Mixed additive for removing internal stress of electrolytic copper foil and method for producing low-stress copper foil

A technology of mixed additive and electrolytic copper foil, applied in the field of mixed additive, can solve the problems of increased surface roughness, difficulty, decreased tensile strength and elongation, etc., to achieve the effect of easy control of production process and stable product quality

Active Publication Date: 2013-06-26
SHANDONG JINBAO ELECTRONICS
View PDF5 Cites 26 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, it will lead to a significant decrease in tensile strength and elongation and an increase in surface roughness
[0005] In the actual production of electrolytic copper

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mixed additive for removing internal stress of electrolytic copper foil and method for producing low-stress copper foil
  • Mixed additive for removing internal stress of electrolytic copper foil and method for producing low-stress copper foil
  • Mixed additive for removing internal stress of electrolytic copper foil and method for producing low-stress copper foil

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0046] Example 1

[0047] In this embodiment, a mixed additive for eliminating internal stress of electrolytic copper foil, the raw materials contained in each liter of mixed additive solution are:

[0048] 1.5 mg of medium-molecular gelatin (Glue) with a molecular weight of 10000-20000, 1.22 mg of low-molecular-weight hydroxyethyl cellulose (HEC) with a molecular weight of 5000-15000 and liquid additives, which are added at a rate of 85 ml / min.

[0049] The above liquid additives, each liter of solution contains:

[0050] Sodium dimercaptodipropane sulfonate (SPS) 0.3 g, sodium dimethyl-dithioformamide sulfonate (DPS) 0.2 g, polyethylene glycol (PEG) 0.1 g, ethylene thiourea (N) 0.06 g, five Aminotetrazolium (TA) 0.03 g and hydrochloric acid (HCl) 30 g, the quality of the raw materials used are all analytically pure;

[0051] The preparation method of the above liquid additives:

[0052] Take the preparation of 1L of this liquid additive as an example

[0053] 1) First, take 200ml of wa...

Example Embodiment

[0060] Example 2

[0061] The difference between this embodiment and embodiment 1 is:

[0062] In this embodiment, a mixed additive for eliminating internal stress in electrolytic copper foil, the raw materials contained in each liter of the mixed additive solution are:

[0063] 1.8 mg of medium-molecular gelatin (Glue) with a molecular weight of 10000-20000, 1.5 mg of low-molecular-weight hydroxyethyl cellulose (HEC) with a molecular weight of 5000-15000 and liquid additives, which are added at a rate of 90 ml / min.

[0064] The above liquid additives, each liter of solution contains:

[0065] Sodium dimercaptodipropane sulfonate (SPS) 0.5 g, sodium dimethyl-dithioformamide sulfonate (DPS) 0.4 g, polyethylene glycol (PEG) 0.3 g, ethylene thiourea (N) 0.09 g, five Aminotetrazolium (TA) 0.06 g and hydrochloric acid (HCl) 40 g, the quality of the raw materials used are analytically pure.

Example Embodiment

[0066] Example 3

[0067] The difference between this embodiment and embodiment 1 is:

[0068] In this embodiment, a mixed additive for eliminating internal stress in electrolytic copper foil, the raw materials contained in each liter of the mixed additive solution are:

[0069] 2.6 mg of gelatin (Glue) with a molecular weight of 10000-20000, 2.5 mg of low-molecular-weight hydroxyethyl cellulose (HEC) with a molecular weight of 5000-15000 and liquid additives, which are added at a rate of 100 ml / min.

[0070] The above liquid additives, each liter of solution contains:

[0071] Sodium dimercaptodipropane sulfonate (SPS) 0.2 g, sodium dimethyl-dithioformamide sulfonate (DPS) 0.5 g, polyethylene glycol (PEG) 0.06 g, ethylene thiourea (N) 0.03 g, five Aminotetrazolium (TA) 0.08 g and hydrochloric acid (HCl) 60 g, the quality of the raw materials used are analytically pure.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Glossaaaaaaaaaa
Login to view more

Abstract

The invention relates to a mixed additive for removing internal stress of an electrolytic copper foil and a method for producing a low-stress copper foil and belongs to the technical field of production of a high-precision electrolytic copper foil. The mixed additive for removing internal stress of the electrolytic copper foil comprises gelatin, hydroxyethyl cellulose and liquid additive. The method for producing the low-stress copper foil by using the mixed additive comprises the steps of preparing high-purity cathode copper and sulfuric acid into mixed solution of sulfuric acid and copper sulfate at 60-95 DEG C under the condition of stirring in the presence of air, wherein Cu<2+> is 85-100g/L and H2SO4 is 100-120g/L; adjusting the temperature of electrolyte to 45-60 DEG C and the flow to 50-70m<3>/h; adding 20-50mg/L of Cl<->, adding the mixed additive, with a drum titanium tube which continuously rotates as a cathode and arc titanium as an anode, carrying out copper electrolytic deposition and lastingly stripping to obtain 12-70 microns copper foil under the condition of the direct current of which the current density is 55-70A/dm<2>. The thickness of the copper foil is controlled by adjusting the rotation speed of the cathode; and the obtained copper foil has excellent performances.

Description

technical field [0001] The invention relates to a mixed additive for eliminating internal stress of electrolytic copper foil and a method for producing low-stress copper foil, belonging to the technical field of high-precision electrolytic copper foil production technology. Background technique [0002] With the increasing amount of various types of information processing, people have put forward higher and higher requirements for the information processing capabilities of electronic products. As an important part of electronic products, printed circuit boards (PCBs) require high reliability substrate materials. Excellent properties such as high moisture resistance, high heat resistance, high dielectric properties, and high dimensional stability. As the basic raw material of printed circuit board (PCB) and copper clad laminate (CCL), electrolytic copper foil needs to meet the normal temperature (23°C), high temperature (180°C) elongation, peel strength and other properties, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C25D3/38C25D7/06
Inventor 杨祥魁徐策王其伶刘建广马学武李忠洋王涛
Owner SHANDONG JINBAO ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products