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High-thermal conductivity diamond/copper composite material applicable to wide temperature range and method

A composite material and diamond technology, applied in the field of thermal management material preparation, can solve the problems of affecting the performance stability of the system, unable to achieve satisfactory results, limited heat dissipation capacity, etc. Effect

Inactive Publication Date: 2013-07-03
GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the thermal conductivity is low, and in some places where the heat is concentrated, the heat dissipation capacity is limited, and satisfactory results cannot be achieved.
Especially in special application environments such as low temperature, there are some special changes in material properties, which limit the application and affect the performance stability of the entire system.

Method used

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  • High-thermal conductivity diamond/copper composite material applicable to wide temperature range and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Raw material: diamond grain size 200 μm, crystal form: hexahedron, copper matrix: CuCr (Cr1wt%).

[0037] The diamond particles and the paraffin-based binder are prepared according to the volume ratio of 75:25; the mixer is mixed evenly, and the uniformly mixed powder is prepared on the press to prepare the preform body; after the preform body is air-dried, the Degreasing and sintering are carried out under a hydrogen atmosphere; put the sintered preform into a graphite mold, put it into a pressure infiltration furnace to evacuate, and raise the temperature at the same time; the vacuum degree in the vacuum pressure infiltration furnace reaches 0.05Pa, and the temperature rises to At 1150°C, melt the copper matrix, pour it into a graphite mold, infiltrate the metal at 5GPa, keep the pressure for 5 minutes, and the volume ratio of the reinforcement to the copper matrix is ​​75:25; cool with the furnace and demould.

[0038] The density of the obtained composite material i...

Embodiment 2

[0040] Raw materials: diamond 1 particle size: 50 μm, crystal form: hexocahedron, diamond 2: 100 μm crystal form: hexocahedron; mass ratio: diamond 1: diamond 2 volume ratio: 16: 2; copper matrix: CuCr (Cr1wt% ).

[0041]The diamond particles and the paraffin-based binder are prepared according to the volume ratio of 65:35; the mixer is mixed evenly, and the mixed powder is prepared on the press to prepare the preform body; after the preform body is air-dried, it is heated at 900°C Degreasing and sintering are carried out under a hydrogen atmosphere; put the sintered preform into a graphite mold, put it into a pressure infiltration furnace to evacuate, and raise the temperature at the same time; the vacuum degree in the vacuum pressure infiltration furnace reaches 0.01Pa, and the temperature rises to At 1200°C, melt the copper matrix, pour it into a graphite mold, infiltrate the metal at 60MPa, keep the pressure for 8 minutes, and the volume ratio of the reinforcement to the c...

Embodiment 3

[0044] Raw materials: diamond particle size: 100 μm, crystal form: square, copper matrix: CuCr (Cr1wt%).

[0045] The diamond particles and the paraffin-based binder are prepared according to the volume ratio of 60:40; the mixer is evenly mixed, and the uniformly mixed powder is prepared on the press to prepare the preform body; after the preform body is air-dried, the Degreasing and sintering are carried out under a hydrogen atmosphere; put the sintered preform into a graphite mold, put it into a pressure infiltration furnace to evacuate, and raise the temperature at the same time; the vacuum degree in the vacuum pressure infiltration furnace reaches 0.1Pa, and the temperature rises to At 1200°C, melt the copper matrix, pour it into a graphite mold, infiltrate the metal at 50MPa, keep the pressure for 10 minutes, and the volume ratio of the reinforcement to the copper matrix is ​​55:45; cool with the furnace and demould.

[0046] The density of the obtained composite material...

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Abstract

The invention relates to a high-thermal conductivity diamond / copper composite material applicable to a wide temperature range and a method, belonging to the technical field of preparation of thermal management materials. The copper-based composite material is prepared through the following steps: preparing a prefabricated reinforcement component from a reinforcement and a binder by using an injection molding process for a prefabricated component, wherein the reinforcement is prepared by mixing one or two different diamond particles; and casting fused copper liquid on the prefabricated reinforcement component and carrying out pressure infiltration, wherein a copper substrate is pure copper or copper alloy, and a volume ratio of a diamond to the copper substrate is 50-75%: 50-25%. The diamond / copper composite material prepared by using pressure infiltration is applicable to a wide temperature range of 40 to 350 K, has higher thermal conductivity compared with molybdenum-copper and tungsten-copper in the temperature range of 40 to 350 K, a low thermal expansion coefficient and small density and is a good option for a heat dissipation material used in a spatial refrigeration environment.

Description

technical field [0001] The invention relates to a diamond / copper composite material with high thermal conductivity and a method applicable to a wide temperature range, in particular to a diamond / copper composite material with high thermal conductivity and low expansion suitable for a wide temperature range (40-350K) and a preparation method thereof, belonging to thermal Manages the field of material preparation technology. Background technique [0002] As an important functional material, thermal management materials play an important role in equipment manufacturing, electronic packaging and other fields. With the continuous advancement of technology, the requirements for materials are getting higher and higher, not only requiring materials to have high thermal conductivity, low thermal expansion coefficient and other properties under normal and daily environmental conditions, but also requiring materials to be able to withstand extreme environmental conditions. Meet the re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00B22D19/00
Inventor 郭宏尹法章王光宗张习敏范叶明韩媛媛
Owner GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG
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