretreatment agents for non-metallic materials. However, due to the semi-rigidity caused by CTS intermolecular and intramolecular hydrogen bonds affecting its coordination effect, the current research is only focused on adsorption. Pb 2+ post-activation process