Mixed additive for removing internal stress of electrolytic copper foil and method for producing low-stress copper foil
A technology of mixed additive and electrolytic copper foil, applied in the field of mixed additive, can solve the problems of increased surface roughness, difficulty, decreased tensile strength and elongation, etc., to achieve the effect of easy control of production process and stable product quality
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[0046] Example 1
[0047] In this embodiment, a mixed additive for eliminating internal stress of electrolytic copper foil, the raw materials contained in each liter of mixed additive solution are:
[0048] 1.5 mg of medium-molecular gelatin (Glue) with a molecular weight of 10000-20000, 1.22 mg of low-molecular-weight hydroxyethyl cellulose (HEC) with a molecular weight of 5000-15000 and liquid additives, which are added at a rate of 85 ml / min.
[0049] The above liquid additives, each liter of solution contains:
[0050] Sodium dimercaptodipropane sulfonate (SPS) 0.3 g, sodium dimethyl-dithioformamide sulfonate (DPS) 0.2 g, polyethylene glycol (PEG) 0.1 g, ethylene thiourea (N) 0.06 g, five Aminotetrazolium (TA) 0.03 g and hydrochloric acid (HCl) 30 g, the quality of the raw materials used are all analytically pure;
[0051] The preparation method of the above liquid additives:
[0052] Take the preparation of 1L of this liquid additive as an example
[0053] 1) First, take 200ml of wa...
Example Embodiment
[0060] Example 2
[0061] The difference between this embodiment and embodiment 1 is:
[0062] In this embodiment, a mixed additive for eliminating internal stress in electrolytic copper foil, the raw materials contained in each liter of the mixed additive solution are:
[0063] 1.8 mg of medium-molecular gelatin (Glue) with a molecular weight of 10000-20000, 1.5 mg of low-molecular-weight hydroxyethyl cellulose (HEC) with a molecular weight of 5000-15000 and liquid additives, which are added at a rate of 90 ml / min.
[0064] The above liquid additives, each liter of solution contains:
[0065] Sodium dimercaptodipropane sulfonate (SPS) 0.5 g, sodium dimethyl-dithioformamide sulfonate (DPS) 0.4 g, polyethylene glycol (PEG) 0.3 g, ethylene thiourea (N) 0.09 g, five Aminotetrazolium (TA) 0.06 g and hydrochloric acid (HCl) 40 g, the quality of the raw materials used are analytically pure.
Example Embodiment
[0066] Example 3
[0067] The difference between this embodiment and embodiment 1 is:
[0068] In this embodiment, a mixed additive for eliminating internal stress in electrolytic copper foil, the raw materials contained in each liter of the mixed additive solution are:
[0069] 2.6 mg of gelatin (Glue) with a molecular weight of 10000-20000, 2.5 mg of low-molecular-weight hydroxyethyl cellulose (HEC) with a molecular weight of 5000-15000 and liquid additives, which are added at a rate of 100 ml / min.
[0070] The above liquid additives, each liter of solution contains:
[0071] Sodium dimercaptodipropane sulfonate (SPS) 0.2 g, sodium dimethyl-dithioformamide sulfonate (DPS) 0.5 g, polyethylene glycol (PEG) 0.06 g, ethylene thiourea (N) 0.03 g, five Aminotetrazolium (TA) 0.08 g and hydrochloric acid (HCl) 60 g, the quality of the raw materials used are analytically pure.
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