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Porous graphene/polymer composite structure and preparation method and application thereof

A porous graphene and composite structure technology, applied in the field of nanomaterials, can solve the problems of high price, low thermal conductivity, large amount of addition, etc., and achieve the effect of low cost, wide source of raw materials, and simple process

Active Publication Date: 2013-06-12
苏州格瑞丰纳米科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, commonly used thermal conductive fillers include silver powder, copper powder, nickel powder, aluminum oxide, boron nitride and graphite, etc., but they often exist or the price is high, or the thermal conductivity is low, or the amount added is too large, etc. shortcoming

Method used

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  • Porous graphene/polymer composite structure and preparation method and application thereof
  • Porous graphene/polymer composite structure and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The preparation method of this high thermal conductivity porous graphene / polymer composite material of embodiment 1 comprises:

[0028] Take 0.5 g of high-quality porous graphene, ultrasonically disperse it in ethanol for 1 h, add 4.5 g of high-density polyethylene powder and stir at high speed for 1 h, filter it with suction, dry it, and mold it to obtain a graphene / high-density polyethylene composite material.

Embodiment 2

[0029] The preparation method of embodiment 2 this high thermal conductivity porous graphene / polymer composite material comprises:

[0030] Take 2kg of high-quality porous graphene and 20kg of high-density polyethylene and put them into a twin-screw extruder at 200°C to stir and extrude, cool and granulate to obtain a black compound.

Embodiment 3

[0031] Embodiment 3 The preparation method of this high thermal conductivity porous graphene / polymer composite material comprises:

[0032] Take 10 g of high-quality porous graphene and disperse it in 2000 ml of xylene, add 100 g of high-density polyethylene powder and stir at 120 ° C, and distill under reduced pressure to obtain a composite.

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PUM

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Abstract

The invention discloses a porous graphene / polymer composite structure, and a preparation method and application thereof. The composite structure mainly comprises a compound formed by porous graphene and more than one polymer and / or polymer monomer. The preparation method comprises the following steps of: compounding polymers and / or polymer monomers with porous graphene to form a target product, wherein the compounding manner comprises single-screw / double-screw fusing processing, injection molding, blow molding, melt spinning, solution spinning, electrostatic spinning, electrostatic spraying, powder metallurgy, liquid mixing or high speed mechanical stirring dispersion. The invention is simple in process, wide in source of raw materials, easy to implement in large scale, low in cost, safe, environment-friendly and free from toxic and harmful wastes, and the product obtained is excellent in thermal and electric properties, and has wide application prospect in the fields of heat conduction, radiation, electric conduction, anti-static electricity, electromagnetic shielding and the like.

Description

technical field [0001] The invention particularly relates to a porous graphene / polymer composite structure, its preparation method and application, and belongs to the field of nanomaterial science and technology. Background technique [0002] High-performance polymer composites have huge application space in the electronics industry and building materials industry. For example, high thermal conductivity polymers have been used as thermal interface materials such as thermal adhesives and heating pipes. High thermal conductivity polymers are generally prepared by adding thermal conductivity fillers In polymers, thermally conductive fillers are channeled through the mixing process to obtain high thermal conductivity compounds. At present, commonly used thermal conductive fillers include silver powder, copper powder, nickel powder, aluminum oxide, boron nitride and graphite, etc., but they often exist or the price is high, or the thermal conductivity is low, or the amount added ...

Claims

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Application Information

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IPC IPC(8): C08K7/24C08L23/06C08L63/02C08L83/04
Inventor 刘立伟邱胜强李伟伟魏相飞吴丽琼高嵩
Owner 苏州格瑞丰纳米科技有限公司
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