Method of preparing copper-zinc tin-sulphur solar cell absorbed layer thin film
A solar cell, copper-zinc-tin-sulfur technology, applied in coatings, circuits, electrical components, etc., can solve the problems of high equipment requirements and cumbersome stack sputtering process, and achieve good repeatability, easy operation, and controllability strong effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2013-06-19
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to a method for preparing a thin film of an absorbing layer of a solar cell, in particular to a method for preparing a thin film of an absorbing layer of a copper-zinc-tin-sulfur solar cell. Background technique
[0002] Thin-film solar cells have become one of the promising photovoltaic technologies due to their advantages such as less consumables, low price, easy large-scale production, deposition on flexible substrates, and easy building-integrated applications. The direct narrow bandgap semiconductor material with 1.4-1.6eV is considered to be an ideal solar cell absorber thin film material, and the current commercial non-silicon-based thin film solar cells are mainly based on CdTe or Cu(In,Ga)Se 2 (CIGS for short), but the toxicity of Cd and the scarcity of In limit the application and development of these materials in the field of solar cells.
[0003] Copper zinc tin sulfur (i.e. Cu 2 ZnSnS 4 , referred to as CZTS) semic...
Examples
Embodiment 1
[0027] 1) Substrate preparation: Soak the molybdenum-coated soda-lime glass substrate (SLG) in acetone, alcohol, deionized water in sequence, clean it ultrasonically, and dry it with nitrogen gas for later use;
[0028] 2) Preparation of CuZnSn metal precursor thin film: a DC magnetron sputtering system was used, and Cu-Zn-Sn alloy with a size of 50×4mm was used as a target for single-target sputtering, and the vacuum degree was 3.5×10 -4 More than Pa, the initiation argon gas flow rate is 45sccm, the initiation pressure is 1.2Pa, the sputtering power is 30W, the working pressure is 1.0Pa, and the sputtering time is 50min, and the thickness obtained on the surface of the above-mentioned molybdenum-coated soda-lime glass substrate is 600nm uniform and dense CuZnSn metal precursor film;
[0029] 3) Vacuum vulcanization of CuZnSn metal precursor thin film: Put the molybdenum-coated soda-lime glass substrate with CuZnSn metal precursor thin film sputtered on the surface and approp...
Embodiment 2
[0031] Embodiments 2-3: basically the same as Embodiment 1, only the working air pressure is different, the working air pressure of Embodiment 2 is 0.7Pa, and the working air pressure of Embodiment 3 is 0.3Pa.
Embodiment 4
[0032] Examples 4-5: are basically the same as Example 1, only the sputtering power is different, the sputtering power of Example 4 is 20W, and the sputtering power of Example 5 is 50W.